Discussed is a deposition mask including a metal plate. The metal plate includes an alloy of nickel (Ni) and iron (Fe) having a plurality of through-holes. Each of the through-holes includes a first surface hole, a second surface hole opposite to the first surface hole, and a connecting part through which the first surface hole and the second surface hole communicate with each other. The metal plate includes a first outer portion, a second outer portion opposite to the first outer portion and a central portion between the first outer portion and the second outer portion. Nickel contents of the first outer portion and the second outer portion are greater than that of the central portion.

A wire electrode for wirecut electrical discharge machining (WEDM) having a carbonaceous surface layer is disclosed. The wire electrode can include a core material, an outermost carbonization layer, and a phase transition layer between the core material and the carbonization layer.

In a method for chromium upgrading of interconnects made of ferritic steel to be used in solid oxide cell stacks, comprising the steps of shaping the interconnect, depositing a coating comprising Cr on at least one surface of the shaped interconnect and performing one or more thermal treatments at a temperature below 1000° C., the resulting Cr concentration near the surface of the interconnect is higher than the Cr concentration in the ferritic steel before shaping. Specifically, the average Cr concentration of the shaped interconnect is increased to 26 wt % Cr or higher.

A method for producing a metal porous body includes the steps of: performing electrical conduction treatment on a surface of a skeleton of a sheet-like resin porous body having the skeleton with a three-dimensional network structure, to obtain a conductive resin porous body having a conductive layer; performing electroplating treatment on a surface of a skeleton of the conductive resin porous body to obtain a plated resin porous body having a metal plating layer; and performing treatment of removing at least the resin porous body from the plated resin porous body to obtain a metal porous body. In the electroplating treatment, power is supplied to a rotation shaft of a rotating electrode roller while a contact surface of a power supply brush composed of a sintered body is brought into sliding contact with the rotation shaft, with a lubricant, not containing conductive metal powder, interposed therebetween.

The present disclosure relates to an electroplated bead wire having excellent oxidation resistance, of which oxidation resistance and aging adhesive strength with tire rubber are improved by forming a copper- and cobalt-plated layer by electroplating. The electroplated bead wire includes the plated layer formed through electroplating, wherein the plated layer contains 40 to 99 wt % of copper and 1 to 40 wt % of cobalt.

A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.

A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.

An anticorrosive and conductive substrate includes a bulk portion and a surface portion including a magnesium titanium material having a formula (I) Ti.sub.xMg.sub.1-xO.sub.y (I), where x is a number from 0 to ≤1 and y is a number from 1 to ≤2, and wherein at least about 50% of the magnesium titanium material has a cubic crystal structure, and wherein the magnesium titanium material is configured to impart anticorrosive and conductive properties to the substrate.

To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.

Systems and methods for manufacturing and processing microwires for use as microelectrodes are disclosed. The disclosed techniques provide methods for creating microelectrode bundles with different organizations and patterns. Systems and methods of the present disclosure also provide methods for electrochemically modifying bundles of microelectrode ends.