First, a patterned substrate including an insulating substrate, a conductive seed layer, and an insulating layer is prepared. The seed layer is disposed on the insulating substrate, and consists of a first part having a predetermined pattern corresponding to the wiring pattern and a second part as a part other than the first part. The insulating layer is disposed on the second part of the seed layer. Subsequently, a metal layer having a thickness larger than a thickness of the insulating layer is formed on the first part of the seed layer. Here, a voltage is applied between an anode and the seed layer while a resin film containing a metal ion-containing solution is disposed between the patterned substrate and the anode and the resin film and the seed layer are brought into pressure contact. Subsequently, the insulating layer and the second part of the seed layer are removed.

A plating method which can achieve a desired dome height is disclosed. The method includes: preparing correlation data showing a relationship between proportion of dome height to bump height and concentration of chloride ions; producing a plating solution containing chloride ions at a concentration which has been selected based on a desired proportion of dome height to bump height and on the correlation data, the selected concentration being in a range of 100 mg/dm.sup.3 to 300 mg/dm.sup.3; immersing a substrate in the plating solution; and passing an electric current between an anode and the substrate, both immersed in the plating solution, thereby plating the substrate to form bumps.

A method for manufacturing a miniaturized electrochemical cell and a miniaturized electrochemical cell is provided. The method includes the following steps: a) forming a colloidal template of colloidal particles made of an electrically insulating material, on a substrate made of an electrically conducting material, b) depositing by electrodeposition in the void spaces of the colloidal template, at least three alternating layers forming a repeating unit, the alternating layers being made of an electron conducting material or a semi -conducting material, the intermediate layer(s) being made of a material M.sub.3 different from materials M.sub.1 and M.sub.2 constituting respectively the upper and lower layers, the material M3 having a standard potential lower than the standard potentials of the materials M.sub.1 and M.sub.2, c) removal of the material M.sub.3 of intermediate layer(s), and d) removal of the colloidal particles of the upper and lower layers to obtain the desired electrodes.

The present invention includes a method for creating a system-in-package in or on photodefinable glass including: providing a photodefinable glass substrate; masking a design layout comprising one or more structures to form one or more integrated lumped element devices as the system-in-package on or in a photodefinable glass substrate; transforming at least a portion of the photodefinable glass substrate to form a glass-crystalline substrate; etching the glass-crystalline substrate to form one or more channels in the glass-crystalline substrate; depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate to enable electroplating of copper; and electroplating the copper to fill the one or more channels and to deposit copper on the surface of the photodefinable glass to form the one or more integrated lumped element devices.

The present invention is directed to a method for preparing a coated optical article including providing a non-conductive substrate; forming a conductive coating layer over the substrate; electrodepositing a first electrodepositable coating composition over the conductive coating layer to form a first electrodeposited inorganic coating layer; and electrodepositing a second electrodepositable coating composition over the first electrodeposited coating layer to form a second electrodeposited inorganic coating layer thereover, thereby forming a multi-layer antireflective inorganic coating over the conductive coating layer. Each of the first electrodepositable coating composition and the second electrodepositable coating composition is different one from the other, and each includes a sol prepared from a composition of a metal oxide precursor and protic acid such that each coating composition is hydrolyzed. Coated optical articles are also provided.

The present invention is directed to a method for preparing a coated optical article including providing a non-conductive substrate; forming a conductive coating layer over the substrate; electrodepositing a first electrodepositable coating composition over the conductive coating layer to form a first electrodeposited inorganic coating layer; and electrodepositing a second electrodepositable coating composition over the first electrodeposited coating layer to form a second electrodeposited inorganic coating layer thereover, thereby forming a multi-layer antireflective inorganic coating over the conductive coating layer. Each of the first electrodepositable coating composition and the second electrodepositable coating composition is different one from the other, and each includes a sol prepared from a composition of a metal oxide precursor and protic acid such that each coating composition is hydrolyzed. Coated optical articles are also provided.

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

A method for depositing a decorative and/or functional layer on at least a portion of a surface of a finished or semi-finished article made of a non-conductive ceramic material, this deposition method includes the following operations: subjecting the at least a portion of the surface of the article to a carburising or nitriding treatment during which carbon, respectively nitrogen atoms, diffuse in the at least a portion of the surface of the article, then depositing, by galvanic growth of a metallic material, the decorative and/or functional layer on at least a portion of the surface of the article which has undergone the carburising or nitriding treatment.

A fabricating method of a non-enzyme sensor element includes a printing step, a coating step and an electroplating step. In the printing step, a conductive material is printed on a surface of a substrate to form a working electrode, a reference electrode and an auxiliary electrode, and a porous carbon material is printed on the working electrode to form a porous carbon layer. In the coating step, a graphene film material is coated on the porous carbon layer of the working electrode to form a graphene layer. In the electroplating step, a metal is electroplated on the graphene layer by a pulse constant current to form a catalyst layer including a metal oxide.