Provided is a method for manufacturing a copper-clad laminate in which a copper foil and a resin are joined together with high heat-resistant adhesion force though a fluororesin, which is a low dielectric constant thermoplastic resin, is used. This method includes providing a surface-treated copper foil including a copper foil and a zinc-containing layer on at least one surface of the copper foil, and affixing a sheet-shaped fluororesin to the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more. When the interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by XPS, the content of Zn is 10 wt % or less, and the Zn/M weight ratio, the ratio of the content of Zn to the content of the transition element M, is 0.2 to 0.6.

Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.

Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

A corrosion-resistant terminal material for an aluminum core wire having a good adhesion of plating and a high effect of corrosion resistant, having a base material in which at least a surface is made of copper or copper alloy and a corrosion-resistant film formed on at least a part of the base material; the corrosion film having an intermediate alloy layer made of tin alloy, a zinc layer made of zinc or zinc alloy formed on the intermediate alloy layer, and a tin-zinc alloy layer made of tin alloy containing zinc and formed on the zinc layer; and a tin content in the intermediate alloy layer is 90 at % or less.

An aluminum base wire includes a core wire made of pure aluminum or an aluminum alloy and a coating layer provided on an outer periphery of the core wire. The coating layer includes a first layer provided on the outer periphery of the core wire, a second layer provided on an outer periphery of the first layer, and a third layer provided on an outer periphery of the second layer. The first layer is composed of at least one metal selected from the group consisting of nickel, a nickel alloy, copper, and a copper alloy, the second layer is composed of metals that include zinc and tin, the third layer is composed of at least one metal selected from the group consisting of tin and tin alloys that contain substantially no zinc, and a zinc content in the second layer is 15 atomic % or more and 60 atomic % or less.

An aluminum base wire includes a core wire made of pure aluminum or an aluminum alloy and a coating layer provided on an outer periphery of the core wire. The coating layer includes a first layer provided on the outer periphery of the core wire, a second layer provided on an outer periphery of the first layer, and a third layer provided on an outer periphery of the second layer. The first layer is composed of at least one metal selected from the group consisting of nickel, a nickel alloy, copper, and a copper alloy, the second layer is composed of metals that include zinc and tin, the third layer is composed of at least one metal selected from the group consisting of tin and tin alloys that contain substantially no zinc, and a zinc content in the second layer is 15 atomic % or more and 60 atomic % or less.

A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.

A method for the electrodeposition of a functional or decorative chromium layer onto a metallic substrate in an electrodeposition process from a halide-ion free and boric acid free aqueous electrolyte solution and to the coated product obtained thereby.

It is an object of the present invention to provide an electrolytic iron foil and a battery current collector in which the risk of breakage or tearing during manufacture caused by reduction in film thickness can be suppressed and which have thinness as well as strength and elongation sufficient for withstanding repeated charging and discharging in a secondary battery.

An electrolytic iron foil in which, in at least either one surface, a crystallite diameter on (110) plane of iron is equal to or more than 45 nm and the electrolytic iron foil is less than 20 μm in thickness.

An electroplating method for enhancing the performance of rolled-up passive components comprises providing an array of rolled-up passive components on a substrate, where each rolled-up passive component comprises a multilayer strip in a rolled configuration including multiple turns spaced apart by gaps. The multilayer strip comprises a conductive pattern layer on a strain-relieved layer, and a core of each rolled-up passive component is defined by a first of the multiple turns. A layer comprising a functional material is electroplated onto the conductive pattern layer of each rolled-up passive component, thereby at least partly filling the gaps and/or the core with the functional material.