The invention relates to a method for coating an organic or metallic material by covalent grafting of at least one organic compound A having at least one aromatic group substituted with a diazonium function, on a surface of said material, characterized in that the material is porous or fibrillar having a geometric surface area of at least 10 cm.sup.2 of material, and in that said method includes a step of continuous imposition of a non-zero pulsed current in an intensiostatic mode on the surface of the material in order to electrochemically reduce the diazonium ion or ions. The invention further relates to the resulting composite materials and to the use of such materials for manufacturing electrodes.

The invention relates to a method for coating an organic or metallic material by covalent grafting of at least one organic compound A having at least one aromatic group substituted with a diazonium function, on a surface of said material, characterized in that the material is porous or fibrillar having a geometric surface area of at least 10 cm.sup.2 of material, and in that said method includes a step of continuous imposition of a non-zero pulsed current in an intensiostatic mode on the surface of the material in order to electrochemically reduce the diazonium ion or ions. The invention further relates to the resulting composite materials and to the use of such materials for manufacturing electrodes.

A method and system for manufacturing an optical article is provided. The method may comprise providing at least one ophthalmic lens substrate having a surface; applying at least one conductive coating on at least a portion the ophthalmic lens substrate; and electroplating the ophthalmic lens substrate to form a plating layer that is in a contacting relationship with the conductive coating of the optical article. Other layers may also be applied.

Embodiments of the present methods deposit smooth, semi-bright nickel coatings from a nickel bath at room temperature, with relatively high concentrations (between about 5 and about 10%) of an organic modifier (such as butanol) under acidic conditions and using a modified pulse potential. The methods for electrodepositing nickel coatings result in nickel coatings that have improved internal structure and corrosion resistance.

Embodiments of the present methods deposit smooth, semi-bright nickel coatings from a nickel bath at room temperature, with relatively high concentrations (between about 5 and about 10%) of an organic modifier (such as butanol) under acidic conditions and using a modified pulse potential. The methods for electrodepositing nickel coatings result in nickel coatings that have improved internal structure and corrosion resistance.

The present invention discloses a method and a device for laser-assisted electrochemical composite deposition using a rifling-type hollow rotating electrode, which relate to the field of micro-composite processing in special processing technologies. A center of a laser beam is allowed to pass through a rifling-type hollow rotating electrode and focus onto a cathode substrate. When the rifling-type hollow rotating electrode is rotated at a constant speed, an electrodeposition solution rotates in the rifling-type hollow rotating electrode and generates a certain centripetal force to improve the precision and localization of deposition. During the process of the present invention, an internal rifling structure of the electrode is rotated at a high speed so that the deposition solution generates a centripetal force. The internal rifling structure and an external helical structure of the rifling-type hollow rotating electrode make the deposition solution move upward to form a “self-circulation” system.

The present invention discloses a method and a device for laser-assisted electrochemical composite deposition using a rifling-type hollow rotating electrode, which relate to the field of micro-composite processing in special processing technologies. A center of a laser beam is allowed to pass through a rifling-type hollow rotating electrode and focus onto a cathode substrate. When the rifling-type hollow rotating electrode is rotated at a constant speed, an electrodeposition solution rotates in the rifling-type hollow rotating electrode and generates a certain centripetal force to improve the precision and localization of deposition. During the process of the present invention, an internal rifling structure of the electrode is rotated at a high speed so that the deposition solution generates a centripetal force. The internal rifling structure and an external helical structure of the rifling-type hollow rotating electrode make the deposition solution move upward to form a “self-circulation” system.

A method of plating a copper substrate with gold that reduces or eliminates the presence of microvoids at the interface of the gold/copper substrate is described. Suitably, live entry of the substrate into the plating bath is performed with application of external current to the bath such that no portion of the substrate is exposed to the bath for more than one second without the application of the external current. Increase of the applied current for gold strike to the mass-transfer-limit for gold reduction accomplishes the full measure of improvement in eliminating microvoids.

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, the apparatus may switch between a sealed state and an unsealed state, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal. A higher level of applied current or applied voltage may be provided to the substrate when the apparatus is in the sealed state compared to the unsealed state.

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold between the channeled plate and substrate, and on the sides by a flow confinement ring. A seal may be provided between the bottom surface of a substrate holder and the top surface of an element below the substrate holder (e.g., the flow confinement ring). During plating, the apparatus may switch between a sealed state and an unsealed state, for example by lowering and lifting the substrate and substrate holder as appropriate to engage and disengage the seal. A higher level of applied current or applied voltage may be provided to the substrate when the apparatus is in the sealed state compared to the unsealed state.