Provided herein are tubular articles comprising electrodeposited nano- or microlaminate coatings, which have improved heat, wear, and corrosion resistance. The present disclosure further provides apparatuses, systems, and methods for the electrodeposition of such coatings on tubular workpieces using fixed or dynamic electrical contact points.

A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.

A plating apparatus 1000 includes a plating tank, a substrate holder 20, a rotation mechanism, an elevating mechanism, a contact member 40, and a cleaning device 50 configured to clean the contact member 40. The cleaning device 50 includes a pivot shaft 51, a first arm 53, a second arm 54, and a nozzle 55 that includes at least one discharge port. Applying a cleaning fluid discharged from the discharge port to the contact member 40 cleans the contact member 40.

Provided are a conductive plating apparatus, a plating system and a plating method for a conductive film. The conductive plating apparatus is configured to electrically connect the conductive film with a power supply. A first conductive structure includes a first conductive roller and a first press roller. A second conductive structure includes a second conductive roller and a second press roller. The first and second conductive structures are configured to allow the conductive film to sequentially pass between the first conductive roller and the first press roller and between the second the conductive roller and the second press roller. The first and second press rollers are configured to be brought into contact with and apply pressures to two opposite surfaces of the conductive film, respectively, and to be equipotential. The second press roller and the first conductive roller are configured to be equipotential.

A system for electroplating a web of conductive material with a source material comprises a transport mechanism, an electrical contact, a plating bath, and at least one nozzle. The transport mechanism transports the web through the system. The electrical contact electrically engages the web to cause current to flow into the web. The plating bath contains a volume of an electrically conductive liquid contain ions of the source material. The nozzle is configured to flow a low electrical conductivity fluid onto the web. A portion of the web is immersed in the electrically conductive liquid. The current flowing in the web causes the ions of the source material in the electrically conductive liquid to attach to a surface of the portion of the web.

Systems and methods for automated electroplating are disclosed. An electroplating system includes a first chamber configured to receive one or more parts. The first chamber includes a vessel extending from a first end to a second end, a first cap proximate to the first end a first cathode contact coupled to the first end, a second cathode contact coupled to the second end, and a plurality of anodes formed on an inner surface of the vessel. The electroplating system further includes at least one reservoir and a first conduit and a second conduit each coupled between the at least one reservoir and the first chamber. The first conduit may be configured to transfer fluid from the first reservoir to the first chamber and the second conduit may be configured to transfer fluid from the first chamber to the at least one reservoir.

A method of the present disclosure includes: plating a plurality of substrates using a substrate holder; determining a total number of substrates that have been plated using the substrate holder until a failure occurs in the substrate holder; determining a first processable number and a second processable number; generating a first data set constituted by a combination of first condition data and the first processable number, the first condition data representing a state of a component of the substrate holder; generating a second data set constituted by a combination of second condition data and the second processable number, the second condition data representing a state of a component of the substrate holder; and optimizing a parameter of a prediction model constituted by a neural network using training data including the first data set and the second data set.

The present invention discloses a device and method for preventing copper plating of a conductor roll in the technical field of manufacturing of copper electroplating films. A conductor roll and an electroplating anode are respectively connected to the negative output end and the positive output end of a first power source, the conductor roll and the electroplating anode electroplate a plating product flowing through plating pool bath after being electrified, and the conductor roll is connected to the positive output end of a second power source and mated with an auxiliary electrode connected to the negative output end of the second power source to realize the electrolysis of the conductor roll so that the conductor roll avoids copper deposition when electroplating the plating product. The present invention can realize the electrolysis of bath near the conductor roll on the premise of completing electroplating by the conductor roll so that the copper electroplating process and the copper electrolyzing process are balanced on the conductor roll to avoid residual copper on the conductor roll so as to improve the copper plating quality of the plating product, and the present invention does not increase the procedure of the electroplating process or affect the implementation of the electroplating process.

Provided is a metal film forming apparatus capable of forming a uniform metal film on a surface of a substrate by uniformly pressurizing an electrolyte membrane against the surface of the substrate. The film forming apparatus includes first and second film forming units, a coupling portion that couples the first and second film forming units together, a pressure device including a pressure unit that pressurizes substrates with electrolyte membranes of the respective film forming units via the coupling portion, and a power supply unit adapted to apply a voltage across each anode and each substrate. The film forming units are coupled to the coupling portion via their respective first elastic bodies that elastically deform in the pressurization direction of the pressure unit.

A coating device for coating components, in particular for nickel-plating spark plug housings. The coating device includes: a housing having an outer anode that is designed to receive the component, an inner anode that can be introduced into a through-opening of the component, and a voltage-generating device, the voltage-generating device being designed to generate a first voltage between the outer anode and the component, as well as a second voltage between the inner anode and the component. The housing has an inlet and an outlet for introducing and discharging a process medium into or out of the housing.