A plating system is provided. The plating system includes an electroplating chamber defining a plating region within which a wafer is plated. The electroplating chamber includes an inlet configured to introduce plating solution into the plating region of the electroplating chamber. The electroplating chamber includes an outlet configured to remove the plating solution from the plating region of the electroplating chamber. The plating system includes a barrier configured to inhibit removal of the plating solution from the plating region.

A method for decontamination of a toxic substance is disclosed. The method includes fabricating a plurality of nanomotors, and putting the plurality of nanomotors in contact with a contaminant solution comprising the toxic substance. Fabricating the plurality of nanomotors includes preparing a mesoporous silica template, forming the plurality of nanomotors within the mesoporous silica template, and separating the plurality of nanomotors from the mesoporous silica template. The mesoporous silica template includes a plurality of channels, where each channel of the plurality of channels have a diameter less than about 50 nm and a length of less than about 100 nm, and each nanomotor of the plurality of nanomotors is formed within a channel of the plurality of channels. Putting the plurality of nanomotors in contact with the contaminant solution includes adding hydrogen peroxide (H.sub.2O.sub.2) and the plurality of nanomotors to the contaminant solution.

A method for decontamination of a toxic substance is disclosed. The method includes fabricating a plurality of nanomotors, and putting the plurality of nanomotors in contact with a contaminant solution comprising the toxic substance. Fabricating the plurality of nanomotors includes preparing a mesoporous silica template, forming the plurality of nanomotors within the mesoporous silica template, and separating the plurality of nanomotors from the mesoporous silica template. The mesoporous silica template includes a plurality of channels, where each channel of the plurality of channels have a diameter less than about 50 nm and a length of less than about 100 nm, and each nanomotor of the plurality of nanomotors is formed within a channel of the plurality of channels. Putting the plurality of nanomotors in contact with the contaminant solution includes adding hydrogen peroxide (H.sub.2O.sub.2) and the plurality of nanomotors to the contaminant solution.

A partial plating method of an automobile resin part may include a painting step of partially applying masking paint for plating on one side surface of an injection molded automobile resin product to form a painting portion where the masking paint for plating is applied and a non-painting portion where the masking paint for plating is not applied, and a wet electroplating step of attaching a current electrode for wet electroplating on the non-painting portion and performing the wet electroplating to form a plating layer on the entire surface of the automobile resin part except for the painting portion.

A partial plating method for a resin part of a vehicle may include a masking step of applying masking paint on an injection molded product made of a plastic resin to divide the injection molded product into a plating area on which a metal component is to be plated and a non-plating area on which the metal component is not to be plated, an etching step of etching the masked injection molded product in an etching solution to elute some components of the resin from the plating area, and an electroplating step of electroplating the etched injection molded product in a plating bath.

The invention relates generally to electrodeposition apparatus and methods. When depositing films via electrodeposition, where the substrate has an inherent resistivity, for example, sheet resistance in a thin film, methods and apparatus of the invention are used to electrodeposit materials onto the substrate by forming a plurality of ohmic contacts to the substrate surface and thereby overcome the inherent resistance and electrodeposit uniform films. Methods and apparatus of the invention find particular use in solar cell fabrication.

An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.

A hybrid magnetic substrate manufacturing method through spin-spraying ferrite coating solutions is disclosed, wafers of various schematic slit patterns using spin-spray ferrite coating generate magnetic hybrid substrates. A ferrite via-based inductor or transformer using spin-spray manufacturing method produces quality factors greater than 625 at 50300 MHz. Integrated ferrite inductors of I-shaped and U-shaped copper patterns with various ferrite loops that have quality factors bigger than 700 at 50300 MHz are manufactured.

A hybrid magnetic substrate manufacturing method through spin-spraying ferrite coating solutions is disclosed, wafers of various schematic slit patterns using spin-spray ferrite coating generate magnetic hybrid substrates. A ferrite via-based inductor or transformer using spin-spray manufacturing method produces quality factors greater than 625 at 50300 MHz. Integrated ferrite inductors of I-shaped and U-shaped copper patterns with various ferrite loops that have quality factors bigger than 700 at 50300 MHz are manufactured.

A metal coated article includes a platinum-group metal region adjacent a refractory metal region, which is adjacent a substrate comprising an inorganic material. A refractory metal carbide layer is adjacent the substrate and the refractory metal layer is adjacent the refractory metal carbide layer. The platinum-group metal region comprises a refractory metal/platinum-group metal layer and a platinum-group metal layer. Related methods are also disclosed.