The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.

The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

The presently disclosed apparatus and method offer the capability to electroplate pure metals or alloys onto substrates, having no current collectors or being connected to the power supply by a low conductivity seed layer. Thus, the disclosed system enables pure metal or alloy deposition on various substrates, including flexible electronic circuits, wafers for IC processing, and discrete electronic devices in surface finishing applications.

The present disclosure relates to an apparatus for electroplating an element. The apparatus may comprise a cathode cage assembly. The cathode cage assembly may include a cage member and at least one electrically conductive wire extending along at least a portion of the cage member. The wire may be arranged to form at least one volume within the cage member for retaining an element within the cage member. The cage member and the wire permit a degree of movement of the element during an electroplating process while retaining the element within the volume.

A method of forming an electrode in an electrochemical battery comprises: coating a reticulated substrate with a conductive material; curing the reticulated substrate coated with the conductive material; and electroplating the reticulated substrate coated with the conductive material with a desired metal material.

A method of forming an electrode in an electrochemical battery comprises: coating a reticulated substrate with a conductive material; curing the reticulated substrate coated with the conductive material; and electroplating the reticulated substrate coated with the conductive material with a desired metal material.

The present invention relates to a low-friction member imitating shark skin and a manufacturing method therefor, the low-friction member implementing a structure similar to shark skin and having riblets by stacking, in layers, composite particles formed by attaching spherical particles on the surfaces of plate-shaped particles, and thus the low-friction member has excellent low-friction characteristics. The present invention comprises: a base plate; plate-shaped particles stacked in layers on the surface of the base plate in the form of scales; and a plurality of spherical metal lubricating particles having a size smaller than that of the plate-shaped particles, and coated on the surfaces of the plate-shaped particles, wherein the metal lubricating particles are arranged in the form of a bridge connecting the base plate and the plate-shaped particles, and the plate-shaped particles to each other.

The present invention relates to a low-friction member imitating shark skin and a manufacturing method therefor, the low-friction member implementing a structure similar to shark skin and having riblets by stacking, in layers, composite particles formed by attaching spherical particles on the surfaces of plate-shaped particles, and thus the low-friction member has excellent low-friction characteristics. The present invention comprises: a base plate; plate-shaped particles stacked in layers on the surface of the base plate in the form of scales; and a plurality of spherical metal lubricating particles having a size smaller than that of the plate-shaped particles, and coated on the surfaces of the plate-shaped particles, wherein the metal lubricating particles are arranged in the form of a bridge connecting the base plate and the plate-shaped particles, and the plate-shaped particles to each other.

The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.

The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.