According to one example, preparing a substrate for an electronic device can include forming a deposition layer on a magnesium alloy substrate, anodizing the magnesium alloy substrate, and forming an electrophoretic deposition layer on the anodized magnesium alloy substrate.

The invention relates to a heating rod for a pressurizer of a primary cooling system of a pressurized-water nuclear reactor, the rod comprising a metal outer shell (36) of longitudinally elongate shape having an external surface (62), and a heating element (40) mounted inside the shell (36). It comprises an anti-corrosion coating (60) covering at least part of the external surface (62) of the shell (36).

The invention relates to a heating rod for a pressurizer of a primary cooling system of a pressurized-water nuclear reactor, the rod comprising a metal outer shell (36) of longitudinally elongate shape having an external surface (62), and a heating element (40) mounted inside the shell (36). It comprises an anti-corrosion coating (60) covering at least part of the external surface (62) of the shell (36).

A surface treatment device utilizes an electrode device. The electrode device is provided with a closed part facing a bottom part of a bottomed hole when inserted inside the bottomed hole, and a flow through hole linking the inside and outside of the electrode device is formed in the electrode device. When surface treatment is implemented on the inner wall surface of the bottomed hole, the hollow electrode device is inserted into the inside of the bottomed hole, the electrolytic treatment solution is made to flow through the space inside the bottomed hole, and power is applied across the electrode device and the inner wall surface of the bottomed hole. The closed part faces the bottom part of the bottomed hole as an electrode across a prescribed surface area; therefore, electroplating at the bottom part of the bottomed hole proceeds to the same extent as other sites.

A surface treatment device utilizes an electrode device. The electrode device is provided with a closed part facing a bottom part of a bottomed hole when inserted inside the bottomed hole, and a flow through hole linking the inside and outside of the electrode device is formed in the electrode device. When surface treatment is implemented on the inner wall surface of the bottomed hole, the hollow electrode device is inserted into the inside of the bottomed hole, the electrolytic treatment solution is made to flow through the space inside the bottomed hole, and power is applied across the electrode device and the inner wall surface of the bottomed hole. The closed part faces the bottom part of the bottomed hole as an electrode across a prescribed surface area; therefore, electroplating at the bottom part of the bottomed hole proceeds to the same extent as other sites.

A structure of assembly grasp for palladium-alloy tubes and the manufacturing method thereof are described. The structure of assembly grasp for palladium-alloy tubes includes a grasp with a plurality of holes, a plurality of palladium-alloy tubes inserted into the plurality of holes, and an intermetallic compound layer between the palladium-alloy tubes and the inner sidewalls of the plurality of holes.

A structure of assembly grasp for palladium-alloy tubes and the manufacturing method thereof are described. The structure of assembly grasp for palladium-alloy tubes includes a grasp with a plurality of holes, a plurality of palladium-alloy tubes inserted into the plurality of holes, and an intermetallic compound layer between the palladium-alloy tubes and the inner sidewalls of the plurality of holes.

A cylinder liner for insertion into an aluminum internal-combustion engine block may include a cylindrical body of cast iron having a circumferential external surface. The cylinder liner may also have a coating deposited on and surrounding the external surface. The external surface may have a specific roughness, and the coating may include at least 98% by volume of pure nickel, and a remainder composed of impurities.

The purpose of the present invention is to provide a tool for water supply, which has luster and rarely undergoes the leaching out of nickel. A tool for water supply 100 which is provided with a nickel-plated layer 102 formed on a base material 101, wherein the nickel-plated layer 102 contains no sulfur component, the corrosion potential of the nickel-plated layer 102 in a leaching solution as measured against a saturated calomel electrode is −0.01 or more (preferably +0.04 V or more), and the Wa value of the nickel-plated layer 102 as measured using a WaveScan device manufactured by BYK is 5.1 or less.

The purpose of the present invention is to provide a tool for water supply, which has luster and rarely undergoes the leaching out of nickel. A tool for water supply 100 which is provided with a nickel-plated layer 102 formed on a base material 101, wherein the nickel-plated layer 102 contains no sulfur component, the corrosion potential of the nickel-plated layer 102 in a leaching solution as measured against a saturated calomel electrode is −0.01 or more (preferably +0.04 V or more), and the Wa value of the nickel-plated layer 102 as measured using a WaveScan device manufactured by BYK is 5.1 or less.