A tool and a method for forming a tool are disclosed. The tool has a base layer additively formed from a polymer material in a desired tool shape. In addition, a sealant layer is formed over an outer surface the base layer. The sealant is a low-modulus material such as a silicone rubber or an elastomer. In one embodiment, the sealant is made electrically conductive by the addition of a filler to the low-modulus material. The filler material may be one of carbon black, carbon fibers, graphene, carbon nanotubes, and metallic whiskers, for example. In another embodiment, the sealant is not electrically conductive and an electrically conductive layer is formed over the sealant layer. Finally, a metallic coating, preferably multilayer, is formed over the sealant layer by electroplating or electrodeposition.

A tool and a method for forming a tool are disclosed. The tool has a base layer additively formed from a polymer material in a desired tool shape. In addition, a sealant layer is formed over an outer surface the base layer. The sealant is a low-modulus material such as a silicone rubber or an elastomer. In one embodiment, the sealant is made electrically conductive by the addition of a filler to the low-modulus material. The filler material may be one of carbon black, carbon fibers, graphene, carbon nanotubes, and metallic whiskers, for example. In another embodiment, the sealant is not electrically conductive and an electrically conductive layer is formed over the sealant layer. Finally, a metallic coating, preferably multilayer, is formed over the sealant layer by electroplating or electrodeposition.

Various embodiments herein relate to methods and apparatus for electroplating cobalt on a substrate. In many cases, the cobalt is electroplated into recessed features. The recessed features may include a seed layer such as a cobalt seed layer. Electroplating may occur through a bottom-up mechanism. The bottom-up mechanism may be achieved by using particular additives (e.g., accelerator and suppressor), which may be present in the electrolyte at particular concentrations. Further, leveler, wetting agent, and/or brightening agents may be used to promote high quality plating results. In various embodiments, the substrate is pre-treated to remove oxide (and in some cases carbon impurities) from the seed layer before electroplating takes place. Further, the electrolyte may have a particular conductivity to promote uniform plating results across the face of the substrate.

Various embodiments herein relate to methods and apparatus for electroplating cobalt on a substrate. In many cases, the cobalt is electroplated into recessed features. The recessed features may include a seed layer such as a cobalt seed layer. Electroplating may occur through a bottom-up mechanism. The bottom-up mechanism may be achieved by using particular additives (e.g., accelerator and suppressor), which may be present in the electrolyte at particular concentrations. Further, leveler, wetting agent, and/or brightening agents may be used to promote high quality plating results. In various embodiments, the substrate is pre-treated to remove oxide (and in some cases carbon impurities) from the seed layer before electroplating takes place. Further, the electrolyte may have a particular conductivity to promote uniform plating results across the face of the substrate.

A method of metal plating components includes placing a component and a spacer on a brochette, placing the brochette with the component and the spacer on a structure, and placing the structure with the brochette into a metal plating tank having a metal plating solution such that the component is submersed in the metal plating solution. The spacer is configured to mask a portion of the least one component and the component and the spacer are arranged on the brochette such that the spacer prevents the portion of the component from being contacted by the metal plating solution. The method also includes metal plating a surface of the component submersed in the metal plating solution, removing the structure with the brochette from the metal plating solution, drying the component on the brochette, and removing the dried component and the spacer from the brochette. Metal plating systems are also provided.

A method of metal plating components includes placing a component and a spacer on a brochette, placing the brochette with the component and the spacer on a structure, and placing the structure with the brochette into a metal plating tank having a metal plating solution such that the component is submersed in the metal plating solution. The spacer is configured to mask a portion of the least one component and the component and the spacer are arranged on the brochette such that the spacer prevents the portion of the component from being contacted by the metal plating solution. The method also includes metal plating a surface of the component submersed in the metal plating solution, removing the structure with the brochette from the metal plating solution, drying the component on the brochette, and removing the dried component and the spacer from the brochette. Metal plating systems are also provided.

An electroconductive material includes a Cu or Cu alloy base member, a Cu—Sn alloy coating layer, and a Sn coating layer. The Cu—Sn alloy coating layer has a Cu content of 20 to 70 atomic %, and an average thickness of 0.2 to 3.0 μm. The Sn coating layer has an average thickness of 0.2 to 5.0 μm. A surface of the electroconductive material has an arithmetic average roughness Ra of at least 0.15 μm in at least one direction along the surface and 3.0 μm or less in all directions along the surface. The Cu—Sn alloy coating layer is partially exposed at the surface of the electroconductive material. An area ratio of the Cu—Sn alloy coating layer exposed at the surface of the electroconductive material is 3 to 75%. An average crystal grain size on a surface of the Cu—Sn alloy coating layer is less than 2 μm.

Disclosed is a composite electroplating method for sintered NdFeB magnet, including: a process of pre-treating sintered NdFeB magnet, a process of electroplating the pre-treated sintered NdFeB magnet, and a process of cleaning and drying the electroplated sintered NdFeB magnet. The electroplating process forms a composite coating composed of a Zn coating, a Zn—Ni alloy coating, a Cu coating and a Ni coating on the surface of the sintered NdFeB magnet.

Disclosed is a composite electroplating method for sintered NdFeB magnet, including: a process of pre-treating sintered NdFeB magnet, a process of electroplating the pre-treated sintered NdFeB magnet, and a process of cleaning and drying the electroplated sintered NdFeB magnet. The electroplating process forms a composite coating composed of a Zn coating, a Zn—Ni alloy coating, a Cu coating and a Ni coating on the surface of the sintered NdFeB magnet.

Example embodiments of a method, system, and apparatus for agent-based architecture for integrated mobile applications are generally described herein. In an example embodiment, a mobile device includes a client agent module. The client agent module may be configured to receive a request from an integrated mobile application. The client agent module may be configured to determine a communication mode including at least a connected mode, a disconnected mode, and an opportunistic synchronization mode. In the disconnected mode, the client agent module may be configured to satisfy the request using local data, if the request can be satisfied with local data; otherwise the client module may be configured to store the request in local data. In the opportunistic synchronization mode, the client agent module may be configured to select data from the local data associated with the request and send the selected data and the request to the server agent.