Described herein is an aqueous coating composition (A) for at least partly coating an electrically conductive substrate with an electrocoat material, including (A1) at least one cathodically depositable resin binder, (A2) at least one crosslinking agent, (A3) at least 100 ppm of bismuth, based on the total weight of the coating composition (A), and (A4) lithium, in a form dissolved in (A), the lithium not exceeding a fraction of 300 ppm, based on the total weight of the coating composition (A). Also described herein are a method for producing (A), a coating method, and an at least partly coated substrate obtainable by the method.

An exemplary system for controlling electrodeposition coating for electrochemically forming a coating film on a coating object in an electrodeposition tank storing electrodeposition solution includes, a positive electrode configured to apply a positive electrode voltage to a positive electrode disposed in the electrodeposition tank, a negative electrode configured to apply a negative electrode voltage to the coating object transferred by a hanger, and an electrodeposition controller configured to electrochemically deposit the coating film on an external surface and an internal surface of the coating object by applying the positive electrode voltage to the positive electrode and the negative electrode voltage to the negative electrode, where the electrodeposition controller may be configured to control voltage, current, and pulse in multi-stages over time from a dip-in time point to a draw-out time point of the coating object into and from the electrodeposition tank.

The present disclosure involves a method for partial gold plating of a metal packaging housing and a packaging housing thereof. The packaging housing may include a base. The base may be provided with at least one lead hole. A housing lead may be interspersed in the lead hole. The lead hole may be also provided with an insulator surrounding the housing lead. The method may include operations such as nickel plating, oxidation, gold plating, reduction, etc.

The present disclosure involves a method for partial gold plating of a metal packaging housing and a packaging housing thereof. The packaging housing may include a base. The base may be provided with at least one lead hole. A housing lead may be interspersed in the lead hole. The lead hole may be also provided with an insulator surrounding the housing lead. The method may include operations such as nickel plating, oxidation, gold plating, reduction, etc.

A variety of homogeneous or layered hybrid nanostructures are fabricated by electric field-directed assembly of nanoelements. The nanoelements and the fabricated nanostructures can be conducting, semi-conducting, or insulating, or any combination thereof. Factors for enhancing the assembly process are identified, including optimization of the electric field and combined dielectrophoretic and electrophoretic forces to drive assembly. The fabrication methods are rapid and scalable. The resulting nanostructures have electrical and optical properties that render them highly useful in nanoscale electronics, optics, and biosensors.

A variety of homogeneous or layered hybrid nanostructures are fabricated by electric field-directed assembly of nanoelements. The nanoelements and the fabricated nanostructures can be conducting, semi-conducting, or insulating, or any combination thereof. Factors for enhancing the assembly process are identified, including optimization of the electric field and combined dielectrophoretic and electrophoretic forces to drive assembly. The fabrication methods are rapid and scalable. The resulting nanostructures have electrical and optical properties that render them highly useful in nanoscale electronics, optics, and biosensors.

The present invention is directed to devices and methods for assembling particulates through the use of non-contact electrokinetic forces applied to polymeric, organic, non-organic, and metallic micro- and nano-particulates in an aqueous solution. The present invention features an electrode comprising a conductive substrate with a layer of photosensitive polymer disposed on it with a plurality of windows etched into the layer. The plurality of windows expose certain portions of the conductive substrate. Applying electric signals to the conductive substrate (e.g. by a function generator) causes materials to attract to only the exposed portions of the conductive substrate. The materials may comprise a plurality of organic, non-organic, and metallic micro- and nano-particulates disposed in an aqueous solution.

The invention relates to an installation for impregnating powder on at least one substrate to be treated of the yarn and/or tape type. The installation includes a powder delivery unit, a unit supplying the substrate to be treated, at least two electrodes and a circulation zone for the powder and the substrate to be treated. The installation also includes a containment unit having an inlet orifice for the substrate to be treated and the powder, an outlet orifice for the impregnated substrate and a contour area closed from the inlet orifice to the outlet orifice. The circulation zone is formed by the internal volume of the containment unit, and the confinement unit is fixed with respect to at least one of the electrodes. The substrate to be treated and the powder are mobile, in the circulation zone, between the inlet orifice and the outlet orifice of said confinement unit.

The invention relates to an installation for impregnating powder on at least one substrate to be treated of the yarn and/or tape type. The installation includes a powder delivery unit, a unit supplying the substrate to be treated, at least two electrodes and a circulation zone for the powder and the substrate to be treated. The installation also includes a containment unit having an inlet orifice for the substrate to be treated and the powder, an outlet orifice for the impregnated substrate and a contour area closed from the inlet orifice to the outlet orifice. The circulation zone is formed by the internal volume of the containment unit, and the confinement unit is fixed with respect to at least one of the electrodes. The substrate to be treated and the powder are mobile, in the circulation zone, between the inlet orifice and the outlet orifice of said confinement unit.

A method is disclosed for treating an anodized metal surface. According to the method, polynuclear clusters comprising aluminum oxide hydroxide are applied to the anodized metal surface.