The present invention provides an in-situ method for synthesizing a Ni—W—WC composite coating, which includes the following steps: immersing a carbon steel substrate to be coated in an electroplating solution and electroplating, to obtain a Ni—W—C alloy coating on the surface of the carbon steel substrate; and then subjecting the alloy coating to high temperature heat treatment to obtain the Ni—W—WC composite coating. The electroplating solution comprises the following components: a nickel salt, a tungstate, citric acid, a citrate, a recarburizer, and a wetting agent. The present invention shows merits of simple operation, high current efficiency, simple electroplating process, and is clean and causes no pollution, thus meeting the requirements of environment protection.

A nickel-coated copper foil suitable for mass production, to which YAG laser welding can be applied while reducing the electrical resistivity by forming a nickel plating layer with a thickness of 0.5 μm or less on a surface of a copper foil by Ni plating, is provided. The nickel-coated copper foil has an overall thickness of 200 μm or less, and includes a copper layer made of Cu or a Cu alloy, and a nickel plating layer made of Ni or a Ni alloy, covering a surface of the copper foil, having a thickness of 0.01 μm or more and 0.5 μm or less, and including a surface having an a* value of 0 or more and 10 or less and a b* value of 0 or more and 14 or less in an L*a*b* color system obtained by an SCI measurement method in accordance with JIS Z 8722.

A nickel-coated copper foil suitable for mass production, to which YAG laser welding can be applied while reducing the electrical resistivity by forming a nickel plating layer with a thickness of 0.5 μm or less on a surface of a copper foil by Ni plating, is provided. The nickel-coated copper foil has an overall thickness of 200 μm or less, and includes a copper layer made of Cu or a Cu alloy, and a nickel plating layer made of Ni or a Ni alloy, covering a surface of the copper foil, having a thickness of 0.01 μm or more and 0.5 μm or less, and including a surface having an a* value of 0 or more and 10 or less and a b* value of 0 or more and 14 or less in an L*a*b* color system obtained by an SCI measurement method in accordance with JIS Z 8722.

Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

A method for preparing an electrode of an inductive component, includes: S1: performing surface insulation treatment, specifically including: placing an inductive component in a tilting and rotating spraying pot, and performing thermal spraying on resin by using a fixed spray gun for surface insulation treatment; S2: exposing an inner electrode, specifically including: processing an electrode area through laser or mechanical polishing to expose the inner electrode; S3: performing surface pretreatment, specifically including: performing degreasing and surface pretreatment with ultrasound in a special solution; S4: performing surface activation treatment, specifically including: performing surface activation treatment with ultrasound in a low-concentration acid solution; S5: electroplating to form a metal layer, specifically including: electroplating to form an electroplated copper layer first, then electroplating to form an electroplated nickel layer, and finally electroplating to form an electroplated tin layer; and S6: performing surface post-treatment.

A method for preparing an electrode of an inductive component, includes: S1: performing surface insulation treatment, specifically including: placing an inductive component in a tilting and rotating spraying pot, and performing thermal spraying on resin by using a fixed spray gun for surface insulation treatment; S2: exposing an inner electrode, specifically including: processing an electrode area through laser or mechanical polishing to expose the inner electrode; S3: performing surface pretreatment, specifically including: performing degreasing and surface pretreatment with ultrasound in a special solution; S4: performing surface activation treatment, specifically including: performing surface activation treatment with ultrasound in a low-concentration acid solution; S5: electroplating to form a metal layer, specifically including: electroplating to form an electroplated copper layer first, then electroplating to form an electroplated nickel layer, and finally electroplating to form an electroplated tin layer; and S6: performing surface post-treatment.

Methods and apparatus for producing helix windings used for a transformer are provided. For example, apparatus comprise an electrically conductive mandrel comprising an elongated body, a head comprising an eyelet detail, and a winding structure disposed along the elongated body.

A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.

A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.

A surface-treated steel sheet for a battery container includes a steel sheet, an iron-nickel diffusion layer formed on the steel sheet, and a nickel layer formed on the iron-nickel diffusion layer and constituting the outermost layer. When the Fe intensity and the Ni intensity are continuously measured from the surface of the surface-treated steel sheet for a battery container along the depth direction with a high frequency glow discharge optical emission spectrometric analyzer, the thickness of the iron-nickel diffusion layer being the difference (D2−D1) between the depth (D1) at which the Fe intensity exhibits a first predetermined value and the depth (D2) at which the Ni intensity exhibits a second predetermined value is 0.04 to 0.31 μm; and the total amount of the nickel contained in the iron-nickel diffusion layer and the nickel contained in the nickel layer is 10.8 to 26.7 g/m2.