C25D11/38

STEEL SHEET FOR CANS AND PRODUCTION METHOD FOR STEEL SHEET FOR CANS

A steel sheet for cans has, on the surface thereof, in order from the steel sheet side, a chromium metal layer and a hydrous chromium oxide layer. The chromium metal layer is deposited in an amount of 50-200 mg/m.sup.2, and the hydrous chromium oxide layer is deposited in an amount of 3-15 mg/m.sup.2 in terms of chromium. The chromium metal layer includes: a flat chromium metal layer that has a thickness of at least 7 nm; and a granular chromium metal layer that includes granular protrusions that are formed on the surface of the flat chromium metal layer. The maximum grain size of the granular protrusions is 150 nm or smaller. The number density of the granular protrusions per unit area is 10/m.sup.2 or higher.

STEEL SHEET FOR CANS AND PRODUCTION METHOD FOR STEEL SHEET FOR CANS

A steel sheet for cans has, on the surface thereof, in order from the steel sheet side, a chromium metal layer and a hydrous chromium oxide layer. The chromium metal layer is deposited in an amount of 50-200 mg/m.sup.2, and the hydrous chromium oxide layer is deposited in an amount of 3-15 mg/m.sup.2 in terms of chromium. The chromium metal layer includes: a flat chromium metal layer that has a thickness of at least 7 nm; and a granular chromium metal layer that includes granular protrusions that are formed on the surface of the flat chromium metal layer. The maximum grain size of the granular protrusions is 150 nm or smaller. The number density of the granular protrusions per unit area is 10/m.sup.2 or higher.

STEEL SHEET FOR CANS AND PRODUCTION METHOD FOR STEEL SHEET FOR CANS

A steel sheet for cans has, on the surface thereof, in order from the steel sheet side, a chromium metal layer and a hydrous chromium oxide layer. The chromium metal layer is deposited in an amount of 65-200 mg/m.sup.2, and the hydrous chromium oxide layer is deposited in an amount of 3-15 mg/m.sup.2 in terms of chromium. The chromium metal layer includes: a flat chromium metal layer that has a thickness of at least 7 nm; and a granular chromium metal layer that includes granular protrusions that are formed on the surface of the flat chromium metal layer. The maximum grain size of the granular protrusions is 100 nm or smaller. The number density of the granular protrusions per unit area is 10/?m.sup.2 or higher.

NICKEL PLATED COATING AND METHOD OF MANUFACTURING THE SAME
20180347060 · 2018-12-06 ·

In a method of manufacturing a Ni plated coating that includes at least one Ni plated layer, an agitation intensity of a plating bath is changed while the Ni plated layer is being electrodeposited to change potential of the deposited Ni plated layer in a deposition depth direction. A Ni plated coating including a D-Ni plated layer and a B-Ni plated layer adjoining the D-Ni plated layer has, other than an interface voltage changing region at an interface between the D-Ni plated layer and the B-Ni plated layer, an in-layer voltage changing region in which, in the D-Ni plated layer or in the B-Ni plated layer, potential is changed in a deposition depth direction at an average rate of 1 mV/0.1 m or greater.

NICKEL PLATED COATING AND METHOD OF MANUFACTURING THE SAME
20180347060 · 2018-12-06 ·

In a method of manufacturing a Ni plated coating that includes at least one Ni plated layer, an agitation intensity of a plating bath is changed while the Ni plated layer is being electrodeposited to change potential of the deposited Ni plated layer in a deposition depth direction. A Ni plated coating including a D-Ni plated layer and a B-Ni plated layer adjoining the D-Ni plated layer has, other than an interface voltage changing region at an interface between the D-Ni plated layer and the B-Ni plated layer, an in-layer voltage changing region in which, in the D-Ni plated layer or in the B-Ni plated layer, potential is changed in a deposition depth direction at an average rate of 1 mV/0.1 m or greater.

Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device
20180288881 · 2018-10-04 ·

The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed.

