Patent classifications
C25D7/04
Apparatus and method for the continuous metallization of an object
An apparatus and a method for the metallization of an object including placing the object in an electrolyte, placing an anode in contact with the electrolyte, placing a metallization contact of a cathode in contact with the object, applying an electrical tension between the anode and the cathode, wherein the metallization contact is displaced in relation to the object during the metallization of the object to achieve a complete and continuous metallization of the object's surface.
Apparatus and method for the continuous metallization of an object
An apparatus and a method for the metallization of an object including placing the object in an electrolyte, placing an anode in contact with the electrolyte, placing a metallization contact of a cathode in contact with the object, applying an electrical tension between the anode and the cathode, wherein the metallization contact is displaced in relation to the object during the metallization of the object to achieve a complete and continuous metallization of the object's surface.
Plated expanding bullet and method of manufacturing the bullet
A fully plated hollow-point bullet and a method of manufacturing the bullet wherein a malleable metal precursor core having a central cavity and a surrounding wall is divided into a series of petals, each petal being separated from one another by an air space, and all interior and exterior surfaces of the precursor core, including individual petals, are thereafter electroplated with a second metal and final formed in a hollow-point pointing die, ultimately producing a more robust bullet and one that expands easier and faster on impact than plated bullets of conventional manufacture.
Plated expanding bullet and method of manufacturing the bullet
A fully plated hollow-point bullet and a method of manufacturing the bullet wherein a malleable metal precursor core having a central cavity and a surrounding wall is divided into a series of petals, each petal being separated from one another by an air space, and all interior and exterior surfaces of the precursor core, including individual petals, are thereafter electroplated with a second metal and final formed in a hollow-point pointing die, ultimately producing a more robust bullet and one that expands easier and faster on impact than plated bullets of conventional manufacture.
PLATED EXPANDING BULLET AND METHOD OF MANUFACTURING THE BULLET
A fully plated hollow-point bullet and a method of manufacturing the bullet wherein a malleable metal precursor core having a central cavity and a surrounding wall is divided into a series of petals, each petal being separated from one another by an air space, and all interior and exterior surfaces of the precursor core, including individual petals, are thereafter electroplated with a second metal and final formed in a hollow-point pointing die, ultimately producing a more robust bullet and one that expands easier and faster on impact than plated bullets of conventional manufacture.
PLATED EXPANDING BULLET AND METHOD OF MANUFACTURING THE BULLET
A fully plated hollow-point bullet and a method of manufacturing the bullet wherein a malleable metal precursor core having a central cavity and a surrounding wall is divided into a series of petals, each petal being separated from one another by an air space, and all interior and exterior surfaces of the precursor core, including individual petals, are thereafter electroplated with a second metal and final formed in a hollow-point pointing die, ultimately producing a more robust bullet and one that expands easier and faster on impact than plated bullets of conventional manufacture.
APPARATUS AND METHOD FOR IN-SITU ELECTROSLEEVING AND IN-SITU ELECTROPOLISHING INTERNAL WALLS OF METALLIC CONDUITS
An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits are described. The apparatus and system can be employed on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. The apparatus includes components which can be independently manipulated and assembled on or near a degraded site and, after secured in place, form an electrolytic cell within the workpiece. The apparatus contains counter-electrodes which can be moved relative to the workpiece surface during the electroplating and/or electropolishing operation to provide flexibility in selecting and employing electropolishing process parameters and electroplating process parameters to design and optimize the surface roughness as well as the size, shape and properties of the electrodeposited reinforcing layer(s).
APPARATUS AND METHOD FOR IN-SITU ELECTROSLEEVING AND IN-SITU ELECTROPOLISHING INTERNAL WALLS OF METALLIC CONDUITS
An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits are described. The apparatus and system can be employed on straight tubes, tube joints to different diameter tubes or face plates, tube elbows and other complex shapes encountered in piping systems. The apparatus includes components which can be independently manipulated and assembled on or near a degraded site and, after secured in place, form an electrolytic cell within the workpiece. The apparatus contains counter-electrodes which can be moved relative to the workpiece surface during the electroplating and/or electropolishing operation to provide flexibility in selecting and employing electropolishing process parameters and electroplating process parameters to design and optimize the surface roughness as well as the size, shape and properties of the electrodeposited reinforcing layer(s).
CATHETER TIPS AND RELATED METHODS
A method of manufacturing a catheter tip by electroplating a conductive material over an insert comprising a negative to a domelike shape thereby forming a shape of the catheter tip comprising a dome with the domelike shape, selectively positioning a plurality of irrigation holes between outer and inner surfaces of the catheter tip, removing the insert thereby leaving the catheter tip and the plurality of irrigation holes, and electropolishing the catheter tip. In other examples, the insert is not removed and instead the step of electroplating causes the insert to be encapsulated with the conductive material thereby forming the catheter tip.
CATHETER TIPS AND RELATED METHODS
A method of manufacturing a catheter tip by electroplating a conductive material over an insert comprising a negative to a domelike shape thereby forming a shape of the catheter tip comprising a dome with the domelike shape, selectively positioning a plurality of irrigation holes between outer and inner surfaces of the catheter tip, removing the insert thereby leaving the catheter tip and the plurality of irrigation holes, and electropolishing the catheter tip. In other examples, the insert is not removed and instead the step of electroplating causes the insert to be encapsulated with the conductive material thereby forming the catheter tip.