Method and apparatus for producing metal-coated optical fiber involves feeding a length of glass fiber through a first solution bath so as to plate a first predetermined metal on the glass fiber via electroless deposition. The length of glass fiber is passed continuously from the first solution bath to a second solution bath adapted to plate thereon a second predetermined metal via electrolytic plating such that the optical fiber contacts an electrode only after at least some of the second predetermined metal has been applied. The length of glass fiber may be passed continuously from the second solution bath to a third solution bath adapted to plate thereon a third predetermined metal via electrolytic plating.

An oxide superconducting wire, includes a laminate including a base material, an intermediate layer, and an oxide superconducting layer, the intermediate layer being laminated on a main surface of the base material, the intermediate layer being constituted of one or more layers having an orientation, the intermediate layer having one or more first non-orientation regions extending in a longitudinal direction of the base material, the oxide superconducting layer being laminated on the intermediate layer, the oxide superconducting layer having a crystal orientation controlled by the intermediate layer, the oxide superconducting layer having second non-orientation regions located on the first non-orientation regions, and a metal layer which covers at least a front surface and side surfaces of the oxide superconducting layer in the laminate.

The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has a plated layer in which an underlying Cu plated layer and a Sn plated layer have been laminated in this order on a surface of the base metal, and has an adhesive strength of 1 N or more as measured by a solder adhesive strength test according to the definition in the specification.

The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has an Sn plated layer on a surface of the base metal, and has an adhesive strength of 0.5 N or more as measured by a solder adhesive strength test according to the definition in the specification.

The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.

This foil for a secondary battery negative electrode collector (negative electrode-collecting foil 5b) includes a first Cu layer (51) made of Cu or a Cu-based alloy, a stainless steel layer (52), and a second Cu layer (53) made of Cu or a Cu-based alloy, which are disposed in this order, a total thickness is 200 μm or less, and 0.01% proof stress is 500 MPa or more.

An electroconductive material includes a Cu or Cu alloy base member, a Cu—Sn alloy coating layer, and a Sn coating layer. The Cu—Sn alloy coating layer has a Cu content of 20 to 70 atomic %, and an average thickness of 0.2 to 3.0 μm. The Sn coating layer has an average thickness of 0.2 to 5.0 μm. A surface of the electroconductive material has an arithmetic average roughness Ra of at least 0.15 μm in at least one direction along the surface and 3.0 μm or less in all directions along the surface. The Cu—Sn alloy coating layer is partially exposed at the surface of the electroconductive material. An area ratio of the Cu—Sn alloy coating layer exposed at the surface of the electroconductive material is 3 to 75%. An average crystal grain size on a surface of the Cu—Sn alloy coating layer is less than 2 μm.

A forming method for a heating element of an electronic cigarette and a manufacturing method for an atomization assembly are provided, the forming method comprises coiling a heating wire into a heating coil, dividing the heating coil into sections including a plurality of heating sections and connecting sections; providing a deposition preventing layer on an external surface of the heating section; electroplating the heating coil, coating outer peripheral faces of all of the connecting sections of the heating coil with coatings having an electrical resistivity lower than that of the heating wire; removing the deposition preventing layer; and cutting the heating coil electroplated. The present application makes the manufacturing process of the heating element and the atomization assembly continues automatically, the production efficiency is improved, the resistance of the heating element or atomization assembly manufactured is more stable, and the product quality is higher.

An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt.

A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.