Patent classifications
C25D9/02
COATING METHOD FOR CATIONIC ELECTRODEPOSITION COATING MATERIAL
A coating method for a cationic electrodeposition coating material includes: a step of immersing a metallic article to be coated in a first solution bath, a step of immersing the article in a second solution bath and a step of immersing the article in a third solution bath; and at least one of the three steps includes a cationic electrodeposition coating in which a current is applied. A coating film formed through the three steps contains at least: a base resin component (A), a reaction component (B) and a catalyst (C). The first solution bath, the second solution bath and the third solution bath contain the base resin component (A), the reaction component (B) and the catalyst (C) in a combination of one or two of the components.
COATING METHOD FOR CATIONIC ELECTRODEPOSITION COATING MATERIAL
A coating method for a cationic electrodeposition coating material includes: a step of immersing a metallic article to be coated in a first solution bath, a step of immersing the article in a second solution bath and a step of immersing the article in a third solution bath; and at least one of the three steps includes a cationic electrodeposition coating in which a current is applied. A coating film formed through the three steps contains at least: a base resin component (A), a reaction component (B) and a catalyst (C). The first solution bath, the second solution bath and the third solution bath contain the base resin component (A), the reaction component (B) and the catalyst (C) in a combination of one or two of the components.
Impregnation of a non-conductive material with an intrinsically conductive polymer
Composite materials are made by impregnating a non-conductive material with a conducting monomer to form a monomer-impregnated non-conductive material, and polymerizing the monomer-impregnated non-conductive material to form the composite material. The composite materials are used in medical devices and implants.
Impregnation of a non-conductive material with an intrinsically conductive polymer
Composite materials are made by impregnating a non-conductive material with a conducting monomer to form a monomer-impregnated non-conductive material, and polymerizing the monomer-impregnated non-conductive material to form the composite material. The composite materials are used in medical devices and implants.
Electrically conductive hydrogels with tunable properties
A manufacturing method includes: inducing gelation of an electrically conductive polymer to form a gel; infiltrating the gel with a solution including monomers; and polymerizing the monomers to form a secondary polymer network intermixed with the electrically conductive polymer.
Electrically conductive hydrogels with tunable properties
A manufacturing method includes: inducing gelation of an electrically conductive polymer to form a gel; infiltrating the gel with a solution including monomers; and polymerizing the monomers to form a secondary polymer network intermixed with the electrically conductive polymer.
STRONG ADHESION OF CONDUCTING POLYMERS ON DIVERSE SUBSTRATES
Adhesion of conducting polymers on diverse insulating and conductive substrates via a hydrophilic adhesion layer, where one or more functional groups may be disposed between the substrate and the hydrophilic adhesion layer. Adhesion of the conducting polymers on the substrates is such that adhesion is maintained or substantially maintained in wet physiological environments.
Formation of organic electro-grafted films on the surface of electrically conductive or semi-conductive surfaces
The invention relates to a method for grafting an organic film onto an electically conductive or semiconductive surface by electro-reduction of a solution, wherein the solution comprises one diazonium salt and one monomer bearing at least one chain polymerizable functional group. During the electrolyzing process, at least one protocole consisting of an electrical polarization of the surface by applying a variable potential over at least a range of values which are more cathodic that the reduction or peak potential of all diazonium salts in said solution is applied. The invention also relates to an electrically conducting or semiconducting surface obtained by implementing this method. The invention further relates to electrolytic compositions.
Formation of organic electro-grafted films on the surface of electrically conductive or semi-conductive surfaces
The invention relates to a method for grafting an organic film onto an electically conductive or semiconductive surface by electro-reduction of a solution, wherein the solution comprises one diazonium salt and one monomer bearing at least one chain polymerizable functional group. During the electrolyzing process, at least one protocole consisting of an electrical polarization of the surface by applying a variable potential over at least a range of values which are more cathodic that the reduction or peak potential of all diazonium salts in said solution is applied. The invention also relates to an electrically conducting or semiconducting surface obtained by implementing this method. The invention further relates to electrolytic compositions.
METHOD TO ENABLE ELECTROPLATING OF GOLDEN SILVER NANOPARTICLES
A method to enable electroplating of nano-silver like gold material ([Ag.sub.25(SR).sub.18].sup. where SR is a thiolate). The method includes activating a surface of a substrate using first counter flow conditioning rinses (CFCR) with a solution of acetone followed by a solution of alcohol; rinsing the substrate surface; drying using a nitrogen gas; cleaning using a soak-clean solution; activating using an activator solution; rinsing using an ammonia dead rinse solution; conditioning using second CFCR; etching using hydrochloric acid; rinsing third CFCR; depositing woods nickel strike material and electrolytic nickel metal; electrodeposition of a gold strike metal to the surface of the substrate; and electroplating of a nano-silver like gold material and a nano-silver like gold alloy material on to the surface of the substrate using an electroplating solution and a rate of deposition 0.0001 m/h.