The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate joined with an insert molding plastic part, and a protective treatment layer on the light metal substrate and the insert molding plastic part. A transparent primer coating on the protective treatment layer, and a paint coating on the transparent primer coating. A milled edge along the insert molding plastic part, wherein the milled edge cuts through the paint coating to expose the transparent primer coating.

An antimicrobial medical device that includes a substrate having a metal surface that is made from a metal or metal alloy that may include stainless steel, cobalt, and titanium. Disposed on the metal surface is a first antimicrobial oxide layer that includes an antimicrobial metal that may include silver, copper, and zinc, and combinations thereof. The atoms of antimicrobial metal in the first antimicrobial oxide layer are of a first concentration. The first antimicrobial oxide layer is positioned in a direction opposite that of the metal surface. The device further includes a second antimicrobial oxide layer that includes an antimicrobial metal that may be silver, copper, and zinc, and combinations thereof. The atoms of the antimicrobial metal present in the second antimicrobial oxide layer are of a second concentration. The first concentration and the second concentration are not equal. Methods for making the antimicrobial medical device are also disclosed.

An antimicrobial medical device that includes a substrate having a metal surface that is made from a metal or metal alloy that may include stainless steel, cobalt, and titanium. Disposed on the metal surface is a first antimicrobial oxide layer that includes an antimicrobial metal that may include silver, copper, and zinc, and combinations thereof. The atoms of antimicrobial metal in the first antimicrobial oxide layer are of a first concentration. The first antimicrobial oxide layer is positioned in a direction opposite that of the metal surface. The device further includes a second antimicrobial oxide layer that includes an antimicrobial metal that may be silver, copper, and zinc, and combinations thereof. The atoms of the antimicrobial metal present in the second antimicrobial oxide layer are of a second concentration. The first concentration and the second concentration are not equal. Methods for making the antimicrobial medical device are also disclosed.

A composition for selective anodization, comprising the substances amidosulphuric acid, magnesium sulphate and concentrated sulphuric acid as a base electrolyte and additionally sodium stannate and/or molybdenum oxide. A corresponding method of selectively anodizing a substrate or workpiece includes providing a substrate having a surface which is to be selectively coated, where the substrate is arranged in a tool and forms a coating cell, selectively bathing the surface with the composition for selective anodization, and applying an electric current between substrate (anode) and tool (cathode) for selective anodization of the surface.

A method of coating a plasma channel of a plasma source, comprises providing at least one electrolyte having one or more chelating agents therein, treating at least one surface to produce a processed surface, smoothing the surface of the processed surface with at least one post processing technique to produce at least one smoothed processed surface, and cleaning the smoothed surface.

There is provided a surface-treated steel sheet (1) comprising: a tin-plated steel sheet (10) obtained by tin-plating a steel sheet (11); a phosphate compound layer (20) containing tin phosphate formed on the tin-plated steel sheet (10); and an aluminum-oxygen compound layer (30) formed on the phosphate compound layer (20), a main constituent of the aluminum-oxygen compound layer being an aluminum-oxygen compound.

The disclosure provides for anti-scale deposition coatings for use on surface, such as on oilfield parts. The coating includes a first, sublayer of a metal, ceramic, or metal-ceramic composite, which is characterized in having a hardness in excess of 35 HRC. The coating includes a second, top layer over the first layer, that is a polymer. A surface of the first layer may be conditioned to have a roughened or patterned topology for receipt of and adherence with the at least one top layer. The first layer may provide the coating with hardness, and the at least one top layer may provide the coating with low-friction and anti-scale properties.

Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

A support element (S) for supporting implants (I), such as dental implants, the support element comprising a bar (S1) and a plurality of pins (S5) that are fitted to the bar (S1) and that are arranged parallel to one another, each pin (S5) defining a free end that is provided with reception means (S8) that are suitable for co-operating with the implant (S) so as to hold it on the reception means (S8) of the pin (S5), the bar (S1) including at least one mounting end (S4) for mounting the bar (S1) on another support device, thereby forming a support structure; the support element being characterized in that each pin (S5) is provided with a removal system (S9) for removing the implant (S) from the reception means (S8), without coming into contact with an exposed portion of the implant (S).