C25D17/02

PLATING DEVICE

A belt conveyer 7 includes a metal belt-shaped conveyer main body 9 and a metal clip 8 held on the conveyer main body 9, and clamps an end part on one side of a work 14 by the spring force of the metal clip 8. A roller conveyer 6 includes multiple conveying rollers 10 that rotate in synch with the belt conveyer 7 and supports the work 14 from below where an end part on the other side of the work 14 clamped by the belt conveyer 7 is placed on the plurality of conveying rollers. The work 14 is conveyed in a horizontal position and is subjected to plating, with the end part on the one side of the work 14 clamped by the belt conveyer 7 and end part on the other side of the work 14 placed on the roller conveyer 6.

PLATING DEVICE

A belt conveyer 7 includes a metal belt-shaped conveyer main body 9 and a metal clip 8 held on the conveyer main body 9, and clamps an end part on one side of a work 14 by the spring force of the metal clip 8. A roller conveyer 6 includes multiple conveying rollers 10 that rotate in synch with the belt conveyer 7 and supports the work 14 from below where an end part on the other side of the work 14 clamped by the belt conveyer 7 is placed on the plurality of conveying rollers. The work 14 is conveyed in a horizontal position and is subjected to plating, with the end part on the one side of the work 14 clamped by the belt conveyer 7 and end part on the other side of the work 14 placed on the roller conveyer 6.

Electroforming system and method

An electroforming system and method for electroforming a component includes an electroforming reservoir with a housing defining a fluid passage. An electroforming chamber can be located within the housing and fluidly coupled to the fluid passage via a set of apertures in at least one wall of the electroforming chamber.

Electroforming system and method

An electroforming system and method for electroforming a component includes an electroforming reservoir with a housing defining a fluid passage. An electroforming chamber can be located within the housing and fluidly coupled to the fluid passage via a set of apertures in at least one wall of the electroforming chamber.

Method and device for the galvanic application of a surface coating
11136685 · 2021-10-05 · ·

A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component. Before the galvanic application of the surface coating, a layer of a compound that can be oxidized by an electrolyte solution that is used, preferably a polyhydroxy compound with a viscosity of at least 1000 mPas at 25° C., is applied to the body. A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component, wherein the surface coating is carried out in a closed reactor in an at least two-stage, preferably three-stage process, is also disclosed. An electrolyte solution contained in the reactor at a temperature T1 for carrying out a subsequent process stage is substituted by an electrolyte solution at a temperature T2≠T1. A device for carrying out this method is also disclosed.

Method and device for the galvanic application of a surface coating
11136685 · 2021-10-05 · ·

A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component. Before the galvanic application of the surface coating, a layer of a compound that can be oxidized by an electrolyte solution that is used, preferably a polyhydroxy compound with a viscosity of at least 1000 mPas at 25° C., is applied to the body. A method for galvanic application of a surface coating, in particular a chromium coating, to a body, for example a machine component, wherein the surface coating is carried out in a closed reactor in an at least two-stage, preferably three-stage process, is also disclosed. An electrolyte solution contained in the reactor at a temperature T1 for carrying out a subsequent process stage is substituted by an electrolyte solution at a temperature T2≠T1. A device for carrying out this method is also disclosed.

Method for mounting oxygen-consuming electrodes in electrochemical cells and electrochemical cells

Method for the gastight and liquid-tight installation of oxygen consuming electrodes in an electrolysis apparatus, and electrolysis apparatus for use in chloralkali electrolysis, in which particular regions are covered with an additional film having a composition comparable to the oxygen-consuming electrodes.

ELECTRODE FOR AN ELOXAL PROCESS
20210277535 · 2021-09-09 · ·

The present disclosure relates to an electrode for eloxing a component, in particular a component of a vehicle brake system, comprising an electrolyte inlet for feeding an electrolyte into the electrode, an inlet channel, which connects the electrolyte inlet to an electrolyte outlet opening formed in the region of an outer surface of the electrode, an electrolyte inlet opening formed in the region of the outer surface of the electrode at a distance from the electrolyte outlet opening, an electrolyte flow path, which runs between the electrolyte outlet opening and the electrolyte inlet opening along the outer surface of the electrode and is designed to bring a surface portion of the component, which surface portion is to be eloxed, into fluid contact with the electrolyte flowing through the electrolyte flow path, an outlet channel, and an electrolyte outlet.

PLATING APPARATUS AND PLATING SYSTEM

There is provided a plating apparatus capable of suitably measuring a micro-throwing power. A first plating apparatus (1A) includes: a first anode (12A) disposed in a first plating bathtub (11A); an insulating substrate (4) having a hole (5) and disposed in the first plating bathtub (11A); a pair of first cathodes (13AX, 13AY), each cathode being provided in the insulating substrate (4) at a bottom portion of the hole (5) and at a surface on an opening side of the hole (5); a first plating power source (14A) configured to supply an electric current between the first anode (12) and the pair of first cathodes (13AX, 13AY); and a first electric current measuring circuit (22A) configured to measure respective values of electric currents flowing through the pair of first cathodes (13AX, 13AY).

PLATING APPARATUS AND PLATING SYSTEM

There is provided a plating apparatus capable of suitably measuring a micro-throwing power. A first plating apparatus (1A) includes: a first anode (12A) disposed in a first plating bathtub (11A); an insulating substrate (4) having a hole (5) and disposed in the first plating bathtub (11A); a pair of first cathodes (13AX, 13AY), each cathode being provided in the insulating substrate (4) at a bottom portion of the hole (5) and at a surface on an opening side of the hole (5); a first plating power source (14A) configured to supply an electric current between the first anode (12) and the pair of first cathodes (13AX, 13AY); and a first electric current measuring circuit (22A) configured to measure respective values of electric currents flowing through the pair of first cathodes (13AX, 13AY).