A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

A portable electroplating system with components integrated into a complete system, rather than separated and disjointed. A single electroplating system can be self-contained to include all necessary rectifiers, tanks, cleaning functionalities, and other helpful or necessary items. By using smaller components than conventional electroplating systems, the system can allow for more economical use of chemicals, solutions, and energy and can be utilized more efficiently towards a unique shape or size of object to be plated. The system can also include wheels to make the system portable. A rack management system can be employed to move objects from one location to another within the system.

A portable electroplating system with components integrated into a complete system, rather than separated and disjointed. A single electroplating system can be self-contained to include all necessary rectifiers, tanks, cleaning functionalities, and other helpful or necessary items. By using smaller components than conventional electroplating systems, the system can allow for more economical use of chemicals, solutions, and energy and can be utilized more efficiently towards a unique shape or size of object to be plated. The system can also include wheels to make the system portable. A rack management system can be employed to move objects from one location to another within the system.

Provided is a method for forming a metal film using a solid-state electrolyte membrane, and the method allows a metal film having a smooth surface to be formed and an additive to sufficiently serve its function. A method for forming a metal film includes the successive steps of (a) supplying a solution to a solution-housing space, the solution containing ions of the metal and an additive; (b) increasing a pressure of the solution in the solution-housing space in a state where the solution-housing space is uncommunicated with a solution tank and the substrate held by a holder is in contact with the solid-state electrolyte membrane; (c) decreasing the pressure of the solution in the solution-housing space; and (d) forming the film of the metal on the substrate by applying a voltage between an anode and the substrate while the solution is circulated between the solution-housing space and the solution tank.

A system for controlling an electrochemical production process includes a variable controllable power circuit and an electrolytic cell. The cell includes two electrodes and operates in different states dependent on the potential difference across the electrodes. The system includes a power circuit controller that causes the power circuit to apply a given potential difference across the electrodes to initiate operation of the cell in the one of multiple possible states associated with the given potential difference. The possible states include a production state associated with a first non-zero potential difference in which a product of interest is produced, and an idle state associated with a second non-zero potential difference in which the product of interest is not produced. A monitoring and control subsystem maintains a predefined set of production process conditions, including a predefined operating temperature range, while the cell operates in both the production state and the idle state.

The present invention provided an optimized method for an insoluble anode acid sulfate copper electroplating process, comprising following steps: providing an insoluble anode made of coated titanium in the form of a mesh or a perforated plate; providing at least one liquid outlet pipe/port on the side of the insoluble anode away from the cathode, to generate a liquid flow of an electroplating solution by overflow and/or power driven suction at the liquid outlet pipe/port; initiating an electroplating process by switching on an electroplating power supply, while the electroplating solution flows away due to the overflow and/or power driven suction at the liquid outlet pipe/port, the electroplating solution in the electroplating cell forms a liquid flow towards the liquid outlet pipe/port, and accordingly, adding electroplating solution to the electroplating cell to maintain the liquid volume in the cell until the electroplating process is completed and the electroplated cathode is removed.

Provided is a technique that allows measuring a film thickness of a substrate in a plating process. A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.

Provided is a technique that allows measuring a film thickness of a substrate in a plating process. A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.

A surface treatment device includes at least one paddle in a plate shape, in a surface treatment tank, for stirring a surface treatment solution near a substrate by reciprocally moving the paddle with respect to the substrate. The paddle is configured by integrally forming multiple square bars provided in a depth direction or a horizontal direction of the surface treatment solution at regular intervals along the substrate. A liquid draining member for draining a liquid is arranged in at least one side of an end of the paddle.