Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed gas solvents. Unlike conventional electrolytes, disclosed electrolytes are based on compressed gas solvents mixed with various salts, referred to as compressed gas electrolytes. Various embodiments of a compressed gas solvent includes a material that is in a gas phase and has a vapor pressure above an atmospheric pressure at a room temperature. The disclosed compressed gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high pressure solvent properties. Examples of a class of compressed gases that can be used as solvent for electrolytes include hydrofluorocarbons, in particular fluoromethane, difluoromethane, tetrafluoroethane, pentafluoroethane. Also disclosed are battery and supercapacitor structures that use compressed gas solvent-based electrolytes, techniques for constructing such energy storage devices. Techniques for electroplating difficult-to-deposit materials using compressed gas electrolytes as an electroplating bath are also disclosed.

Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed gas solvents. Unlike conventional electrolytes, disclosed electrolytes are based on compressed gas solvents mixed with various salts, referred to as compressed gas electrolytes. Various embodiments of a compressed gas solvent includes a material that is in a gas phase and has a vapor pressure above an atmospheric pressure at a room temperature. The disclosed compressed gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high pressure solvent properties. Examples of a class of compressed gases that can be used as solvent for electrolytes include hydrofluorocarbons, in particular fluoromethane, difluoromethane, tetrafluoroethane, pentafluoroethane. Also disclosed are battery and supercapacitor structures that use compressed gas solvent-based electrolytes, techniques for constructing such energy storage devices. Techniques for electroplating difficult-to-deposit materials using compressed gas electrolytes as an electroplating bath are also disclosed.

The invention relates to a system for the local surface treatment of an aeronautical part (1) to be treated.

Said system is characterised in that it comprises a plurality of containers (18, 19, 20, 21) each comprising a treatment product (22, 23, 24, 25), at least one bath enclosure (102a, 102b) suitable for delimiting a fluid-tight space (26a, 26b) between this bath enclosure (102a, 102b) and a portion (101a, 101b) of the part to be treated, and a controlled circuit (10) for supplying said fluid-tight space (26a, 26b) with treatment product (22, 23, 24, 25) the containers (18, 19, 20, 21) connecting at least this container (18, 19, 20, 21) to said fluid-tight space (26a, 26b) and comprising valves for managing the supply to the fluid-tight space by one or more containers from the plurality of containers.

An electrodepositing apparatus is provided comprising an inner tank (1) filled with an electrodepositing solution, an outer tank (3), a feedback means (4), a rectifying member (5) disposed in the inner tank (1), a means (8) for holding an article (p), a counter electrode (6), and a power supply (9). The electrodepositing solution is circulated in such a way that it overflows the inner tank and is fed back from the outer tank to the inner tank by the feedback means, the flow of the solution is rectified by the rectifying member to keep flat the solution surface in the inner tank, a selected portion of the article is immersed in the solution, and the coating agent is electrodeposited on the selected portion of the article.

An electrodepositing apparatus is provided comprising an inner tank (1) filled with an electrodepositing solution, an outer tank (3), a feedback means (4), a rectifying member (5) disposed in the inner tank (1), a means (8) for holding an article (p), a counter electrode (6), and a power supply (9). The electrodepositing solution is circulated in such a way that it overflows the inner tank and is fed back from the outer tank to the inner tank by the feedback means, the flow of the solution is rectified by the rectifying member to keep flat the solution surface in the inner tank, a selected portion of the article is immersed in the solution, and the coating agent is electrodeposited on the selected portion of the article.

Providing a holding device which can hold a plurality of types of workpieces and can reliably prevent a liquid in a liquid tank from leaking. The holding device includes a holding member configured to hold an article (workpiece) to be plated in a holding chamber. The article is disposed over a liquid tank in which a plating solution (liquid) flows and the holding chamber communicating with the liquid tank. The holding member has a plurality of abutting parts which closely abut against portions of an outer periphery of the article at a same level thereby to hold the article therebetween. The abutting parts are formed of a sponge sheet (elastic body) with chemical resistance. The holding device includes a pressurizing unit configured to supply air into the holding chamber to pressurize an atmosphere in the holding chamber while the article is held by the holding member.

Providing a holding device which can hold a plurality of types of workpieces and can reliably prevent a liquid in a liquid tank from leaking. The holding device includes a holding member configured to hold an article (workpiece) to be plated in a holding chamber. The article is disposed over a liquid tank in which a plating solution (liquid) flows and the holding chamber communicating with the liquid tank. The holding member has a plurality of abutting parts which closely abut against portions of an outer periphery of the article at a same level thereby to hold the article therebetween. The abutting parts are formed of a sponge sheet (elastic body) with chemical resistance. The holding device includes a pressurizing unit configured to supply air into the holding chamber to pressurize an atmosphere in the holding chamber while the article is held by the holding member.

An electroplating system includes an enclosure with an interior, an anode lead extending through the enclosure and into the interior, and a porous body. The porous body is supported within the interior of the enclosure for coupling an electroplating solution within the interior with a workpiece. A conduit extends through the enclosure and into the interior of the enclosure to provide a flow of nitrogen enriched air to the interior of enclosure for drying and removing oxygen from the electroplating solution.

An electroplating system includes an enclosure with an interior, an anode lead extending through the enclosure and into the interior, and a porous body. The porous body is supported within the interior of the enclosure for coupling an electroplating solution within the interior with a workpiece. A conduit extends through the enclosure and into the interior of the enclosure to provide a flow of nitrogen enriched air to the interior of enclosure for drying and removing oxygen from the electroplating solution.

According to the invention a method of removing electrolyte from an electrochemical deposition or polishing chamber comprising the steps of: providing an electrochemical deposition or polishing chamber comprising a support for a substrate, the support having an in-use position; a housing having an interior surface and a fluid outlet pathway for removing electrolyte from the chamber, wherein the fluid outlet pathway includes one or more slots which extend into the housing from at least one slotted opening formed in the interior surface; a seal for sealing the housing to a peripheral portion of a surface of a substrate position on the support in its in-use position; and a tilting mechanism for tilting the chamber in order to assist in removing electrolyte from the housing through the fluid outlet pathway; using an electrolyte to perform an electrochemical deposition or polishing processing on a substrate positioned on the support in its in-use position; and tilting the chamber using the tilting mechanism in order to assist in removing electrolyte from the housing through the fluid outlet pathway.