High surface area coatings are applied to solid substrates to increase the surface area available for solid-phase synthesis of polymers. The high surface area coatings use three-dimensional space to provide more area for functional groups to bind polymers than an untreated solid substrate. The polymers may be oligonucleotides, polypeptides, or another type of polymer. The solid substrate is a rigid supportive layer made from a material such as glass, a silicon material, a metal material, and plastic. The coating may be thin films, hydrogels, microparticles. The coating may be made from a metal oxide, a high-κ dielectric, a low-κ dielectric, an etched metal, a carbon material, or an organic polymer. The functional groups may be hydroxyl groups, amine groups, thiolate groups, alkenes, n-alkenes, alkalines, N-Hydroxysuccinimide (NHS)-activated esters, polyaniline, aminosilane groups, silanized oxides, oligothiophenes, and diazonium compounds. Techniques for applying coatings to solid substrates and attaching functional groups are also disclosed.

High surface area coatings are applied to solid substrates to increase the surface area available for solid-phase synthesis of polymers. The high surface area coatings use three-dimensional space to provide more area for functional groups to bind polymers than an untreated solid substrate. The polymers may be oligonucleotides, polypeptides, or another type of polymer. The solid substrate is a rigid supportive layer made from a material such as glass, a silicon material, a metal material, and plastic. The coating may be thin films, hydrogels, microparticles. The coating may be made from a metal oxide, a high-κ dielectric, a low-κ dielectric, an etched metal, a carbon material, or an organic polymer. The functional groups may be hydroxyl groups, amine groups, thiolate groups, alkenes, n-alkenes, alkalines, N-Hydroxysuccinimide (NHS)-activated esters, polyaniline, aminosilane groups, silanized oxides, oligothiophenes, and diazonium compounds. Techniques for applying coatings to solid substrates and attaching functional groups are also disclosed.

A steel sheet for cans which exhibits excellent weldability; and a production method therefore include the surface of a steel sheet in order from the steel sheet side, a chromium metal layer and a hydrous chromium oxide layer. The deposited amount of the chromium metal layer is 50-200 mg/m.sup.2. The deposited amount of the hydrous chromium oxide layer in terms of chromium is 3-30 mg/m.sup.2. The chromium metal layer includes: a base part having a thickness of 7.0 nm or higher; and granular protrusions which are on the base part, have a maximum grain size of 200 nm or lower, and have a number density per unit area of at least 30 per m.sup.2.

A hot-pressed member having excellent post-coating corrosion resistance and excellent resistance spot weldability, a method for manufacturing the hot-pressed member, and a steel sheet for hot pressing suitable for a hot-pressed member having excellent post-coating corrosion resistance and excellent resistance spot weldability. The hot-pressed member includes a Zn-based coated layer on a first side of a steel sheet, and a Zn-based coated layer on a second side of the steel sheet. A coating weight of Zn in the Zn-based coated layer on the first side of the steel sheet is 5 to 35 g/m.sup.2, and an average line roughness Ra of a surface of the Zn-based coated layer on the first side is less than or equal to 2.5 m. The average line roughness Ra of a surface of the Zn-based coated layer on the second side of the steel sheet is greater than or equal to 3.5 m.

A steel sheet for cans has, on the surface thereof, in order from the steel sheet side, a chromium metal layer and a hydrous chromium oxide layer. The chromium metal layer is deposited in an amount of 50-200 mg/m.sup.2, and the hydrous chromium oxide layer is deposited in an amount of 3-15 mg/m.sup.2 in terms of chromium. The chromium metal layer includes: a flat chromium metal layer that has a thickness of at least 7 nm; and a granular chromium metal layer that includes granular protrusions that are formed on the surface of the flat chromium metal layer. The maximum grain size of the granular protrusions is 150 nm or smaller. The number density of the granular protrusions per unit area is 10/m.sup.2 or higher.

The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed. The surface treated copper foil comprises a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein an aspect ratio of roughening particles of the roughening treatment layer satisfies one or more of the following items (1) and (2), the aspect ratio being a height of the roughening particles/a thickness of the roughening particles: (1) the aspect ratio of the roughening particles is 3 or less, (2) the aspect ratio of the roughening particles satisfies any one of the following items (2-1) or (2-2): (2-1) the aspect ratio of the roughening particles is 10 or less in the case that the height of the roughening particles is more than 500 nm and 1000 nm or less, (2-2) the aspect ratio of the roughening particles is 15 or less in the case that the height of the roughening particles is 500 nm or less; and a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

A micro-roughened electrodeposited copper foil and a copper foil substrate are provided. The micro-roughened electrodeposited copper foil includes a micro-rough surface. The micro-rough surface has a plurality of peaks, a plurality of V-shaped grooves and a plurality of micro-crystal clusters. Each of the V-shaped grooves is defined by adjacent two of the peaks and has an average depth less than 1 m. The micro-crystal clusters are correspondingly located on the tops of the peaks and each thereof has an average height less than 1.5 m. The micro-rough surface of the micro-roughened electrodeposited copper foil has an Rlr value less than 1.06.

A method of manufacturing a multiple-color plating member includes forming a copper plating layer on at least a part of a surface of a substrate, forming a nickel plating layer on a surface of the copper plating layer, forming a chromium plating layer on a surface of the nickel plating layer, applying a color coating agent onto a surface of the chromium plating layer and then drying the applied color coating agent to form a color coating layer, and applying a clear coating agent onto a surface of the color coating layer and photocuring the applied clear coating agent to form a clear layer. The color coating agent includes 10 to 35% by weight of a modified acrylic resin, 1 to 25% by weight of a pigment, and 40 to 80% by weight of a first solvent. The clear coating agent includes 10 to 30% by weight of a polyester-modified acrylic resin, 5 to 25% by weight of an acrylic oligomer, 5 to 45% by weight of an acrylic monomer, 1 to 15% by weight of a photoinitiator, and 10 to 75% by weight of a second solvent.

A method of manufacturing a multiple-color plating member includes forming a copper plating layer on at least a part of a surface of a substrate, forming a nickel plating layer on a surface of the copper plating layer, forming a chromium plating layer on a surface of the nickel plating layer, applying a color coating agent onto a surface of the chromium plating layer and then drying the applied color coating agent to form a color coating layer, and applying a clear coating agent onto a surface of the color coating layer and photocuring the applied clear coating agent to form a clear layer. The color coating agent includes 10 to 35% by weight of a modified acrylic resin, 1 to 25% by weight of a pigment, and 40 to 80% by weight of a first solvent. The clear coating agent includes 10 to 30% by weight of a polyester-modified acrylic resin, 5 to 25% by weight of an acrylic oligomer, 5 to 45% by weight of an acrylic monomer, 1 to 15% by weight of a photoinitiator, and 10 to 75% by weight of a second solvent.

A leadless packaged semiconductor device includes a metal substrate having at least a first through-hole aperture having a first outer ring and a plurality of cuts through the metal substrate to define spaced apart metal pads on at least two sides of the first through-hole aperture. A semiconductor die that has a back side metal (BSM) layer on its bottom side and a top side with circuitry coupled to bond pads is mounted top side up on the first outer ring. A metal die attach layer is directly between the BSM layer and walls of the metal substrate bounding the first through-hole aperture that provides a die attachment that fills a bottom portion of the first through-hole aperture. Bond wires are between metal pads and the bond pads. A mold compound is also provided including between adjacent ones of the metal pads.