Embodiments relate to nanoporous copper interconnects on a first body for electrically connecting to a second body. To fabricate the nanoporous copper interconnect, a zinc-copper alloy is deposited on recesses on the surface of the first body, and then the zinc is removed from the zinc-copper alloy to obtain nanoporous copper. The first body and the second body can be attached using bonding between oxide surfaces of the two bodies or be provided with underfill between the two bodies. The nanoporous copper electrically connects to an active layer or electrical components of the first body and the second bodies. Using nanoporous copper as interconnects is advantageous, among other reasons, because it can be formed at a low temperature, it is compatible with a standard complementary metal-oxide-semiconductor (CMOS) process, it provides good electrical conductivity, and it is less likely to cause issues due to migration of material.

A piston ring includes a base body having an inner circumferential surface, first and second flank surfaces and an outer circumferential surface, wherein a first hard chromium layer with a crack network is applied to the outer circumferential surface and has a crack density of 10-250 cracks per mm and solid particles having an average particle size of 0.01-10 μm embedded in cracks of the first hard chromium layer, a second hard chromium layer having a crack network applied to the first hard chromium layer and having a crack density of the crack network of 10-250 cracks per mm, no solid particles being embedded in the cracks thereof, where the cracks have an average width of 1-15 μm, the cracks are electrolytically expanded and the surface proportion of the cracks are 3-25% based on a total surface of the second hard chromium layer.

A piston ring includes a base body having an inner circumferential surface, first and second flank surfaces and an outer circumferential surface, wherein a first hard chromium layer with a crack network is applied to the outer circumferential surface and has a crack density of 10-250 cracks per mm and solid particles having an average particle size of 0.01-10 μm embedded in cracks of the first hard chromium layer, a second hard chromium layer having a crack network applied to the first hard chromium layer and having a crack density of the crack network of 10-250 cracks per mm, no solid particles being embedded in the cracks thereof, where the cracks have an average width of 1-15 μm, the cracks are electrolytically expanded and the surface proportion of the cracks are 3-25% based on a total surface of the second hard chromium layer.

The chemical conversion treatment liquid according to the present invention, which is cobalt-free and is capable of forming a chemical conversion film having excellent corrosion resistance, contains a water-soluble trivalent chromium-containing substance, a water-soluble titanium-containing substance, and a water-soluble lactic acid-containing substance as essential components and may optionally contain a component at least a part of which is any of a water-soluble glycolic acid-containing substance and a water-soluble ineffective organic acid-containing substance. The water-soluble ineffective organic acid-containing substance is a water-soluble organic acid-containing substance based on an ineffective organic acid that is an organic acid other than lactic acid and other than glycolic acid. When the chemical conversion treatment liquid does not contain the water-soluble glycolic acid-containing substance and does not contain the water-soluble ineffective organic acid-containing substance, a titanium-equivalent molar concentration CTi of the water-soluble titanium-containing substance, a chromium-equivalent molar concentration CCr of the water-soluble trivalent chromium-containing substance, and a lactic acid-equivalent molar concentration CLc of the water-soluble lactic acid-containing substance satisfy the following Expressions (1) to (3): CTi/CCr≥0.5 ...(1); CLc/(CTi+CCr)≥0.40 ...(2); and CLc/CTi≤2.6 ...(3).

Provided is an electrochemical aptasensor for detecting di(2-ethylhexyl)phthalate (DEHP) with high sensitivity. The electrochemical aptasensor according to the present invention has a low detection limit concentration by improving sensitivity by sensor surface modification using a nano composite and gold nanoflowers, and has high practical applicability of a sensor by monitoring a trace amount of DEHP migrating from a real plastic product by a simple measurement method.

Provided is an electrochemical aptasensor for detecting di(2-ethylhexyl)phthalate (DEHP) with high sensitivity. The electrochemical aptasensor according to the present invention has a low detection limit concentration by improving sensitivity by sensor surface modification using a nano composite and gold nanoflowers, and has high practical applicability of a sensor by monitoring a trace amount of DEHP migrating from a real plastic product by a simple measurement method.

A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein the first chromium layer is deposited by supplying current from a power source that is electrically connected to the substrate and to anodes positioned in the chromium bath; etching the first chromium layer by engaging a current bridge that closes the current bridge circuit; depositing a first intermediate chromium layer, wherein the first intermediate chromium layer is deposited by supplying current from the power source; etching the first intermediate chromium layer, wherein the first intermediate chromium layer is etched by engaging the current bridge; and depositing a final chromium layer, wherein the final chromium layer is deposited by supplying current from the power source.

A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein the first chromium layer is deposited by supplying current from a power source that is electrically connected to the substrate and to anodes positioned in the chromium bath; etching the first chromium layer by engaging a current bridge that closes the current bridge circuit; depositing a first intermediate chromium layer, wherein the first intermediate chromium layer is deposited by supplying current from the power source; etching the first intermediate chromium layer, wherein the first intermediate chromium layer is etched by engaging the current bridge; and depositing a final chromium layer, wherein the final chromium layer is deposited by supplying current from the power source.

Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

The method for treatment of parts, characterized in that it comprises the stages of applying an electrolytic chromium plating layer on a part; applying a coating over the entire outer surface of the part; selective stripping of the coating in order to leave the part with at least one coated portion and at least one uncoated portion; carrying out a selective etching on the layer in at least one part of the uncoated portion; metallization of the entire surface of the part; and removal of the coating.