A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.

Customized patient-specific instruments configured to be selectively attached at predetermined locations of a patient's bone are disclosed. The customized patient-specific instruments may include a polymeric body including a bone-facing surface having a customized patient-specific negative contour shaped to match and receive a corresponding positive contour of the patient's bone at the predetermined location. The customized patient-specific instruments also include a metallic coating that defines one or more cutting slots. A method of performing an orthopaedic surgical procedure is also disclosed.

A micro fabricated electromagnetic device and method for fabricating its component structures, the device having a layered magnetic core of a potentially unlimited number of alternating insulating and magnetic layers depending upon application, physical property and performance characteristic requirements for the device. Methods for fabricating the high performing device permit cost effective, high production rates of the device and its component structures without any degradation in device performance resulting from component layering.

A method of forming a high-conductivity electrical interconnect on a substrate may include forming a graphene film with a plurality of graphene members, depositing a metal over the graphene film, and providing a metallic overlay that connects the plurality of graphene members together through the depositing operation to form a covered graphene film.

A method of forming a high-conductivity electrical interconnect on a substrate may include forming a graphene film with a plurality of graphene members, depositing a metal over the graphene film, and providing a metallic overlay that connects the plurality of graphene members together through the depositing operation to form a covered graphene film.

An aluminum plating film contains aluminum as a main component. The aluminum plating film has, between coating surfaces at both ends in a thickness direction, an intervening layer that contains a metal having a lower ionization tendency than aluminum or an intervening layer that contains an alloy of aluminum and a metal having a lower ionization tendency than aluminum.

A plated silicon-based electronic cigarette atomizing chip includes the following components: a silicon substrate, wherein the silicon substrate is provided with an array of micro-pillars or an array of micro-holes, an inlet end, and an outlet end, the outer walls of the micro-pillars are plated side walls, the inner walls of the micro-holes are plated inner walls, and the array of micro-pillars defines a plurality of micro-channels or electronic cigarette liquid channels penetrating the micro-holes are provided on the silicon substrate; a glass cover, wherein the air holes passing through the glass cover are provided; and the glass cover is fixedly connected to the silicon substrate by a bonding process.

A plated silicon-based electronic cigarette atomizing chip includes the following components: a silicon substrate, wherein the silicon substrate is provided with an array of micro-pillars or an array of micro-holes, an inlet end, and an outlet end, the outer walls of the micro-pillars are plated side walls, the inner walls of the micro-holes are plated inner walls, and the array of micro-pillars defines a plurality of micro-channels or electronic cigarette liquid channels penetrating the micro-holes are provided on the silicon substrate; a glass cover, wherein the air holes passing through the glass cover are provided; and the glass cover is fixedly connected to the silicon substrate by a bonding process.

A wear-resistant coating film is disclosed that can maintain high wear resistance for a long period of time even when it is subjected to repetitive wear, and a method for producing the film, as well as a wear-resistant component. The wear-resistant coating film 10 includes a plated layer 11, lump parts 2, and a coat layer 13. The plated layer and the coat layer are laminated, and each of the lump parts is formed of a single particle 12 and/or an assembly of particles 12. The lump parts 2 are held by the plated layer 11 and are disposed to protrude from the plated layer 11. The coat layer 13 is formed to coat the surface of the plated layer 11, the lump parts 2 have flat portions 18, and the flat portions 18 are placed on the same plane as the surface of the coat layer 13.

The present disclosure generally relates to a method for electroplating (or electrodeposition) a transition metal oxide composition that may be used in gas sensors, biological cell sensors, supercapacitors, catalysts for fuel cells and metal air batteries, nano and optoelectronic devices, filtration devices, structural components, and energy storage devices. The method includes electrodepositing the electrochemically active transition metal oxide composition onto a working electrode in an electrodeposition bath containing a molten salt electrolyte and a transition metal ion source. The electrode structure can be used for various applications such as electrochemical energy storage devices including high power and high-energy primary or secondary batteries.