A process for making a carbon nanotube structure includes forming a composite by depositing or growing carbon nanotubes onto a metal substrate, and infusing the carbon nanotubes. In other aspects, a method of making a wire, includes coating carbon nanotubes on a wire, and electroplating the carbon nanotubes. In still other aspects, a method of making a conductor includes growing or depositing vertically aligned carbon nanotubes on a sheet. Yet still, a method of making a cable includes forming multiple composite wires, each composite wire formed by depositing or growing carbon nanotubes onto a metal substrate, and performing a metal infusion of the carbon nanotubes. The method also comprises combining multiple finished composite wires or objects to make large cables or straps.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

A final injection molded assembly and process for making same that eliminates paint and reduces areas of wasted chrome material. The final injection molded assembly has at least one first injection molded part of a non-plateable first material, at least one overmolded part of plateable second material, at least one pathway through the assembly and integrated features operable for selectively applying an electric current. The pathway creates a predetermined surface path arrangement for applying chrome to desired predetermined plateable areas. A shot of each material is delivered to an injection molding rotary device to produce the injection molded assembly which is then affixed to a chroming process line where electric current is applied. As the electric current is applied and chrome is delivered only the plateable second material will accept the chrome.

The invention relates to a process for coating plastics or plastic surfaces with metals, especially plastics composed of acrylonitrile/butadiene/styrene copolymers (ABS) and composed of mixtures of these copolymers with other plastics (e.g. ABS blends), wherein the process comprises the pretreatment of the plastic surfaces with a composition C (etch solution) comprising at least two different ionic liquids IL1 and IL2.

A method for application of a metal on a substrate comprises a) contacting at least a part of the surface of the substrate with at least one initiator, and polymerizable units with the ability to undergo a chemical reaction to form a polymer, the polymer comprising at least one charged group, wherein the contacting is achieved by contacting a pad with a plate comprising the at least one initiator and the polymerizable units and subsequently contacting the pad with the surface of the substrate, thereby transferring the at least one initiator and the polymerizable units to the surface of the substrate. Subsequently a metal layer is produced on the surface. The compactness of the applied metal layer is increased.

The present invention relates to a process for producing one or more electrical contacts on a component, comprising (a) applying one or more coatings on the component, where at least one of the coatings is a coating of an electrically conductive material, (b) applying a self-passivating metal or semiconductor and/or a dielectric material on the coated component, (c) structuring the passivating coating by laser treatment or etching, (d) contacting the structured coating with an electroplating bath, (e) etching the regions not covered with the galvanically deposited metal.

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

The present invention includes methods of manufacturing a metal infused graphitic material. Also described is how this device may be rendered impermeable. The present invention includes the electroplating/electroless deposition of metal on exposed internal and external surfaces of a porous graphitic substrate. The deposition of metal on the internal structure is accomplished by replacing the void space in the porous substrate with an electrolyte solution containing dissolved metallic species. The plating is initiated either through electrochemical means, electroless means, chemical vapor deposition means, or other means obvious to one familiar in the art of metal plating. A post-deposition bath is also described wherein the plating may be removed from one or both sides of the external surface without impacting the internal pore plating.