Patent classifications
C25D17/02
Device intended for implementing an anodization treatment and anodization treatment
A device for performing anodizing treatment on a part, the device including a treatment chamber including a part for anodizing together with a counter-electrode situated facing the part to be treated, the part to be treated constituting a first wall of the treatment chamber; a generator, a first terminal of the generator being electrically connected to the part to be treated and a second terminal of the generator being electrically connected to the counter-electrode; and a system for storing and circulating an electrolyte, the system including a storage vessel, different from the treatment chamber, for containing the electrolyte; and a circuit for circulating the electrolyte in order to enable the electrolyte to flow between the storage vessel and the treatment chamber.
Providing Traffic Warnings to a User Based on Return Journey
Systems and methods for generating return journey notifications include obtaining a request for navigational directions to a target destination. An outbound journey route from an initial location to the target destination can be determined, wherein the outbound journey route includes an estimated outbound journey time. A return journey route from the target destination to a return destination can be determined, wherein the return journey route includes an estimated return journey time. The outbound journey route and/or return journey route can be determined at least in part from one or more of current traffic conditions or historical traffic conditions. One or more notifications regarding the return journey route can be generated when comparing the estimated outbound journey time to the estimated return journey time results in a determination that one or more predetermined criteria are met.
WAVE ABSORBING MEMBER ATTACHABLE TO PADDLE AND PLATING APPARATUS INCLUDING WAVE ABSORBING MEMBER
To prevent turbulence on a surface of a plating solution as much as possible and suppress spattering and splashing of the plating solution even when the plating solution is stirred. Provided is a wave absorbing member that is attachable to a paddle moveable in a horizontal direction to stir liquid. The wave absorbing member includes a thin plate shaped body portion configured to move on a liquid surface when moving in the horizontal direction and a front end portion designed to be tapered toward an end from the body portion.
WAVE ABSORBING MEMBER ATTACHABLE TO PADDLE AND PLATING APPARATUS INCLUDING WAVE ABSORBING MEMBER
To prevent turbulence on a surface of a plating solution as much as possible and suppress spattering and splashing of the plating solution even when the plating solution is stirred. Provided is a wave absorbing member that is attachable to a paddle moveable in a horizontal direction to stir liquid. The wave absorbing member includes a thin plate shaped body portion configured to move on a liquid surface when moving in the horizontal direction and a front end portion designed to be tapered toward an end from the body portion.
PORTABLE AND MODULAR PRODUCTION ELECTROPLATING SYSTEM
A portable electroplating system with components integrated into a complete system, rather than separated and disjointed. A single electroplating system can be self-contained to include all necessary rectifiers, tanks, cleaning functionalities, and other helpful or necessary items. By using smaller components than conventional electroplating systems, the system can allow for more economical use of chemicals, solutions, and energy and can be utilized more efficiently towards a unique shape or size of object to be plated. The system can also include wheels to make the system portable. A rack management system can be employed to move objects from one location to another within the system.
PORTABLE AND MODULAR PRODUCTION ELECTROPLATING SYSTEM
A portable electroplating system with components integrated into a complete system, rather than separated and disjointed. A single electroplating system can be self-contained to include all necessary rectifiers, tanks, cleaning functionalities, and other helpful or necessary items. By using smaller components than conventional electroplating systems, the system can allow for more economical use of chemicals, solutions, and energy and can be utilized more efficiently towards a unique shape or size of object to be plated. The system can also include wheels to make the system portable. A rack management system can be employed to move objects from one location to another within the system.
PLATING APPARATUS AND SUBSTRATE CLEANING METHOD
A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.
PLATING APPARATUS AND SUBSTRATE CLEANING METHOD
A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.
System and process for producing lithium
A decoupled plating system is provided for producing lithium. In a general embodiment, the present disclosure provides a feed tank configured to supply a lithium-rich aqueous electrolyte stream, a plating tank that is configured to receive an organic electrolyte and plate out lithium metal from that organic electrolyte, and one or more lithium replenishment cells configured to receive both electrolytes, keep them separated, and selectively move lithium ions from the aqueous electrolyte into the spent organic electrolyte stream. The present system and process can advantageously reduce operating costs and/or improve energy efficiency in production of lithium metal and associated products.
System and process for producing lithium
A decoupled plating system is provided for producing lithium. In a general embodiment, the present disclosure provides a feed tank configured to supply a lithium-rich aqueous electrolyte stream, a plating tank that is configured to receive an organic electrolyte and plate out lithium metal from that organic electrolyte, and one or more lithium replenishment cells configured to receive both electrolytes, keep them separated, and selectively move lithium ions from the aqueous electrolyte into the spent organic electrolyte stream. The present system and process can advantageously reduce operating costs and/or improve energy efficiency in production of lithium metal and associated products.