Disclosed is a substrate processing method, which comprises the following steps: S1: transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber; S2: after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate; S3: electroplating a second metal layer on the first metal layer. By means of a step of forming a water film layer before electroplating in a plating chamber, the present invention has advantages of preventing delamination between two metal layers and solving product recess abnormality.

Disclosed is a substrate processing method, which comprises the following steps: S1: transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber; S2: after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate; S3: electroplating a second metal layer on the first metal layer. By means of a step of forming a water film layer before electroplating in a plating chamber, the present invention has advantages of preventing delamination between two metal layers and solving product recess abnormality.

The present disclosure provides for methods of phosphidation, catalysts formed from phosphidation, and methods of producing Hz.

The present disclosure provides for methods of phosphidation, catalysts formed from phosphidation, and methods of producing Hz.

A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.

A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.

The present invention relates to a production technique of a 3D glass candle lamp. Transparent glass is processed, the interior of the glass is formed by a laser method, and by conducting electroplating and color plating on the inner surface and the outer surface of the glass correspondingly, under the condition that a light source of the glass lamp is available, light is reflected by the inner electroplated layer and the outer electroplated layer, and thus clearly-layered 3D patterns are formed at the positions of laser patterns; in addition, the colors of the patterns can change along with plating colors and the color of the light source, and the scene illumination effect is additionally achieved.

A ceramic electronic component including a ceramic element assembly, an external electrode, and an underlying layer. In this ceramic electronic component, the underlying layer is formed on the ceramic element assembly, the external electrode is formed on the underlying layer, the underlying layer is formed of a metal material and a glass material containing a silicon atom, and the metal material exists in a highly dispersed state in the glass material.

This disclosure describes composite structures and method of making the structures. The structures according to this disclosure may be used in handheld electronics. In example embodiments, holes are formed through a planar polymeric core. A metallic coating is disposed on the core to coat external surfaces of the core as well as internal surfaces of the holes. The metallic coating may entirely occlude the holes. The resulting structure may provide improved strength and rigidity and resist delamination of the metallic coating.

The toothbrush has a handle, a neck and a head. In the handle there is a first hard component which has a metallic covering. At least in regions, the metallic covering has a covering of a second hard component.