A coating method for a clad steel in which stainless sheets are combined on adjacent surfaces of an aluminum sheet may include preparing the clad steel, preparing a coating solution in which an epoxy resin and titanium dioxide (TiO.sub.2) powder are combined in an acrylic resin, etching the clad steel to improve adhesion property between the coating solution and the clad steel, heating the clad steel, and performing electrodeposition by immersing the clad steel in the coating solution.

The present invention relates to aqueous binder dispersions for cationic electrocoat materials, comprising as binders amine-modified, hydroxy-functional epoxy resins and comprising as crosslinker at least one fully blocked polyisocyanate blocked at least partly with 2,2-dimethyl-1,3-dioxolane-4-methanol, and also to the use of such cationic electrocoat materials for producing coating systems and to the use of crosslinkers based on polyisocyanates blocked with 2,2-dimethyl-1,3-dioxolane-4-methanol in aqueous binder dispersions.

The invention is directed to a metal core substrate having high thermal conductivity and high electrical insulating properties; an electrophoretic deposition fluid for use in fabrication of the metal core substrate; and a method for fabricating the metal core substrate. The electrophoretic deposition fluid is used during electrophoretic deposition, and contains ceramic particles for coating a metal substrate, and an organopolysiloxane composition which binds the ceramic particles.

A steel alloy workpiece and a method for making a press-hardened steel (PHS) component using the steel alloy workpiece is provided. The steel alloy workpiece includes between about 1.0 and 5.0 weight percent chromium, between about 0.5 and 2.0 weight percent silicon, and a surface having a predetermined imprinted pattern. The imprinted pattern includes one of a plurality of overlapping nested sinusoidal waves and a honey-comb pattern, and ascribes a surface roughness of between about 1.0 microns and 2.5 microns. The method includes providing the steel alloy workpiece, heating the workpieces at a predetermined time and temperature, hot stamping the workpieces into the PHS component, quenching the PHS component at a predetermined quench rate, and e-coating the PHS component. The e-coating is applied directly onto the surface of the PHS component.

The present disclosure relates generally to coating medical devices. In particular, the present disclosure provides materials and methods for coating a portion of a balloon catheter with a pharmaceutical agent using electrodeposition techniques. Although angioplasty and stenting can be effective methods for treating vascular occlusions, restenosis remains a pervasiveness problem. Therefore, coating portions of a balloon catheter with a pharmaceutical agent that inhibits restenosis can reduce the likelihood of restenosis.

The present disclosure relates generally to coating medical devices. In particular, the present disclosure provides materials and methods for coating a portion of a balloon catheter with a pharmaceutical agent using electrodeposition techniques. Although angioplasty and stenting can be effective methods for treating vascular occlusions, restenosis remains a pervasiveness problem. Therefore, coating portions of a balloon catheter with a pharmaceutical agent that inhibits restenosis can reduce the likelihood of restenosis.

The present invention is directed to a particle having a chemical conversion coating on at least a portion of the particle surface. The present invention is further directed to a coated substrate comprising: (a) a surface that has been contacted with a particle having a chemical conversion coating on at least a portion of the particle surface such that at least some portion of the substrate becomes treated with the conversion coating.

In various aspects, the processes disclosed herein may include the steps of inducing an electric field about a non-conductive substrate, and depositing functionalized nanoparticles upon the non conductive substrate by contacting a nanoparticle dispersion with the non-conductive substrate, the nanoparticle dispersion comprising functionalized nanoparticles having an electrical charge, the electric field drawing the functionalized nanoparticles to the non-conductive substrate. In various aspects, the related composition of matter disclosed herein comprise functionalized nanoparticles bonded to a surface of a non-conductive fiber, the surface of the non-conductive fiber comprising a sizing adhered to the surface of the non-conductive fiber. This Abstract is presented to meet requirements of 37 C.F.R. §1.72(b) only. This Abstract is not intended to identify key elements of the processes, and related apparatus and compositions of matter disclosed herein or to delineate the scope thereof.

In various aspects, the processes disclosed herein may include the steps of inducing an electric field about a non-conductive substrate, and depositing functionalized nanoparticles upon the non conductive substrate by contacting a nanoparticle dispersion with the non-conductive substrate, the nanoparticle dispersion comprising functionalized nanoparticles having an electrical charge, the electric field drawing the functionalized nanoparticles to the non-conductive substrate. In various aspects, the related composition of matter disclosed herein comprise functionalized nanoparticles bonded to a surface of a non-conductive fiber, the surface of the non-conductive fiber comprising a sizing adhered to the surface of the non-conductive fiber. This Abstract is presented to meet requirements of 37 C.F.R. §1.72(b) only. This Abstract is not intended to identify key elements of the processes, and related apparatus and compositions of matter disclosed herein or to delineate the scope thereof.

A method of producing an optoelectronic semiconductor component includes providing a semiconductor body; applying a photoconductive layer on a radiation exit surface of the semiconductor body, wherein the semiconductor body emits electromagnetic radiation during operation; exposing at least one sub-region of the photoconductive layer with electromagnetic radiation generated by the semiconductor body; and depositing a conversion layer on the sub-region of the photoconductive layer by an electrophoresis process.