An electrode device is provided with a closed part facing a bottom part of a bottomed hole when inserted inside the bottomed hole, and a flow through hole linking the inside and outside of the electrode device is formed in the electrode device. When surface treatment is implemented on the inner wall surface of the bottomed hole, the hollow electrode device is inserted into the inside of the bottomed hole, the electrolytic treatment solution is made to flow through the space inside the bottomed hole, and power is applied across the electrode device and the inner wall surface of the bottomed hole. The closed part faces the bottom part of the bottomed hole as an electrode across a prescribed surface area; therefore, electroplating at the bottom part of the bottomed hole proceeds to the same extent as other sites.

An electrode device is provided with a closed part facing a bottom part of a bottomed hole when inserted inside the bottomed hole, and a flow through hole linking the inside and outside of the electrode device is formed in the electrode device. When surface treatment is implemented on the inner wall surface of the bottomed hole, the hollow electrode device is inserted into the inside of the bottomed hole, the electrolytic treatment solution is made to flow through the space inside the bottomed hole, and power is applied across the electrode device and the inner wall surface of the bottomed hole. The closed part faces the bottom part of the bottomed hole as an electrode across a prescribed surface area; therefore, electroplating at the bottom part of the bottomed hole proceeds to the same extent as other sites.

Methods and processes are described that enable the manufacture of a superior thin-walled mold from which higher-quality, less-costly disposable gloves can be more efficiently produced. The method can include creating a glove form in a sacrificial material; electroforming an electroformed master from the glove form; removing sacrificial material from the electroformed master; creating a tertiary form from the electroformed master; forming an initial copper layering on the tertiary form; and developing the initial copper layering into a thick copper plating to create a copper mold for gloves.

An electroplating apparatus is provided that minimizes unplated regions when an alloy plating layer is provided on the surface of a thread on a steel pipe. An electroplating apparatus (10) includes an electrode (1), sealing members (2, 3), and a plating-solution supply unit (4). The electrode (1) faces the thread (Tm). The sealing member (2) is positioned within the steel pipe (P1). The sealing member (3) is attached to the end portion of the steel pipe (P1) and, together with the sealing member (2), forms a receiving space (8). The plating-solution supply unit (4) includes a plurality of nozzles (42). The nozzles (42) are positioned within the receiving space (8) and adjacent one end of the thread (Tm) and arranged around the pipe axis of the steel pipe (P1). The plating-solution supply unit (4) injects a plating solution between the thread (Tm) and electrode (1) through the nozzles (42). The direction in which plating solution is injected from the nozzles (42) is inclined at an angle larger than 20 degrees and smaller than 90 degrees toward the thread (Tm) relative to a plane perpendicular to the pipe axis.

An electroplating apparatus is provided that minimizes unplated regions when an alloy plating layer is provided on the surface of a thread on a steel pipe. An electroplating apparatus (10) includes an electrode (1), sealing members (2, 3), and a plating-solution supply unit (4). The electrode (1) faces the thread (Tm). The sealing member (2) is positioned within the steel pipe (P1). The sealing member (3) is attached to the end portion of the steel pipe (P1) and, together with the sealing member (2), forms a receiving space (8). The plating-solution supply unit (4) includes a plurality of nozzles (42). The nozzles (42) are positioned within the receiving space (8) and adjacent one end of the thread (Tm) and arranged around the pipe axis of the steel pipe (P1). The plating-solution supply unit (4) injects a plating solution between the thread (Tm) and electrode (1) through the nozzles (42). The direction in which plating solution is injected from the nozzles (42) is inclined at an angle larger than 20 degrees and smaller than 90 degrees toward the thread (Tm) relative to a plane perpendicular to the pipe axis.

A pretreatment method for pretreating components, which are each formed of at least two different materials, prior to a coating process. The pretreatment method includes the steps: alkaline degreasing; chemical pickling in a first pickling medium; anodic pickling in a second pickling medium; and cathodic degreasing.

A pretreatment method for pretreating components, which are each formed of at least two different materials, prior to a coating process. The pretreatment method includes the steps: alkaline degreasing; chemical pickling in a first pickling medium; anodic pickling in a second pickling medium; and cathodic degreasing.

Provided are an implantable medical device (100) and a method for manufacturing the same, and a method for manufacturing a stent. The implantable medical device (100) comprises a metal base (110) and a cladding layer (120). The cladding layer (120) is a nickel-free and cobalt-free metal layer which is deposited on the metal base (110) by means of a metal bond. The arrangement of the cladding layer (120) of the implantable medical device (100) on the metal substrate (110) can prevent carcinogenic elements in the metal base (110) such as nickel and cobalt from dissolution. Moreover, the cladding layer (120) is a nickel-free and cobalt-free metal layer, such that the implantable medical device (100) is free from problems of nickel or cobalt dissolution, thereby improving the biological safety of the implantable medical device (100).

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.