The surface treated copper foil comprises a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein an aspect ratio of roughening particles of the roughening treatment layer satisfies one or more of the following items (1) and (2), the aspect ratio being a height of the roughening particles/a thickness of the roughening particles: (1) the aspect ratio of the roughening particles is 3 or less, (2) the aspect ratio of the roughening particles satisfies any one of the following items (2-1) or (2-2): (2-1) the aspect ratio of the roughening particles is 10 or less in the case that the height of the roughening particles is more than 500 nm and 1000 nm or less, (2-2) the aspect ratio of the roughening particles is 15 or less in the case that the height of the roughening particles is 500 nm or less; and a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

Ferritic Stainless Steel Used for Bipolar Plates of Fuel Cells, Controlling Method of Surface Roughness, Method of Forming Passivation Films, and Use
20240301539 · 2024-09-12 ·

Provided are a ferritic stainless steel used for bipolar plates of fuel cells, a controlling method of surface roughness, a method of forming passivation films, and use. The ferritic stainless steel comprises C of less than or equal to 0.03 wt. %, N of less than or equal to 0.02 wt. %, Si of less than or equal to 0.4 wt. %, Mn of less than or equal to 0.5 wt. %, Cr of 16-23 wt. %, Cu of 0-2.0 wt. %, Mo of 1.8-2.5 wt. %, Ni of 0.2-2.0 wt. %, Ti of 0.1-0.5 wt. %, Nb of 0.005-0.5 wt. %, P of less than or equal to 0.02 wt. %, S of less than or equal to 0.02 wt. %, and a remainder composed of Fe and other unavoidable accompanying elements, and the ferritic stainless steel has a grain size number of 4-9. The ferritic stainless steel has excellent corrosion resistance and electrical conductivity, and good elongation and deformation as well, exhibiting both economy and cost advantages.

STAINLESS STEEL FOIL

The present invention provide a ferritic stainless steel foil having a high thickness precision even with a thickness 60 m or less ultrathin stainless steel foil and simultaneously having a plastic deformation ability and good elongation at break, that is, having a good press-formability (deep drawing ability).

The present invention is a stainless steel foil having a thickness of 5 m to 60 m, wherein a recrystallization ratio of said stainless steel foil is 90% to 100%, a surface layer of said stainless steel foil has a nitrogen concentration of 1.0 mass % or less, three or more crystal grains are contained in the thickness direction of said stainless steel foil, an average crystal grain diameter d of said crystal grains is 1 m to 10 m, and, when said thickness is t (m), an area ratio of crystal grains having a crystal grain diameter of t/3 (m) or more is 20% or less.

STAINLESS STEEL FOIL

The present invention provide a ferritic stainless steel foil having a high thickness precision even with a thickness 60 m or less ultrathin stainless steel foil and simultaneously having a plastic deformation ability and good elongation at break, that is, having a good press-formability (deep drawing ability).

The present invention is a stainless steel foil having a thickness of 5 m to 60 m, wherein a recrystallization ratio of said stainless steel foil is 90% to 100%, a surface layer of said stainless steel foil has a nitrogen concentration of 1.0 mass % or less, three or more crystal grains are contained in the thickness direction of said stainless steel foil, an average crystal grain diameter d of said crystal grains is 1 m to 10 m, and, when said thickness is t (m), an area ratio of crystal grains having a crystal grain diameter of t/3 (m) or more is 20% or less.

Electrolytic copper foil, negative electrode for lithium ion secondary battery, and lithium ion secondary battery

Provided are an electrodeposited copper foil, a negative electrode that is for a lithium ion secondary battery, and a lithium ion secondary battery into which the electrode is incorporated. The electrodeposited copper foil exhibits good electrical conductivity and superior tensile strength, with no significant decline in tensile strength exhibited even after one hour of heating at 300 C. The negative electrode has heightened cycle properties due to the use of the electrodeposited copper foil as a current collector. Using x-ray diffraction, in the electrodeposited copper foil, in normal conditions, the diffraction intensity (I)<220> in the <220> orientation, the diffraction intensity (I)<200> in the <200> orientation, and the diffraction intensity (I)<111> in the <111> orientation, satisfy the following formula (1):
I<220>/{I<220>+I<200>+I<111>}>0.13(1).