The present disclosure relates to an integrally formed product including a metal and a fiber of biological origin disposed in dispersed state in the metal. A proportion by mass of the fiber of biological origin contained in the integrally formed product is within a range of 0.02 mass % or more and 10 mass % or less.

A plating is formed on one side of a cathode by applying a paste composed of particles mixed with a plating liquid to one side of the cathode, disposing a liquid holding member impregnated with the plating liquid on one side of an anode, opposing the cathode and the anode face, and then bringing the liquid holding member and the paste into contact with each other, and applying a voltage between the cathode and the anode.

A plating is formed on one side of a cathode by applying a paste composed of particles mixed with a plating liquid to one side of the cathode, disposing a liquid holding member impregnated with the plating liquid on one side of an anode, opposing the cathode and the anode face, and then bringing the liquid holding member and the paste into contact with each other, and applying a voltage between the cathode and the anode.

A method for making contact wires for sliprings comprising the steps of: coating and/or plating a wire with a first metal of the group of nickel, chrome or a combination thereof; coating and/or plating the wire with a second metal of the group of gold, silver, or a combination thereof; delivering laser radiation and generating an interference pattern of the laser radiation to the surface of the wire; heating the surface selectively as defined by the interference pattern, modifying of the crystal structure and/or providing protrusions and/or recesses due to melting and/or evaporation of the surface material.

An electrodeposition process for electrodeposition of a metal on a metal part (1), includes the connection of the metal part (1) to be treated to a first electrical pole of a current generator and a second pole opposite the first pole connected to the electrolytic medium through an electrode (3), and includes relative movement of the metal part (1) in relation to a set of free solid particles (4) that retain a conductive solution. The solution includes metal cations of the metal to be deposited charged with a positive electrical charge in a non-conductive environment (5) that causes the reduction of the metal cations of the conductive solution on the surface of the metal part to be treated (1). An electrolytic medium for electrodeposition of a metal on a metal part (1) is also provided.

An electrolytic processing jig configured to perform an electrolytic processing on a processing target substrate by using a processing liquid supplied to the processing target substrate includes a base body having a flat plate shape; and a direct electrode provided on a front surface of the base body and configured to be brought into contact with the processing liquid to apply a voltage between the processing target substrate and the direct electrode. An irregularity pattern is formed on a front surface of the electrolytic processing jig at a processing target substrate side.

A metal wire containing tungsten is provided. A tungsten content of the metal wire is at least 90 wt %. A tensile strength of the metal wire is at least 4000 MPa. An elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa. A diameter of the metal wire is at most 60 m. An average crystal grain size of the metal wire in a cross-section orthogonal to an axis of the metal wire is at most 0.20 m.

A metal wire containing tungsten is provided. A tungsten content of the metal wire is at least 90 wt %. A tensile strength of the metal wire is at least 4000 MPa. An elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa. A diameter of the metal wire is at most 60 m. An average crystal grain size of the metal wire in a cross-section orthogonal to an axis of the metal wire is at most 0.20 m.

A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.

An article is disclosed that includes a first substrate of a first metal or metal alloy. An aluminum alloy first layer on a surface of the first substrate includes is galvanically less noble than the first metal or metal alloy. The first layer can also include elements alloyed with or in solid solution with the aluminum alloy, or can include a two or more phase composition including a first phase of aluminum and a second phase of a solid lubricant.