Metastable alloys have recently emerged as high-performance catalysts, extending the toolbox of binary alloy materials that can be utilized to mediate electrocatalytic reactions. In particular, nanostructured metastable ordered intermetallic compounds are particularly challenging to synthesize. Here the present invention is directed to a method for synthesizing sub-15 nm metastable ordered intermetallic Pd31Bi12 nanoparticles at room temperature, in a single step, by pulsed electrochemical deposition onto high surface area carbon supports. The resulting Pd31Bi12 nanoparticles displays a 7× enhancement of the mass activity relative to Pt/C and a 4× enhancement relative to Pd/C for the oxygen reduction reaction (ORR). The high performance of Pd31Bi12 nanoparticles is demonstrated to arise from reduced oxygen binding caused by alloying of Pd with Bi. The isolation of Pd-sites from each other facilitate methanol tolerant ORR behavior.

An electrolyte for the electrochemical machining of a γ-γ″ nickel-based superalloy, includes NaNO3 in a content of between 10% and 30% by weight relative to the total weight of the electrolyte; a complexing agent selected from sulfosalicylic acid at a pH of between 3 and 10 and nitrilotriacetic acid at a pH of between 7 and 14, the complexing agent being present in a content of between 1% and 5% by weight relative to the total weight of the electrolyte; optionally, an anionic surfactant in a content of between 1% and 5% by weight relative to the total weight of the electrolyte; optionally, NaOH in order to obtain the desired pH; and an aqueous solvent.

A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of current; reducing the current to a baseline current level; and optionally increasing the current in one or more steps until electroplating is complete.

A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of current; reducing the current to a baseline current level; and optionally increasing the current in one or more steps until electroplating is complete.

Disclosed are alkaline electrodeposition solutions and apparatus and methods for using such solutions to electroplate metal. During electroplating, the solutions may produce superconformal fill of metal in features such as features having a critical dimension of about 20 nm or less. The metal electroplating process may be used during integrated circuit fabrication. For example, it may be used to fill trenches and vias in partially fabricated integrated circuits. The electroplated metal may be copper. The copper may be electroplated on a substrate material that is less noble than copper.

Articles prepared by additive manufacturing of preforms that are coated by electrodeposition of nanolaminate materials, and methods of their production are described.

Articles prepared by additive manufacturing of preforms that are coated by electrodeposition of nanolaminate materials, and methods of their production are described.

A nano-twinned Cu—Ni alloy layer is provided, wherein more than 50% in volume of the nano-twinned Cu—Ni alloy layer comprises plural twinned grains, the plural twinned grains comprise plural columnar twinned grains, and a Ni content in the nano-twinned Cu—Ni alloy layer is in a range from 0.05 at % to 20 at %. In addition, a method for manufacturing the aforesaid nano-twinned Cu—Ni alloy layer is also provided.

A nano-twinned Cu—Ni alloy layer is provided, wherein more than 50% in volume of the nano-twinned Cu—Ni alloy layer comprises plural twinned grains, the plural twinned grains comprise plural columnar twinned grains, and a Ni content in the nano-twinned Cu—Ni alloy layer is in a range from 0.05 at % to 20 at %. In addition, a method for manufacturing the aforesaid nano-twinned Cu—Ni alloy layer is also provided.

In one example, an electroplating system comprises a first bath reservoir, a second bath reservoir, a clamp, a first anode in the first bath reservoir, a second anode in the second bath reservoir, and a direct current power supply. The first bath reservoir contains a first electrolyte solution that includes an alkaline copper-complexed solution. The second bath reservoir contains a second electrolyte solution that includes an acidic copper plating solution. The direct current power supply generates a first direct current between the clamp and the first anode to electroplate a first copper layer on the cobalt layer of the wafer submerged in the first electrolyte solution. The direct current power supply then generates a second direct current between the clamp and the second anode to electroplate a second copper layer on the first copper layer of the wafer submerged in the second electrolyte solution.