A nickel-chromium (NiCr) alloy and a method for electrodepositing the NiCr alloy on a turbine engine component for dimensionally restoring the engine component are described. The engine component is restored by rebuilding wall thickness with the NiCr alloy including from 2 to 50 wt % chromium balanced with nickel. The turbine component coated with the NiCr alloy is heat-treated at a high temperature to homogenize composition of the alloy to mimic the base alloy and to restore materials lost during repair of the turbine component.

An electrodeposited nickel-chromium-aluminum (NiCrAl) composite including nickel-chromium alloy and aluminum, and alloys or compounds formed by Al, Cr and Ni applied on turbine components comprises from 2 to 50 wt % chromium, from 0.1 to 6 wt % aluminum, and a remaining balance of nickel, wherein the NiCrAl composite is heat-treated to form an aluminum compound and to restore materials lost during repair processes of the turbine components.

A nickel-chromium (NiCr) alloy and a method for electrodepositing the NiCr alloy on a turbine engine component for dimensionally restoring the engine component are described. The engine component is restored by re-building wall thickness with the NiCr alloy including from 2 to 50 wt % chromium balanced with nickel. The turbine component coated with the NiCr alloy is heat-treated at a high temperature to homogenize composition of the alloy to mimic the base alloy and to restore materials lost during repair of the turbine component.

The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. In some instances, the first current is not present. A second current, in the form of waveform, is induced across the first electrode, the second current being transverse to the first current, and the second current inducing a relativistic charge across the first electrode. Metal from the electrolyte is deposited on the substrate or corroded from the substrate, among other things. The methods, as well as associated apparatus, improve deposition, bonding, corrosion, and other effects.

At least one plating pen is brought into aligned relationship with at least one hole defined in a board. The pen includes a central retractable protrusion, a first shell surrounding the protrusion and defining a first annular channel therewith, and a second shell surrounding the first shell and defining a second annular channel therewith. The protrusion is lowered to block the hole and plating material is flowed down the first channel to a surface of the board and up into the second channel, to form an initial deposit on the board surface. The protrusion is raised to unblock the hole, and plating material is flowed down the first annular channel to side walls of the hole and up into the second annular channel, to deposit the material on the side walls of the hole.

Provided is a film forming apparatus for forming a metal film capable of replacing an electrolyte membrane at a proper timing along with further degradation in the electrolyte membrane. The film forming apparatus includes a housing for containing a plating solution, the housing having an electrolyte membrane removably attached thereto; a replacement mechanism configured to replace the electrolyte membrane attached to the housing; a detecting device configured to detect a state of the electrolyte membrane or a state of the surface of the substrate after film formation; and a control device configured to control replacement of the electrolyte membrane. The control device determines whether there is degradation in the electrolyte membrane based on a result of detection by the detecting device, and if it is determined that the electrolyte membrane is degraded, causes the replacement mechanism to replace the electrolyte membrane.

Systems and methods for overcoming technical problems associated with machining and manufacturing printed circuit boards. In some embodiments, the systems and methods include a process to remove or reduce defects in initially created printed circuit board (PCB) traces. For example, a method can include a process to remove or reduce burrs of laser micromachined PCB traces (which can be electrically isolated from each other). In some cases, a material is deposited over the PCB traces, and the depositing results in a conducting layer that electrically connects all or most of the PCB traces and provides an electrical connection for removing or reducing the defects in the PCB traces.

Disclosed are an electroplating repair apparatus, an electroplating repair system having the same, and an operating system thereof. The apparatus includes a probe body extending a predefined length in a structure corresponding to an inner diameter part of a tube, an electroplating electrode attached to and surrounding an outer circumferential surface of the probe body, a sealing member attached to opposite end sides of the probe body to seal a target portion to be electroplated, and a solution supply line supplying a solution to the target portion through the inside of the probe body, wherein the apparatus has a structure capable of wholly repairing the inside of the tube including a sealing welding part and an expanded part.

A method used to repair a workpiece through a combination of laser and an electrochemical reaction is provided. A tool anode is arranged on the back side of the workpiece and is spaced therefrom. A laser beam is focused on an outer surface of the workpiece to realize localized repairing on the back side. The method realizes localized coating repairing on the back side of the workpiece through coordination between the thermal effect of the laser and the electrochemical deposition based on the characteristic of high thermal conductivity of the workpiece. The electrodeposition reaction does not occur in regions that do not need to be repaired. The operating process is simple, the cost of the plating solution is largely reduced, and the problem that the coating on the inner wall of the thin-walled workpiece is difficult to repair due to stripping is solved.

A metal article comprises an alloy substrate having a surface and a non-diffused metal monolayer disposed thereon. The surface has a first surface work function value .sub.s. The non-diffused monolayer deposited on the surface has a second surface work function value .sub.s that is less negative than the first surface work function value. A method for depositing the monolayer via underpotential deposition (UPD) is also disclosed.