Patent classifications
C25D5/54
Method for making an optical fiber device from a 3D printed preform body and related structures
A method for making an optical fiber device may include using a three-dimensional (3D) printer to generate a preform body including an optical material. The preform body may have a 3D pattern of voids therein defining a 3D lattice. The method may further include drawing the preform body to form the optical fiber device.
Method of producing reinforced container
A container structure having one or more sections and a method for manufacturing such a structure is provided. Using an additive manufacturing process, a mold material is applied to produce a shaped substrate in the form of the desired sections and/or structure. Multiple reinforcement members are disposed within the substrate and extend between and are at least partially exposed at the inner and outer substrate surfaces. A coating material is applied to the inner and outer substrate surfaces and bonds to the exposed portions of the reinforcement members. The mold material is removed and replaced with another material among the reinforcement members between the substrate coatings.
Transparent conductive films with embedded metal grids
A transparent conductive film with a metal mesh embedded in a substrate and a method of fabrication thereof is provided. The metal mesh has a cap that is pressed and embedded in a substrate or a deformable material on a substrate, providing superior mechanical stability by mechanical interlocking. The embedding mechanism also provides superior chemical and environmental stability. A fabrication method is provided and includes a vacuum-free and low-cost process for large-volume manufacturing of the transparent conductive film with tunable performance.
Transparent conductive films with embedded metal grids
A transparent conductive film with a metal mesh embedded in a substrate and a method of fabrication thereof is provided. The metal mesh has a cap that is pressed and embedded in a substrate or a deformable material on a substrate, providing superior mechanical stability by mechanical interlocking. The embedding mechanism also provides superior chemical and environmental stability. A fabrication method is provided and includes a vacuum-free and low-cost process for large-volume manufacturing of the transparent conductive film with tunable performance.
Semiconductor package having a variable redistribution layer thickness
Semiconductor packages having variable redistribution layer thicknesses are described. In an example, a semiconductor package includes a redistribution layer on a dielectric layer, and the redistribution layer includes first conductive traces having a first thickness and second conductive traces having a second thickness. The first thickness may be different than the second thickness, e.g., the first thickness may be less than the second thickness.
METHOD FOR PRODUCING A CONTROL ELEMENT MADE OF PLASTIC WITH BACKLIT IMAGERY THAT IS METALLIZED ON ONE SIDE, CONTROL ELEMENT WITH BACKLIT IMAGERY, AND MACHINE FOR CARRYING OUT A PLURALITY OF METHOD STEPS
A method for producing a control element made of plastic with backlit imagery that is metallized on one side, particularly for a motor vehicle, and a machine that is configured to carry out the aforementioned method, as well as to a control element with backlightable imagery.
Coaxial Cable Utilizing Plated Carbon Nanotube Elements And Method Of Manufacturing Same
A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.
POLYAMIDE COMPOSITIONS AND PLATING APPLICATIONS THEREOF
The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form structurally aesthetic injection-molded articles. The polyamide compositions may include from 40 wt. % to 80 wt. % of a polyamide, from 0.5 wt. % to 40 wt. % of an etchable filler, from 5 wt. % to 30 wt. % of glass fiber, optionally less than 40 wt. % of a semi-structural mineral, and optionally from 0.1 wt. % to 13 wt. % of additive. The polyamide composition imparts very good surface appearance and excellent mechanical properties to injection-molded articles that are substantially free of visual defects.
Methods of phosphidation and structures made therefrom
The present disclosure provides for methods of phosphidation, catalysts formed from phosphidation, and methods of producing H.sub.2.
Methods of phosphidation and structures made therefrom
The present disclosure provides for methods of phosphidation, catalysts formed from phosphidation, and methods of producing H.sub.2.