A method for producing metal decorations on a curved dial made of insulating material includes forming, by a method of the LIGA-UV type, a mould made of photosensitive resin and of galvanically depositing a layer of at least one metal from the conductive layer in order to form a block substantially reaching the upper surface of the photosensitive resin.

Provided herein is a method for specifically adjusting the electrical conductivity of a conversion coating, wherein a metallic surface or a conversion-coated metallic surface is treated with an aqueous composition which comprises at least one kind of metal ions selected from the group consisting of the ions of molybdenum, copper, silver, gold, palladium, tin, and antimony and/or at least one electrically conductive polymer selected from the group consisting of the polymer classes of the polyamines, polyanilines, polyimines, polythiophenes, and polypryrols.

Provided herein is a method for specifically adjusting the electrical conductivity of a conversion coating, wherein a metallic surface or a conversion-coated metallic surface is treated with an aqueous composition which comprises at least one kind of metal ions selected from the group consisting of the ions of molybdenum, copper, silver, gold, palladium, tin, and antimony and/or at least one electrically conductive polymer selected from the group consisting of the polymer classes of the polyamines, polyanilines, polyimines, polythiophenes, and polypryrols.

The present invention relates to a cold-rolled steel sheet comprising: a base steel sheet; and a nickel or nickel alloy coating layer formed on the base steel sheet, wherein the adhesion amount of the nickel or nickel alloy is 50 mg/m.sup.2 or less.

According to the present invention, provided are a high-strength cold-rolled steel sheet and a manufacturing for manufacturing same. In the high-strength cold-rolled steel sheet, a metal layer is coated on a cold-rolled steel sheet to a thickness of nanometers, followed by annealing, thereby suppressing the formation of oxides of Si, Mn, and the like on the surface of the steel sheet to within a range in which the elution of Fe is not suppressed, and thus the high-strength cold-rolled steel sheet has improved phosphatability.

The invention relates to a method for coating a steel sheet or steel strip to which an aluminium-based coating is applied in a dip-coating process and the surface of the coating is freed of a naturally occurring aluminium oxide layer. In order to provide a low-cost method for coating steel sheets or steel strips that makes the steel sheets or steel strips outstandingly suitable for the production of components by means of press hardening and for the further processing thereof, it is proposed that transition metals or transition metal compounds are subsequently deposited on the freed surface of the coating to form a top layer. The invention also relates to a method for producing press-hardened components from the aforementioned steel sheets or steel strips with an aluminium-based coating.

A method for manufacturing a printed wiring board includes forming through holes in a double-sided copper-clad laminated plate such that a high-density region of the through holes and a low-density region of the through holes are formed, forming an electrolytic plating film on a copper foil of the plate in the high-density and low-density regions, forming a masking resist to mask the plating film in the high-density region, etching the plating film in the low-density region exposed from the resist such that the plating film in the low-density region is thinned, peeling off the resist from the plating film in the high-density region, and forming a conductor circuit including the copper foil and the plating film in the high-density and low-density regions. The forming of the plating film on the copper foil of the plate includes forming the plating film in the through holes in the high-density and low-density regions.

A method for manufacturing a printed wiring board includes forming through holes in a double-sided copper-clad laminated plate such that a high-density region of the through holes and a low-density region of the through holes are formed, forming an electrolytic plating film on a copper foil of the plate in the high-density and low-density regions, forming a masking resist to mask the plating film in the high-density region, etching the plating film in the low-density region exposed from the resist such that the plating film in the low-density region is thinned, peeling off the resist from the plating film in the high-density region, and forming a conductor circuit including the copper foil and the plating film in the high-density and low-density regions. The forming of the plating film on the copper foil of the plate includes forming the plating film in the through holes in the high-density and low-density regions.

A method for making a component for use in a semiconductor processing chamber is provided. A component body is formed from a conductive material having a coefficient of thermal expansion of less than 10.0×10.sup.−6/K. A metal oxide layer is then disposed over a surface of the component body.

A method for making a component for use in a semiconductor processing chamber is provided. A component body is formed from a conductive material having a coefficient of thermal expansion of less than 10.0×10.sup.−6/K. A metal oxide layer is then disposed over a surface of the component body.

A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.