Methods of metalizing vias within a substrate are disclosed. In one embodiment, a method of metalizing vias includes disposing a substrate onto a growth substrate. The substrate includes a first surface, a second surface, and at least one via. The first surface or the second surface of the substrate directly contacts a surface of the growth substrate, and the surface of the growth substrate is electrically conductive. The method further includes applying an electrolyte to the substrate such that the electrolyte is disposed within the at least one via. The electrolyte includes metal ions of a metal to be deposited within the at least one via. The method also includes positioning an electrode within the electrolyte, and applying a current and/or a voltage between the electrode and the substrate, thereby reducing the metal ions into the metal on the surface of the growth substrate within the at least one via.

Described herein are electrodeposited corrosion-resistant multilayer coating and claddings that comprises multiple nanoscale layers that periodically vary in electrodeposited species or electrodeposited microstructures. The coatings may comprise electrodeposited metals, ceramics, polymers or combinations thereof. Also described herein are methods for preparation of the coatings and claddings.

Described herein are electrodeposited corrosion-resistant multilayer coating and claddings that comprises multiple nanoscale layers that periodically vary in electrodeposited species or electrodeposited microstructures. The coatings may comprise electrodeposited metals, ceramics, polymers or combinations thereof. Also described herein are methods for preparation of the coatings and claddings.

Provided herein is an electric Al—Zr—Mn alloy-plating bath which comprises (A) an aluminum halide; (B) one or at least two kinds of compounds selected from the group consisting of N-alkylpyridinium halides, N-alkylimidazolium halides, N,N′-dialkyl-imidazolium halides, N-alkyl-pyrazolium halides, N,N′-dialkyl-pyrazolium halides, N-alkylpyrrolidinium halides and N,N-dialkyl-pyrrolidinium halides; (C) a zirconium halide; and (D) a manganese halide, in which the molar ratio of the aluminum halide (A) to the compound (B) ranges from 1:1 to 3:1. The plating bath never involves any risk of causing an explosion and can provide a smooth and fine Al—Zr—Mn alloy-plated film. Moreover, the resulting film has high resistance to corrosion even when it does not contain any chromium and therefore, it is quite suitable from the viewpoint of the environmental protection and it can thus be used in a wide variety of applications including the plating of parts for motorcars, and the plating of parts for electrical appliances.

A nano-twinned copper layer is disclosed, wherein over 50% of a volume of the nano-twinned copper layer comprises a plurality of columnar crystal grains, the plurality of columnar crystal grains connect to each other, at least 70% of the plurality of columnar crystal grains are formed by a plurality of nano-twins stacking in an orientation of a crystal axis, and an angle included between two adjacent columnar crystal grains is greater 20° and less than or equal to 60°. In addition, a method for manufacturing the nano-twinned copper layer and a substrate comprising the same are also disclosed.

A lithium-ion battery having an anode including an array of nanowires electrochemically coated with a polymer electrolyte, and surrounded by a cathode matrix, forming thereby interpenetrating electrodes, wherein the diffusion length of the Li.sup.+ ions is significantly decreased, leading to faster charging/discharging, greater reversibility, and longer battery lifetime, is described. The battery design is applicable to a variety of battery materials. Methods for directly electrodepositing Cu.sub.2Sb from aqueous solutions at room temperature using citric acid as a complexing agent to form an array of nanowires for the anode, are also described. Conformal coating of poly-[Zn(4-vinyl-4′methyl-2,2′-bipyridine).sub.3](PF.sub.6).sub.2 by electroreductive polymerization onto films and high-aspect ratio nanowire arrays for a solid-state electrolyte is also described, as is reductive electropolymerization of a variety of vinyl monomers, such as those containing the acrylate functional group. Such materials display limited electronic conductivity but significant lithium ion conductivity. Cathode materials may include oxides, such as lithium cobalt oxide, lithium magnesium oxide, or lithium tin oxide, as examples, or phosphates, such as LiFePO.sub.4, as an example.

A lithium-ion battery having an anode including an array of nanowires electrochemically coated with a polymer electrolyte, and surrounded by a cathode matrix, forming thereby interpenetrating electrodes, wherein the diffusion length of the Li.sup.+ ions is significantly decreased, leading to faster charging/discharging, greater reversibility, and longer battery lifetime, is described. The battery design is applicable to a variety of battery materials. Methods for directly electrodepositing Cu.sub.2Sb from aqueous solutions at room temperature using citric acid as a complexing agent to form an array of nanowires for the anode, are also described. Conformal coating of poly-[Zn(4-vinyl-4′methyl-2,2′-bipyridine).sub.3](PF.sub.6).sub.2 by electroreductive polymerization onto films and high-aspect ratio nanowire arrays for a solid-state electrolyte is also described, as is reductive electropolymerization of a variety of vinyl monomers, such as those containing the acrylate functional group. Such materials display limited electronic conductivity but significant lithium ion conductivity. Cathode materials may include oxides, such as lithium cobalt oxide, lithium magnesium oxide, or lithium tin oxide, as examples, or phosphates, such as LiFePO.sub.4, as an example.

An electrolytic treatment apparatus 1 (1A) configured to perform an electrolytic treatment on a target substrate includes a substrate holder 10 and an electrolytic processor 20. The substrate holder 10 includes an insulating holding body 11 configured to hold the target substrate and an indirect negative electrode 12 disposed within the holding body 11. A negative voltage is applied to the indirect negative electrode 12. The electrolytic processor 20 is disposed to face the substrate holder 10 and configured to apply a voltage to the target substrate and an electrolyte in contact with the target substrate.

Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by a pause in electroplating and then turning on the current to electroplate at a lower current density to fill through-holes.

Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by electroplating at a lower current density to fill through-holes.