Provided are an anode holder capable of reducing consumption of an additive in a plating apparatus, and a plating apparatus. An anode holder for holding an anode for use in a plating apparatus is provided, and the anode holder includes an inner space formed in the anode holder, to house the anode, a mask including a plurality of holes, and configured to cover a front surface of the inner space, and a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers the front surface of the inner space.

The embodiments herein relate to apparatuses and methods for electroplating one or more materials onto a substrate. Embodiments herein utilize a cross flow conduit in the electroplating cell to divert flow of fluid from a region between a substrate and a channeled ionically resistive plate positioned near the substrate down to a level lower than level of fluid in a fluid containment unit for collecting overflow fluid from the plating system for recirculation. The cross flow conduit can include channels cut into components of the plating cell to allow diverted flow, or can include an attachable diversion device mountable to an existing plating cell to divert flow downwards to the fluid containment unit. Embodiments also include a flow restrictor which may be a plate or a pressure relief valve for modulating flow of fluid in the cross flow conduit during plating.

A plating membrane includes a support structure extending radially outward from a nozzle that is to direct a flow of a plating solution toward a wafer. The plating membrane also includes a frame, supported by the support structure, having an inner wall that is angled outward from the nozzle. The outward angle of the inner wall relative to the nozzle directs a flow of plating solution from the nozzle in a manner that increases uniformity of the flow of the plating solution toward the wafer, reduces the amount of plating solution that is redirected inward toward the center of the plating membrane, reduces plating material voids in trenches of the wafer (e.g., high aspect ratio trenches), and/or the like.

A plating apparatus that allows shielding a specific portion of a substrate at a desired timing is achieved. The plating apparatus includes a plating tank 410 for housing a plating solution, an anode 430 arranged in the plating tank 410, a substrate holder 440 for holding a substrate Wf with a surface to be plated facing downward, a rotation mechanism 447 for rotating the substrate holder 440, and a shielding mechanism 460 moving a shielding member 482 between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.

An electroplating device includes a conduit extending from a first end to a second end. The conduit is configured to house an object for electroplating. A first set of apertures is formed on a surface of the conduit. Each of the first set of apertures has a first size. A second set of apertures is formed on the surface of the conduit adjacent the first set of apertures. Each of the second set of apertures has a second size. The first set of apertures are configured to be in alignment with a first continuous section of the object and transfer fluid to the first continuous section of the object at a first rate. The second set of apertures are configured to be in alignment with a second continuous section of the object and transfer fluid to the second continuous section of the object at a second rate.

There is provided a shielding plate that adjusts an electric potential distribution on a substrate near the substrate. According to one embodiment, there is provided a plating apparatus for performing a plating process on the substrate. The plating apparatus includes a substrate holder, the shielding plate, and a moving mechanism. The substrate holder holds the substrate. The shielding plate is disposed adjacent to the substrate holder. The moving mechanism moves the shielding plate in a direction of approaching the substrate holder and a direction away from the substrate holder. The shielding plate is moved to the substrate holder by the moving mechanism to be contactable with the substrate holder.

A method of manufacturing an electronic device housing includes obtaining a monolithic body of RF transparent material and plating a surface of the monolithic body with a nanograin coating to increase the structural rigidity of the monolithic body. A portion of the nanograin coating is thereafter removed to create an RF window.

To partially or locally control a plating film thickness on a polygonal substrate. There is provided a regulation plate for adjusting a current between an anode and the polygonal substrate. This regulation plate includes a main body that has an edge forming a polygonal opening through which the current passes and an attachable/detachable shielding member to shield at least a part of the polygonal opening.

A plating apparatus including a plating bath, a substrate holder to be arranged in the plating bath and adapted to hold a substrate, an anode for generating an electric field between the substrate and the anode, and at least one electric field shielding body for shielding the substrate holder and a part or the whole of the electric field, wherein the electric field shielding body has an opening portion for allowing the electric field between the substrate and the anode to pass therethrough, and is configured so as to be capable of adjusting an opening size in a first direction of the opening portion and an opening size in a second direction of the opening portion independently of each other.

An anode assembly allowing the anode to be easily pulled up from a plating tank is disclosed. The anode assembly includes: an anode structure; and an anode holder. The anode structure includes: an anode; and a feeding member. The anode holder includes: an anode support frame having a space in which the anode structure is arranged; a conductive bar; and a feeding electrode attached to an end of the conductive bar. One end of the feeding member is fixed to the anode, and the other end of the feeding member is detachably fixed to the conductive bar. The anode support frame has a positioning guide portion into which a lower end of the anode structure is inserted. The anode assembly is configured to allow the anode structure to be separated from the anode holder and pulled up from the plating tank when the feeding member is detached from the conductive bar.