A method of hardfacing a component includes generating a laser beam and directing the laser beam to an area of a wear surface of the component. The method includes feeding a flexible cord of a cladding material into the laser beam to melt the flexible cord and produce a bead of the cladding material on the wear surface. The flexible cord includes an inner metal wire surrounded by an agglomerate of abrasion and wear-resistant material that contains diamond particles. The method further includes moving the laser beam and the flexible cord along the wear surface to produce a cladding layer over the wear surface of the component.

A method of hardfacing a component includes generating a laser beam and directing the laser beam to an area of a wear surface of the component. The method includes feeding a flexible cord of a cladding material into the laser beam to melt the flexible cord and produce a bead of the cladding material on the wear surface. The flexible cord includes an inner metal wire surrounded by an agglomerate of abrasion and wear-resistant material that contains diamond particles. The method further includes moving the laser beam and the flexible cord along the wear surface to produce a cladding layer over the wear surface of the component.

A ceramic electronic component that includes a ceramic main body, a coating film and external electrodes on the surface of the ceramic main body. The coating film is selectively formed on the surface of the ceramic main body by applying, to the surface of the ceramic main body, a resin-containing solution that etches the surface of the ceramic main body so as to ionize constituent elements of the ceramic main body. The coating film includes a resin and the constituent elements of the ceramic main body, which were ionized and deposited from the ceramic main body.

A ceramic electronic component that includes a ceramic main body, a coating film and external electrodes on the surface of the ceramic main body. The coating film is selectively formed on the surface of the ceramic main body by applying, to the surface of the ceramic main body, a resin-containing solution that etches the surface of the ceramic main body so as to ionize constituent elements of the ceramic main body. The coating film includes a resin and the constituent elements of the ceramic main body, which were ionized and deposited from the ceramic main body.

A method for manufacturing a copper composite electrode, including contacting a conductive substrate including copper with a phosphate solution for oxidation to produce a copper phosphate structure on a surface of the conductive substrate, thus acquiring a copper phosphate composite electrode.

An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other.

An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other.

The present disclosure provides carbon nanotube (CNT)-to-metal assemblies comprising a carbon nanotube (CNT) component connected to a metal component, and methods for preparing them. The assemblies may be connected through a CNT-to-metal connector that may comprise a CNT connector pad.

The present disclosure provides carbon nanotube (CNT)-to-metal assemblies comprising a carbon nanotube (CNT) component connected to a metal component, and methods for preparing them. The assemblies may be connected through a CNT-to-metal connector that may comprise a CNT connector pad.

A plating system is provided. The plating system includes an electroplating chamber defining a plating region within which a wafer is plated. The electroplating chamber includes an inlet configured to introduce plating solution into the plating region of the electroplating chamber. The electroplating chamber includes an outlet configured to remove the plating solution from the plating region of the electroplating chamber. The plating system includes a barrier configured to inhibit removal of the plating solution from the plating region.