The present invention provides a transparent conductive thin film which is flexible for suiting substantially all kinds of electronic and optoelectronic devices or display panel. The present conductive thin film includes at least one transparent substrate, a deformable layer and a conductive network pattern having a high aspect ratio such that at least one surface of the conductive network being exposed out of the deformable layer or the transparent substrate for contacting with an external structure while a large proportion thereof stays firmly integrated into the substrate. The present invention also relates to methods of fabricating a transparent conductive thin film including the structural features of the transparent conductive thin film of the present invention. Various optimizations of the present methods are also provided in the present invention for facilitating large area thin film fabrication and large scale production.

The present invention relates to a plastic part (1) with selective metallization comprising at least one first non-metallized portion (7) made from a first plastic material that cannot be metallized by electroplating and at least one second metallized portion (9) made from a second metallizable plastic material, the first plastic material being a mixture of polycarbonate and of a semiaromatic polyester and the second plastic material being a polyamide.

A controller outputs a control signal to control a plating liquid supply and a power applying device to perform a first electrolytic plating processing by applying power to a processing surface in a state that a plating liquid is in contact with a first facing range, which is a partial range of an electrode facing surface, and the controller also outputs, after the first electrolytic plating processing is performed, a control signal to control the plating liquid supply and the power applying device to perform a second electrolytic plating processing by applying the power to the processing surface in a state that the plating liquid is in contact with a second facing range of the electrode facing surface, the second facing range being wider than the first facing range.

A controller outputs a control signal to control a plating liquid supply and a power applying device to perform a first electrolytic plating processing by applying power to a processing surface in a state that a plating liquid is in contact with a first facing range, which is a partial range of an electrode facing surface, and the controller also outputs, after the first electrolytic plating processing is performed, a control signal to control the plating liquid supply and the power applying device to perform a second electrolytic plating processing by applying the power to the processing surface in a state that the plating liquid is in contact with a second facing range of the electrode facing surface, the second facing range being wider than the first facing range.

A method for manufacturing metal-CNT composites is disclosed. The method comprises providing an agglomerate of CNTs, filling interstices of the CNT agglomerate in a plating solution, so as to form a metal phase, in which the CNTs are embedded. The CNT agglomerate is compressed with a clamping appliance when the metal phase is formed. A further aspect of the invention relates to metal-CNT composites with high CNT content.

A method for manufacturing metal-CNT composites is disclosed. The method comprises providing an agglomerate of CNTs, filling interstices of the CNT agglomerate in a plating solution, so as to form a metal phase, in which the CNTs are embedded. The CNT agglomerate is compressed with a clamping appliance when the metal phase is formed. A further aspect of the invention relates to metal-CNT composites with high CNT content.

A method for depositing a metal layer on a component includes applying an electrically conductive coating composition comprising a resin and metal particles on a coating region of the component and partially curing the resin to a gel state to form an electrically conductive coating. The method also includes applying additional metal particles to the partially cured resin in the gel state and depositing, via an electrodeposition process, a metal layer on the electrically conductive coating.

A method of forming an electrode in an electrochemical battery comprises: coating a reticulated substrate with a conductive material; curing the reticulated substrate coated with the conductive material; and electroplating the reticulated substrate coated with the conductive material with a desired metal material.

A method of forming an electrode in an electrochemical battery comprises: coating a reticulated substrate with a conductive material; curing the reticulated substrate coated with the conductive material; and electroplating the reticulated substrate coated with the conductive material with a desired metal material.

The variation between different product lots is reduced for plating growth dimensions of plated films to serve as external electrodes. The correlation is grasped in advance among the surface resistance value of a ceramic body, the applying charge amount for electrolytic plating, an actual plating growth dimension obtained when the ceramic body with the surface resistance value is subjected to plating with the foregoing applying charge amount. The surface resistance value is measured for the ceramic body on which plated films to serve as external electrodes are to be formed by applying electrolytic plating, and the applying charge amount required for plating is determined by applying the surface resistance value and a designed value for an intended plating growth dimension to the correlation mentioned above. Thereafter, in order to form the plated films, the ceramic body is subjected to electrolytic plating, with the applying charge amount determined.