A surface-treated copper foil includes a bulk copper foil and a first surface treatment layer. The first surface treatment layer is disposed on a first surface of the bulk copper foil and includes a roughening layer, where the outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil. The material volume (Vm) of the treating surface is 0.06 to 1.45 μm.sup.3/μm.sup.2, and the five-point peak height (S5p) of the treating surface is 0.15 to 2.00 μm.

Provided are composite array electrode, preparation method thereof and use thereof. The composite array electrode comprises a microelectrode array substrate, and a modification layer formed on a surface of a microelectrode of the microelectrode array substrate, wherein the modification layer comprises a plurality of electrically conductive layers arranged at intervals on the surface of the microelectrode, an insulating layer arranged on the surface of the microelectrode except the electrically conductive layers, and wherein material for the electrically conductive layers comprises one or more of nano platinum, nano iridium, conductive polymer and carbon nanotubes. The composite array electrode effectively eliminates the influence of edge effect such that the electric field distributes uniformly on the microelectrode surface of the composite array electrode, significantly improving electrochemical performance and detection capability of the electrode.

Provided are composite array electrode, preparation method thereof and use thereof. The composite array electrode comprises a microelectrode array substrate, and a modification layer formed on a surface of a microelectrode of the microelectrode array substrate, wherein the modification layer comprises a plurality of electrically conductive layers arranged at intervals on the surface of the microelectrode, an insulating layer arranged on the surface of the microelectrode except the electrically conductive layers, and wherein material for the electrically conductive layers comprises one or more of nano platinum, nano iridium, conductive polymer and carbon nanotubes. The composite array electrode effectively eliminates the influence of edge effect such that the electric field distributes uniformly on the microelectrode surface of the composite array electrode, significantly improving electrochemical performance and detection capability of the electrode.

Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed.

Methods for treating a substrate are disclosed. The substrate is deoxidized and then immersed in an electrodepositable pretreatment composition comprising a lanthanide series element and/or a Group IIIB metal, an oxidizing agent, and a metal-complexing agent to deposit a coating from the electrodepositable pretreatment composition onto a surface of the substrate. Optionally, the electrodepositable pretreatment composition may comprise a surfactant. A coating from a spontaneously depositable pretreatment composition comprising a Group IIIB and/or Group IVB metal may be deposited on the substrate surface prior to electrodepositing a coating from the electrodepositable pretreatment composition. Following electrodeposition of the electrodepositable pretreatment composition, the substrate optionally may be contacted with a sealing composition comprising phosphate and a Group IIIB and/or IVB metal. Substrates treated according to the methods also are disclosed.

Disclosed is a method for activating a surface of metals, such as self-passivated metals, and of metal-oxide dissolution, effected using a fluoroanion-containing composition. Also disclosed is an electrochemical cell utilizing an aluminum-containing anode material and a fluoroanion-containing electrolyte, characterized by high efficiency, low corrosion, and optionally mechanical or electrochemical rechargeability. Also disclosed is a process for fusing (welding, soldering etc.) a self-passivated metal at relatively low temperature and ambient atmosphere, and a method for electrodepositing a metal on a self-passivated metal using metal-oxide source.

Disclosed is a method for activating a surface of metals, such as self-passivated metals, and of metal-oxide dissolution, effected using a fluoroanion-containing composition. Also disclosed is an electrochemical cell utilizing an aluminum-containing anode material and a fluoroanion-containing electrolyte, characterized by high efficiency, low corrosion, and optionally mechanical or electrochemical rechargeability. Also disclosed is a process for fusing (welding, soldering etc.) a self-passivated metal at relatively low temperature and ambient atmosphere, and a method for electrodepositing a metal on a self-passivated metal using metal-oxide source.

Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

A rare earth permanent magnet is prepared by immersing a portion of a sintered magnet body of R.sup.1—Fe—B composition (wherein R.sup.1 is a rare earth element) in an electrodepositing bath of a powder dispersed in a solvent, the powder comprising an oxide, fluoride, oxyfluoride, hydride or rare earth alloy of a rare earth element, effecting electrodeposition for letting the powder deposit on a region of the surface of the magnet body, and heat treating the magnet body with the powder deposited thereon at a temperature below the sintering temperature in vacuum or in an inert gas.