An exemplary RF module includes a dielectric substrate with metal traces on one surface that connect high frequency components and provide reference ground. Other metal traces on the other surface of the substrate also provide high frequency transmission lines and reference ground. An enclosure made using semiconductor manufacturing technology is mounted to the substrate and has conductive interior recesses defined by extending walls that are connected to the reference ground. The recesses surround the respective components and provide electromagnetic shielding. The dimensional precision in the location and smoothness of the walls and recesses due to the semiconductor manufacturing technology provides repeatable unit-to-unit RF characteristics of the RF module. One way of mounting the enclosure to the substrate uses a plurality of metal bonding bumps extending outwardly from the walls to engage reference ground metal traces on the substrate. Applied pressure deforms the bonding bumps to form a metal-to-metal bond.

An exemplary RF module includes a dielectric substrate with metal traces on one surface that connect high frequency components and provide reference ground. Other metal traces on the other surface of the substrate also provide high frequency transmission lines and reference ground. An enclosure made using semiconductor manufacturing technology is mounted to the substrate and has conductive interior recesses defined by extending walls that are connected to the reference ground. The recesses surround the respective components and provide electromagnetic shielding. The dimensional precision in the location and smoothness of the walls and recesses due to the semiconductor manufacturing technology provides repeatable unit-to-unit RF characteristics of the RF module. One way of mounting the enclosure to the substrate uses a plurality of metal bonding bumps extending outwardly from the walls to engage reference ground metal traces on the substrate. Applied pressure deforms the bonding bumps to form a metal-to-metal bond.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

A method for fabricating a heat sink including providing a carbon metal composite having a plurality of metal-coated carbon fibers and a plurality of openings, the openings leading from a first side of the carbon metal composite to a second side of the carbon metal composite, disposing the carbon metal composite over a semiconductor element such that the first side of the carbon metal composite faces the semiconductor element, and bonding the carbon metal composite to the semiconductor element by means of an electroplating process, wherein a metal electrolyte is supplied to an interface between the carbon metal composite and the semiconductor element via the plurality of openings.

A method for fabricating a heat sink including providing a carbon metal composite having a plurality of metal-coated carbon fibers and a plurality of openings, the openings leading from a first side of the carbon metal composite to a second side of the carbon metal composite, disposing the carbon metal composite over a semiconductor element such that the first side of the carbon metal composite faces the semiconductor element, and bonding the carbon metal composite to the semiconductor element by means of an electroplating process, wherein a metal electrolyte is supplied to an interface between the carbon metal composite and the semiconductor element via the plurality of openings.

The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions.

A CNT metal composite material is provided depositing a metal into a plurality of CNTs is provided including 3% by weight or more and 70% by weight or less of the CNTs, a region is arranged with the metal uniformly distributed in a scanning electron microscope image magnified ten thousand times and the length of the region is at least 1 m, a signal of the metal and a signal of carbon are not localized in a specific area in a two-dimensional elemental analysis image magnified ten thousand times, and a length of a region uniformly distributing the signal of the metal and the signal of carbon uniformly distributed is at least 1 m, an allowable current density is at 610.sup.6 A/cm.sup.2 or more, and volume resistivity is 110.sup.6 .Math.cm or more and 510.sup.3 .Math.cm or less.

A CNT metal composite material is provided depositing a metal into a plurality of CNTs is provided including 3% by weight or more and 70% by weight or less of the CNTs, a region is arranged with the metal uniformly distributed in a scanning electron microscope image magnified ten thousand times and the length of the region is at least 1 m, a signal of the metal and a signal of carbon are not localized in a specific area in a two-dimensional elemental analysis image magnified ten thousand times, and a length of a region uniformly distributing the signal of the metal and the signal of carbon uniformly distributed is at least 1 m, an allowable current density is at 610.sup.6 A/cm.sup.2 or more, and volume resistivity is 110.sup.6 .Math.cm or more and 510.sup.3 .Math.cm or less.

Customized patient-specific instruments configured to be selectively attached at predetermined locations of a patient's bone are disclosed. The customized patient-specific instruments may include a polymeric body including a bone-facing surface having a customized patient-specific negative contour shaped to match and receive a corresponding positive contour of the patient's bone at the predetermined location. The customized patient-specific instruments also include a metallic coating that defines one or more cutting slots. A method of performing an orthopaedic surgical procedure is also disclosed.