The present invention provides a Ni-plated copper or copper alloy material having both excellent hardness and excellent bendability. In the Ni-plated copper or copper alloy material having, an area ratio of a crystal having <001> plane orientation in a crystal plane parallel to a surface of a Ni plating, measured by an electron backscatter diffraction, is 15 to 35%.

In one example, a method to manufacture a magnetic sensor, comprises providing an electrolyte solution, submersing a substrate in the electrolyte solution, submersing a plurality of ingots in the electrolyte solution, wherein the ingots comprises a metal that is magnetic, and depositing the metal on the substrate by applying a voltage between the metal ingot and the substrate to result in magnetic alloy layer on the substrate. Other examples and related methods are also disclosed herein.

In one example, a method to manufacture a magnetic sensor, comprises providing an electrolyte solution, submersing a substrate in the electrolyte solution, submersing a plurality of ingots in the electrolyte solution, wherein the ingots comprises a metal that is magnetic, and depositing the metal on the substrate by applying a voltage between the metal ingot and the substrate to result in magnetic alloy layer on the substrate. Other examples and related methods are also disclosed herein.

Method for preparing high-strength and durable super-hydrophobic film layer on inner wall of elongated metal tube includes roughening treatment of inner wall of a metal tube, electrodepositing preparation of nickel-phosphorus alloy layer and functional coating, heat treatment, subsequent anodizing and low surface energy modification. The method greatly reduces the influence of local mass transfer resistance, and a uniform nanocrystalline film layer is electroplated under the ultrasound induction. Since only electroplating solution is filled in the tube during the preparation process, the consumption of device and raw materials is greatly reduced. Also, since silica particles are added to the electroplating solution in preparing the nanocrystalline film layer, the surface morphology can be made more uniform and denser in terms of the microscopic morphology. Nano-scale channels structures are etched, so that the super-hydrophobic inner surface can have a better ability to store air, and its water flow impact resistance is greatly enhanced.

A protective case adapted to be mounted on an electronic device is provided, wherein the electronic device is adapted to perform wireless signal transmission, and has a front surface for usage. The protective case is adapted to surround a periphery of the front surface, and has a frame which surrounds the periphery of the front surface when the protective case is mounted on the electronic device. The protective case includes a core material and a plated coating. The core material includes a metal material. The plated coating covers a surface of the core material, and has a thickness between 15 m and 25 m. Materials of the plated coating include a metallic oxide and an alloy oxide. Specifically, with the metallic oxide and the alloy oxide, the plated coating separates the core material from the exterior, and therefore provides an anticorrosion function, as well as prevents external interferences.

The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

Described herein are electrodeposited corrosion-resistant multilayer coating and claddings that comprises multiple nanoscale layers that periodically vary in electrodeposited species or electrodeposited microstructures. The coatings may comprise electrodeposited metals, ceramics, polymers or combinations thereof. Also described herein are methods for preparation of the coatings and claddings.

The present invention provides a Ni-plated copper or copper alloy material having both excellent hardness and excellent bendability.

In the Ni-plated copper or copper alloy material having, an area ratio of a crystal having <001> plane orientation in a crystal plane parallel to a surface of a Ni plating, measured by an electron backscatter diffraction, is 15 to 35%.

The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.