A floating metallized element assembly and method of manufacturing thereof are disclosed. The floating metallized element assembly includes a work piece of a plateable resin and a non-plateable resin including a front side and a back side. The work piece includes at least one plated decorative region on the plateable resin at the front side. The work piece also includes at least one network of the plateable resin at the back side. The work piece additionally includes a plurality of discrete current paths of the plateable resin extending from the at least one network to the at least one plated decorative region. The work piece also includes at least one non-plated decorative region of the non-plateable resin adjacent the at least one decorative region. Metal surfaces are adhered to and disposed on the at least one plated decorative region.

There is provided a roughened nickel-plated sheet having a roughened nickel layer as an outermost surface layer on at least one surface of a metal base material, wherein the brightness L* of the surface of the roughened nickel layer is 30 to 50, the glossiness of 85° of the surface of the roughened nickel layer is 1.5 to 50.

A method for producing a black plated resin part includes the steps of electroplating a resin substrate provided with an underlying plating layer in a trivalent chromium plating bath containing thiocyanic acid, to thereby form, on the underlying plating layer, a black chromium plating layer composed of trivalent chromium and having a thickness of 0.15 μm or more; and immersing the resin substrate provided with the black chromium plating layer in warm water at 30° C. or higher for a predetermined time. In the method, the amount of thiocyanic acid contained in the trivalent chromium plating bath, the temperature of the warm water, and the time of immersion of the resin substrate in the warm water are adjusted so that the black chromium plating layer exhibits a b* value of −1.7 or less based on the L*a*b* color system.

A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has a root mean square gradient of roughness curve elements RΔq according to JIS B0601:2013 of 5 to 28°. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to the first surface treatment layer 3 of the surface treated copper foil 1.

A substrate includes a final silver-plated surface protected against silver tarnishing by a protective coat having a thickness between 1 nm and 200 nm, the protective coat includes a first coat of Al.sub.2O.sub.3 deposited on said final silver-plated surface and having a thickness between 0.5 nm and 100 nm, and on the first coat of Al.sub.2O.sub.3, a second coat of TiO.sub.2 having a thickness between 0.5 nm and 100 nm, the substrate including a coat of a silver and copper alloy comprising between 0.1% and 10% by weight of copper with respect to the total weight of the alloy, forming said final silver-plated surface, said coat of a silver and copper alloy having a thickness between 1000 nm and 3000 nm. Embodiments also relate to a method for manufacturing such a substrate.

A plumbing fixture having a multi-color appearance includes a first portion including a first finish having a first appearance and a second portion including a second portion having a second appearance that differs from the first appearance. The plumbing fixture further includes a transition region between the first portion and the second portion, wherein the appearance of the third region is graduated from the first appearance to the second appearance between a first end of the transition region adjacent the first portion and a second end of the transition region adjacent the second portion. The plumbing fixture has an ombré appearance as a result of the graduated transition between the first portion and the second portion.

A method for producing a black plated resin part includes the steps of electroplating a resin substrate provided with an underlying plating layer in a trivalent chromium plating bath containing thiocyanic acid, to thereby form, on the underlying plating layer, a black chromium plating layer composed of trivalent chromium and having a thickness of 0.15 μm or more; and immersing the resin substrate provided with the black chromium plating layer in warm water at 30° C. or higher for a predetermined time. In the method, the amount of thiocyanic acid contained in the trivalent chromium plating bath, the temperature of the warm water, and the time of immersion of the resin substrate in the warm water are adjusted so that the black chromium plating layer exhibits a b* value of −1.7 or less based on the L*a*b* color system.

An electrolyte solution for iron-tungsten plating is prepared by dissolving in an aqueous medium a divalent iron salt (e.g., iron (II) sulfate) and an alkali metal citrate (e.g., sodium citrate, potassium citrate, or other alkali metal citrate) to form a first solution, dissolving in the first solution a tungstate salt (e.g., sodium tungstate, potassium tungstate, or other potassium tungstate) to form a second solution, and dissolving in the second solution a citric acid to form the electrolyte solution. An iron-tungsten coating is formed on a substrate using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit iron and tungsten on the substrate.

The present disclosure describes electrodeposited nanolaminate materials having layers comprised of nickel and/or chromium with high hardness. The uniform appearance, chemical resistance, and high hardness of the nanolaminate NiCr materials described herein render them useful for a variety of purposes including wear (abrasion) resistant barrier coatings for use both in decorative as well as demanding physical, structural and chemical environments.

A method for creating a chrome-plated surface having a matte finish that typically includes: controlling a resistance of a current bridge circuit; depositing a first chromium layer on a substrate positioned in a chromium bath, wherein the first chromium layer is deposited by supplying current from a power source that is electrically connected to the substrate and to anodes positioned in the chromium bath; etching the first chromium layer by engaging a current bridge that closes the current bridge circuit; depositing a first intermediate chromium layer, wherein the first intermediate chromium layer is deposited by supplying current from the power source; etching the first intermediate chromium layer, wherein the first intermediate chromium layer is etched by engaging the current bridge; and depositing a final chromium layer, wherein the final chromium layer is deposited by supplying current from the power source.