A semiconductor apparatus includes a semiconductor device, on-semiconductor-device metal pad and metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first insulating layer on which the semiconductor device is placed, a second insulating layer formed on the semiconductor device, a third insulating layer formed on the second layer. The metal interconnect is electrically connected to the semiconductor device via the on-semiconductor-device metal pad at an upper surface of the second layer, penetrates the second layer from its upper surface, and is electrically connected to the through electrode at an lower surface of the second layer, and an under-semiconductor-device metal interconnect is between the first layer and the semiconductor device, and the under-semiconductor-device metal interconnect is electrically connected to the metal interconnect at the lower surface of the second layer.

The toothbrush has a handle, a neck and a head. In the handle there is a first hard component which has a metallic covering. At least in regions, the metallic covering has a covering of a second hard component.

According to one embodiment of a CO.sub.2 reduction catalyst of the present invention, a conductive material is immersed in an aqueous solution containing a gold source, and a current or a potential is applied, whereby a highly active CO.sub.2 reduction catalyst can be formed in a wide range portion on a surface of the conductive material. According to one embodiment of a CO.sub.2 reduction catalyst of the present invention, in a CO.sub.2 reduction reaction apparatus including a CO.sub.2 reduction electrode having the CO.sub.2 reduction catalyst, CO.sub.2 is reduced.

A non-aqueous metal catalytic composition includes (a) a silver carboxylate-trialkyl(triaryl)phosphite complex comprising reducible silver ions in an amount of at least 2 weight %, (b) a silver ion photoreducing composition in an amount of at least 1 weight %, and (c) a photocurable component or a non-curable polymer or a combination of a photocurable component and a non-curable polymer. This non-aqueous metal catalytic composition can be used to form silver metal particles in situ during suitable reducing conditions. The silver metal can be provided in a suitable layer or pattern on a substrate, which can then be subsequently subjected to electroless plating to form electrically-conductive layers or patterns for use in various articles or as touch screen displays in electronic devices.

Method for continuously producing flexible copper clad laminates includes performing continuous ion implantation and/or plasma deposition on the surface of an organic macromolecular polymer film, and performing continuous copper plating. The bonding force between the copper film and the substrate in a two-layer flexible copper clad laminate produced by the method is much larger than that in a flexible copper clad laminate produced by a sputtering/plating method and equivalent to that in a flexible copper clad laminate produced by a coating method and a lamination method. Meanwhile the thickness of the copper film can be easily controlled to be less than 18 microns.

A method for manufacturing metal oxide-grown carbon fibers including immersing carbon fibers in a solution for forming a metal oxide seed layer and electrodepositing a metal oxide seed on the surfaces of carbon fibers, or irradiating microwave thereto to form a metal oxide seed layer, and irradiating microwave to the metal oxide seed layer-formed carbon fibers to grow metal oxide. The method for manufacturing metal oxide-grown carbon fibers can reduce process time, and improve process energy efficiency and production efficiency. The method for manufacturing metal oxide-grown carbon fibers can offer metal oxide-grown carbon fibers with improved interfacial shear stress.

A method of fabricating a mask includes defining cell areas and a mask frame area on a silicon substrate, the mask frame area excluding the cell areas, the mask frame area may include a mask rib region partitioning the cell areas and an outer frame region disposed at an outermost position of the silicon substrate, forming a groove in the mask rib region, forming a metal mask rib by forming a metal in the groove, forming a photoresist pattern including openings in each of the cell areas, growing a plating film in each of the cell areas, forming a mask membrane formed of the plating film by removing the photoresist pattern, and etching a rear surface of the silicon substrate to form cell openings associated with the cell areas, respectively.

A method of fabricating a mask includes defining cell areas and a mask frame area on a silicon substrate, the mask frame area excluding the cell areas, the mask frame area may include a mask rib region partitioning the cell areas and an outer frame region disposed at an outermost position of the silicon substrate, forming a groove in the mask rib region, forming a metal mask rib by forming a metal in the groove, forming a photoresist pattern including openings in each of the cell areas, growing a plating film in each of the cell areas, forming a mask membrane formed of the plating film by removing the photoresist pattern, and etching a rear surface of the silicon substrate to form cell openings associated with the cell areas, respectively.

The present invention presents a method for reducing Hysteresis core loss and Eddy current core loss for magnetic components or materials integrating a porous insulation layer and the resulting apparatus. A metallic layer is formed, and a porous insulation layer is deposited. The insulation deposition is followed by the formation of an ink coverage layer which seals the voids of the porous insulation layer so that they become gaps. The ink coverage layer may be built upon to form subsequent component layers. The result is a component with a gapped porous insulation layer where the voids increase the insulation the porous insulation layer provides. This increases the directional impedance of the magnetic material or core while retaining the thinness of the layers, both insulation and metallic, that the use of porous insulation layers allows.

The present invention presents a method for reducing Hysteresis core loss and Eddy current core loss for magnetic components or materials integrating a porous insulation layer and the resulting apparatus. A metallic layer is formed, and a porous insulation layer is deposited. The insulation deposition is followed by the formation of an ink coverage layer which seals the voids of the porous insulation layer so that they become gaps. The ink coverage layer may be built upon to form subsequent component layers. The result is a component with a gapped porous insulation layer where the voids increase the insulation the porous insulation layer provides. This increases the directional impedance of the magnetic material or core while retaining the thinness of the layers, both insulation and metallic, that the use of porous insulation layers allows.