A semiconductor apparatus and methods of processing a semiconductor workpiece are provided. The semiconductor apparatus for pre-wetting a semiconductor workpiece includes a process chamber, a workpiece holder disposed within the process chamber to hold the semiconductor workpiece, a pre-wetting fluid tank disposed outside the process chamber and containing a pre-wetting fluid, and a conduit coupled to the pre-wetting fluid tank and extending into the process chamber. The conduit delivers the pre-wetting fluid from the pre-wetting fluid tank out through an outlet of the conduit to wet a major surface of the semiconductor workpiece comprising a plurality of recess portions.

A semiconductor apparatus and methods of processing a semiconductor workpiece are provided. The semiconductor apparatus for pre-wetting a semiconductor workpiece includes a process chamber, a workpiece holder disposed within the process chamber to hold the semiconductor workpiece, a pre-wetting fluid tank disposed outside the process chamber and containing a pre-wetting fluid, and a conduit coupled to the pre-wetting fluid tank and extending into the process chamber. The conduit delivers the pre-wetting fluid from the pre-wetting fluid tank out through an outlet of the conduit to wet a major surface of the semiconductor workpiece comprising a plurality of recess portions.

An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.

An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.

According to one embodiment, an anodization apparatus includes: a first process tank configured to perform an anodization process on a substrate; a holder configured to hold the substrate; and a first electrolyte supply system configured to supply a first electrolyte to the first process tank. The holder immerses the substrate in the first electrolyte in a state where the substrate is inclined with respect to a liquid level of the first electrolyte. The anodization process is executed in a state where the substrate is inclined with respect to the liquid level of the first electrolyte.

According to one embodiment, an anodization apparatus includes: a first process tank configured to perform an anodization process on a substrate; a holder configured to hold the substrate; and a first electrolyte supply system configured to supply a first electrolyte to the first process tank. The holder immerses the substrate in the first electrolyte in a state where the substrate is inclined with respect to a liquid level of the first electrolyte. The anodization process is executed in a state where the substrate is inclined with respect to the liquid level of the first electrolyte.

Provided is a technique that allows suppressing a liquid splash of a plating solution. A plating apparatus includes a plating tank 10 including an inner tank 11, a substrate holder, and a paddle 50 configured to agitate the plating solution accumulated in the inner tank 11 by reciprocating in a horizontal direction. The paddle 50 is arranged to be inserted through a hole provided in an outer peripheral wall of the inner tank and to build a bridge between an inside of the inner tank and an outside of the inner tank, and the paddle 50 includes a first portion 51 configured to agitate the plating solution accumulated in the inner tank, a second portion 53 arranged outside the inner tank and disposed above the first portion, and a connecting portion 52 arranged outside the inner tank to connect the first portion to the second portion.

Provided is a technique that allows suppressing a liquid splash of a plating solution. A plating apparatus includes a plating tank 10 including an inner tank 11, a substrate holder, and a paddle 50 configured to agitate the plating solution accumulated in the inner tank 11 by reciprocating in a horizontal direction. The paddle 50 is arranged to be inserted through a hole provided in an outer peripheral wall of the inner tank and to build a bridge between an inside of the inner tank and an outside of the inner tank, and the paddle 50 includes a first portion 51 configured to agitate the plating solution accumulated in the inner tank, a second portion 53 arranged outside the inner tank and disposed above the first portion, and a connecting portion 52 arranged outside the inner tank to connect the first portion to the second portion.

Systems for masking and sealing a component for surface treatment. A system includes a pair of fixture plates disposed on opposite ends of the component from each other. One or more inner sleeves are inserted into the component to mask and seal at least a portion of the component. An outer sleeve extends between the fixture plates to seal outside of the component. A pair of fixture rods extend between the first and second fixture plates and couple the first and second fixture plates together. The system is configured to effect surface treatment of an exposed area of the component, at least a portion of the exposed area defined by and disposed adjacent to the one or more inner sleeves.

The present disclosure relates to a filling device and apparatus, an electrochemical deposition system, and a filling method. The filling device includes: a feeding structure including a first feed port and a first discharge port; a container including a second feed port and a second discharge port; a weighing means disposed on the container; a conveying structure disposed between the first discharge port and the second feed port, the second feed port being in communication with the first discharge port via the conveying structure, and the conveying structure being configured to convey a material output from the first discharge port to the second feed port; and a control structure connected to the weighing means and the conveying structure, respectively, and configured to control a conveying speed of the conveying structure according to the weight detected by the weighing means.