A roll to roll fabrication apparatus includes an injection plate for injecting a chemical treatment liquid on a film transferred from a supplying roll to a collecting roll; and liquid blocking rolls disposed between the supplying roll and the collecting roll, and configured to prevent the chemical treatment liquid injected from the injection plate from being introduced to another process region.

An electroplating apparatus is provided that minimizes unplated regions when an alloy plating layer is provided on the surface of a thread on a steel pipe. An electroplating apparatus (10) includes an electrode (1), sealing members (2, 3), and a plating-solution supply unit (4). The electrode (1) faces the thread (Tm). The sealing member (2) is positioned within the steel pipe (P1). The sealing member (3) is attached to the end portion of the steel pipe (P1) and, together with the sealing member (2), forms a receiving space (8). The plating-solution supply unit (4) includes a plurality of nozzles (42). The nozzles (42) are positioned within the receiving space (8) and adjacent one end of the thread (Tm) and arranged around the pipe axis of the steel pipe (P1). The plating-solution supply unit (4) injects a plating solution between the thread (Tm) and electrode (1) through the nozzles (42). The direction in which plating solution is injected from the nozzles (42) is inclined at an angle larger than 20 degrees and smaller than 90 degrees toward the thread (Tm) relative to a plane perpendicular to the pipe axis.

To provide a plating apparatus that prevents or reduces a diversion of an electric field. According to one embodiment, a plating apparatus for performing a plating process on a substrate held onto a substrate holder is provided. The plating apparatus includes a plating tank configured to receive the substrate holder holding the substrate, a block member that extends to an inside of the plating tank from a wall surface of the inside of the plating tank, and is movable inside the plating tank, and a moving mechanism configured to move the block member toward the substrate holder disposed inside the plating tank.

Method and plant for continuous chrome plating of metal bars, tubular elements and similar, wherein the bar to be chromed is made move forward fastly in a device of chrome plating without of tank of chrome plating including a plurality of anodic cells of chrome plating with tubular-torx shape, into which an electrolytic solution flows with high density of current, for forming on the bar a multi-layer chromium plating while the bar moves forward through the anodes-cells themselves, and wherein the device is characterized in feeding the electrolytic solution with a flow axially distributed and with a circulation of the electrolyte in a turbulent flow, controlled through the anode of chrome plating, said plant including furthermore many cooling stations of the bar by a jet of liquid with cryoscopic thermal step, the sealing of the bath is guaranteed by gaskets in plastic material which are reinforced by armonic steel springs.

In a film forming method, in a state where a metal solution is sealed in a first accommodation chamber of a housing with a solid electrolyte membrane and a fluid is sealed in a second accommodation chamber of a placing table with a thin film, a substrate is placed on the placing table and the placing table and the housing are moved relative to each other to cause the substrate to be interposed between the solid electrolyte membrane and the thin film, the solid electrolyte membrane and the thin film are pressed against the substrate interposed therebetween to cause the solid electrolyte membrane and the thin film to conform to a surface and a rear surface of the substrate, thereby forming a metal film.

A semiconductor device includes a device layer having a semiconductor element and a wiring layer, a first structure, a second structure at an outer periphery of the first structure and having a thickness smaller than that of the first structure, and a conductive layer that covers the first structure and the second structure. The first structure comprises a first substrate having the device layer formed on a first surface thereof and a through hole formed through a second surface thereof that is opposite to the first surface to reach the device layer, and an inner portion of a second substrate facing the first surface and bonded to the first surface by a first adhesive layer.

A substrate holder prevents a substrate to be bent or damaged owing to inward declining of a seal lip. The substrate holder with an opening includes a seal, and a seal support which has a seal support surface, and is formed on an outer circumference of the opening. The seal includes a seal body and a seal lip. At least a part of the seal support surface has an inclination angle that allows an inner end of the seal support surface to approach the plane on which the substrate is to be positioned. The inner end of the seal support surface is positioned on an inner side than the seal lip.

An inspection apparatus, a plating apparatus, and an appearance inspection apparatus that are capable of automatically inspecting a substrate holder are provided. An inspection apparatus that includes an electric contact configured to contact a substrate to allow current flow to the substrate and a sealing member configured to seal a surface of the substrate and that inspects a substrate holder holding the substrate is provided. The inspection apparatus includes a stocker installation part in which a stocker configured to house the substrate holder is installed, a cleaning device configured to cleanse the substrate holder, a substrate attaching/detaching device configured to open and close the substrate holder, an appearance inspection apparatus configured to acquire image data or shape data of appearance of at least one of the sealing member and the electric contact, and a conveyer configured to convey the substrate holder among the stocker, the cleaning device, and the appearance inspection apparatus.

A substrate holder is provided. The substrate holder comprises a first holding member having a support surface supporting a substrate; and a second holding member sandwiching and holding the substrate together with the first holding member. The first holding member comprises a first contact point located along a periphery of the support surface. The second holding member comprises a second contact point configured to contact with the substrate placed on the support surface. The first contact point has a flat plate shape. The second contact point comprises a first end portion contacting with the substrate; and a second end portion contacting with the first contact point. The second end portion is configured to elastically contact with the first contact point when the substrate is held between the first holding member and the second holding member.

An apparatus for electroplating a semiconductor wafer includes an insert member configured to circumscribe a processing region. The insert member has a top surface. A portion of the top surface of the insert member has an upward slope that slopes upward from a peripheral area of the top surface of the insert member toward the processing region. The apparatus also includes a seal member having an annular-disk shape. The seal member is positioned on the top surface of the insert member. The seal member is flexible such that an outer radial portion of the seal member conforms to the upward slope of the top surface of the insert member and such that an inner radial portion of the seal member projects inward toward the processing region.