A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.

The present disclosure generally relates to a method for electroplating (or electrodeposition) a transition metal oxide composition that may be used in gas sensors, biological cell sensors, supercapacitors, catalysts for fuel cells and metal air batteries, nano and optoelectronic devices, filtration devices, structural components, and energy storage devices. The method includes electrodepositing the electrochemically active transition metal oxide composition onto a working electrode in an electrodeposition bath containing a molten salt electrolyte and a transition metal ion source. The electrode structure can be used for various applications such as electrochemical energy storage devices including high power and high-energy primary or secondary batteries.

The present disclosure generally relates to a method for electroplating (or electrodeposition) a transition metal oxide composition that may be used in gas sensors, biological cell sensors, supercapacitors, catalysts for fuel cells and metal air batteries, nano and optoelectronic devices, filtration devices, structural components, and energy storage devices. The method includes electrodepositing the electrochemically active transition metal oxide composition onto a working electrode in an electrodeposition bath containing a molten salt electrolyte and a transition metal ion source. The electrode structure can be used for various applications such as electrochemical energy storage devices including high power and high-energy primary or secondary batteries.

A high-strength coatings and methods of fabrication to yield single-crystal-like nickel containing nanotwins and stacking faults.

A high-strength coatings and methods of fabrication to yield single-crystal-like nickel containing nanotwins and stacking faults.

Provided are a metal body that can be manufactured easily while whisker generation resulting from external stress is suppressed, a fitting connection terminal, and a method for forming the metal body. The metal body includes a barrier layer containing Ni as a main component formed on a metal substrate containing Cu as a main component, and a metal plating layer containing Sn as a main component formed directly on the barrier layer. An area ratio that is a ratio of the area of an intermetallic compound containing Sn and Cu in the metal plating layer to a cross section of the metal plating layer is 20% or less in the cross section of the metal body.

Provided are a metal body that can be manufactured easily while whisker generation resulting from external stress is suppressed, a fitting connection terminal, and a method for forming the metal body. The metal body includes a barrier layer containing Ni as a main component formed on a metal substrate containing Cu as a main component, and a metal plating layer containing Sn as a main component formed directly on the barrier layer. An area ratio that is a ratio of the area of an intermetallic compound containing Sn and Cu in the metal plating layer to a cross section of the metal plating layer is 20% or less in the cross section of the metal body.

Disclosed herein are embodiments of a coating composition and a method of using the same for forming metal coatings on substrates. In particular embodiments, the coating composition comprises a deep eutectic solvent and/or an ionic liquid; a metal precursor; an alkali metal salt; and an optional additive component. The coating composition and method embodiments disclosed herein provide durable, even, high-surface area coatings on various types of substrates and also can be used at low temperatures.

Disclosed herein are embodiments of a coating composition and a method of using the same for forming metal coatings on substrates. In particular embodiments, the coating composition comprises a deep eutectic solvent and/or an ionic liquid; a metal precursor; an alkali metal salt; and an optional additive component. The coating composition and method embodiments disclosed herein provide durable, even, high-surface area coatings on various types of substrates and also can be used at low temperatures.

Exemplary electroplating systems may include a vessel. The systems may include a paddle disposed within the vessel. The paddle may be characterized by a first surface and a second surface. The first surface of the paddle may be include a plurality of ribs that extend upward from the first surface. The plurality of ribs may be arranged in a generally parallel manner about the first surface. The paddle may define a plurality of apertures through a thickness of the paddle. Each of the plurality of apertures may have a diameter of less than about 5 mm. The paddle may have an open area of less than about 15%.