The present invention relates to a plating hanger device having a shock-absorbing structure and, more specifically, to a plating hanger device having a shock-absorbing structure, the device allowing a hanger to be transferred at a uniform speed and reducing noise and shock, which are generated during transferring, so as to enable a uniform plated layer to be formed on a substrate. According to the plating hanger device having the shock-absorbing structure, of the present invention, an elastic spring is pressed by the load of the plating hanger device and a jig, and sequentially, the elastic spring presses a connection shaft and the connection shaft presses a transfer housing so as to improve adhesion between the transfer housing and a driving gear, thereby enabling transferring at uniform speed, and reducing the noise and shock generated during transferring by means of the elastic spring.

A composition for selective anodization, comprising the substances amidosulphuric acid, magnesium sulphate and concentrated sulphuric acid as a base electrolyte and additionally sodium stannate and/or molybdenum oxide. A corresponding method of selectively anodizing a substrate or workpiece includes providing a substrate having a surface which is to be selectively coated, where the substrate is arranged in a tool and forms a coating cell, selectively bathing the surface with the composition for selective anodization, and applying an electric current between substrate (anode) and tool (cathode) for selective anodization of the surface.

A support element (S) for supporting implants (I), such as dental implants, the support element comprising a bar (S1) and a plurality of pins (S5) that are fitted to the bar (S1) and that are arranged parallel to one another, each pin (S5) defining a free end that is provided with reception means (S8) that are suitable for co-operating with the implant (S) so as to hold it on the reception means (S8) of the pin (S5), the bar (S1) including at least one mounting end (S4) for mounting the bar (S1) on another support device, thereby forming a support structure; the support element being characterized in that each pin (S5) is provided with a removal system (S9) for removing the implant (S) from the reception means (S8), without coming into contact with an exposed portion of the implant (S).

Provided is a metal film forming apparatus capable of forming a uniform metal film on a surface of a substrate by uniformly pressurizing an electrolyte membrane against the surface of the substrate. The film forming apparatus includes first and second film forming units, a coupling portion that couples the first and second film forming units together, a pressure device including a pressure unit that pressurizes substrates with electrolyte membranes of the respective film forming units via the coupling portion, and a power supply unit adapted to apply a voltage across each anode and each substrate. The film forming units are coupled to the coupling portion via their respective first elastic bodies that elastically deform in the pressurization direction of the pressure unit.

Provided is a anodizing apparatus, including: a base configured to support a target product including a first bore that requires an anodizing surface treatment and a second bore that is connected to the first bore and excluded from the anodizing surface treatment; a working part configured to perform the anodizing surface treatment on the first bore; and a cover part configured to cover an outer surface of the target product, wherein the working part includes at least one electrode bar configured to access and enter the first bore, and a plurality of spray nozzles provided integrally with each of the at least one electrode bar and configured to selectively supply one of a degreasing solution, an electrolyte, and a cleaning solution to the first bore.

An electrochemical treatment system includes a treatment fluid supply manifold, a fluid return manifold, and an electrode section connected to the treatment fluid supply manifold. A plurality of treatment fluid supply ports feed fluid through or across the electrode and a plurality of fluid return ports proximate the treatment fluid supply ports are connected to the fluid return manifold. A porous pad is coupled to the electrode section for contacting a substrate to be treated and receives the treatment fluid via the plurality of treatment fluid supply ports. The plurality of fluid return ports remove spent and excess treatment fluid and gases from the substrate, the surrounding air, and the porous pad.

According to one embodiment, an anodization apparatus includes: a first process tank configured to perform an anodization process on a substrate; a holder configured to hold the substrate; and a first electrolyte supply system configured to supply a first electrolyte to the first process tank. The holder immerses the substrate in the first electrolyte in a state where the substrate is inclined with respect to a liquid level of the first electrolyte. The anodization process is executed in a state where the substrate is inclined with respect to the liquid level of the first electrolyte.

An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess.

A method including closing upper and lower ends of a bore with upper and lower closure element, respectively; introducing a cathode into the bore; and flowing an electrolyte through an annular space between a wall of the bore an outer surface of the cathode to provide an inner surface of the bore with a wear-resistant surface by electrolysis.

The present disclosure relates to an electrode for eloxing a component, in particular a component of a vehicle brake system, comprising an electrolyte inlet for feeding an electrolyte into the electrode, an inlet channel, which connects the electrolyte inlet to an electrolyte outlet opening formed in the region of an outer surface of the electrode, an electrolyte inlet opening formed in the region of the outer surface of the electrode at a distance from the electrolyte outlet opening, an electrolyte flow path, which runs between the electrolyte outlet opening and the electrolyte inlet opening along the outer surface of the electrode and is designed to bring a surface portion of the component, which surface portion is to be eloxed, into fluid contact with the electrolyte flowing through the electrolyte flow path, an outlet channel, and an electrolyte outlet.