A coating system includes an electrocoat (e-coat) bath having an e-coat fluid with a first amount of dissolved gases, a plurality of ultrasonic transducers mounted on at least two sides of the e-coat bath, a carrier frame and control circuitry. The control circuitry is configured to control a trajectory of a metal part dipped in the e-coat bath using the carrier frame, control the plurality of ultrasonic transducers to direct a plurality of acoustic waves at a defined ultrasonic operating frequency and at a first intensity to cause a plurality of localized pressure drops in the e-coat fluid, the first amount of dissolved gases is reduced or removed as bubbles from the e-coat fluid of the e-coat bath based on the directed plurality of acoustic waves, and increase the first intensity of the directed plurality of acoustic waves over a defined time period to accelerate dispersion of an e-coat pigment.

A coating system includes an electrocoat (e-coat) bath having an e-coat fluid with a first amount of dissolved gases, a plurality of ultrasonic transducers mounted on at least two sides of the e-coat bath, a carrier frame and control circuitry. The control circuitry is configured to control a trajectory of a metal part dipped in the e-coat bath using the carrier frame, control the plurality of ultrasonic transducers to direct a plurality of acoustic waves at a defined ultrasonic operating frequency and at a first intensity to cause a plurality of localized pressure drops in the e-coat fluid, the first amount of dissolved gases is reduced or removed as bubbles from the e-coat fluid of the e-coat bath based on the directed plurality of acoustic waves, and increase the first intensity of the directed plurality of acoustic waves over a defined time period to accelerate dispersion of an e-coat pigment.

The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.

The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.

Disclosed is a method of manufacturing various alloy thin films, in which nano-scale cracks are controlled, with desired compositions using an ultrasonic pulse electroforming process. The method includes a step of forming a multilayer that includes two or more different thin metal film layers, in which nano-scale cracks due to hydrogen generation are controlled, a step of ultimately facilitating interdiffusion by controlling the thickness of the multilayer to a nano-scale thickness through pulse application and the number of layers forming the multilayer, and controlling an alloy to have a desired composition through heat treatment, and a step of thermally treating the multilayer such that interdiffusion sufficiently occurs among the two or more different thin metal film layers. The step of thermally treating may be carried out along with rolling, whereby very fine cracks may be removed by compression and, accordingly, alloy foils having various compositions may be economically produced. A layer number and thickness of the multilayer may be controlled to a nano-sized thickness by applying various types of pulses or by connecting a plurality of electrolytic cells in series and stepwise or repeatedly transferring adding an electroforming layer to the electrolytic cells under a DC application condition.

Disclosed is a method of manufacturing various alloy thin films, in which nano-scale cracks are controlled, with desired compositions using an ultrasonic pulse electroforming process. The method includes a step of forming a multilayer that includes two or more different thin metal film layers, in which nano-scale cracks due to hydrogen generation are controlled, a step of ultimately facilitating interdiffusion by controlling the thickness of the multilayer to a nano-scale thickness through pulse application and the number of layers forming the multilayer, and controlling an alloy to have a desired composition through heat treatment, and a step of thermally treating the multilayer such that interdiffusion sufficiently occurs among the two or more different thin metal film layers. The step of thermally treating may be carried out along with rolling, whereby very fine cracks may be removed by compression and, accordingly, alloy foils having various compositions may be economically produced. A layer number and thickness of the multilayer may be controlled to a nano-sized thickness by applying various types of pulses or by connecting a plurality of electrolytic cells in series and stepwise or repeatedly transferring adding an electroforming layer to the electrolytic cells under a DC application condition.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.

The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.