The invention relates to a novel reactor design, wherein the pressurized chamber contains both a high-temperature electrolysis (HTE) reactor with elementary electrolysis cell stacking for producing either hydrogen or a synthesis gas (syngas for a H.sub.2+CO mixture) from water vapor H.sub.2O and carbon dioxide CO.sub.2, and at least one catalyst arranged at a distance and downstream of the outlet of the electrolyzer for converting the previously produced synthesis gas into the desired combustible gas, by means of heterogeneous catalysis, the synthesis gas having being produced either directly from the electrolysis reactor or indirectly by mixing the hydrogen produced with carbon dioxide CO.sub.2 injected into the chamber.

A surface treating apparatus that suppresses occurrence of defects is provided. A treatment solution is accumulated in a tank 15 through a treatment solution collecting port/air discharging port 13 in a lower portion of a bath 4. An air heated by the treatment solution flows toward an upper portion (portion without the treatment solution) of the tank 15 via the treatment solution collecting port/air discharging port 13 in the lower portion of the bath 4, and is discharged via an exhaust duct 17. In this way, the air that is heated and tends to flow upward in the bath 4 is discharged from the lower portion thereof and is replaced with an external air from the upper portion thereof. Accordingly, the air in the bath 4 can be maintained at a uniform temperature. Thus, the treatment solution that reaches a lower portion of a substrate 54 from an upper portion thereof can be maintained at a uniform temperature. The air is caused to flow toward the lower portion from the upper portion in the bath 4, so that the substrate 54 is pulled downward, and swinging of the substrate 54 can thus be reduced. Therefore, the substrate 54 can be less likely to contact an inlet 44 and an outlet 46.

An apparatus and a method suited for metal plating aircraft engine components that allows the creation a local environment for plating by covering a localized area to be plated so that the localized area to be plated is sealed from remaining parts of the component, thereby eliminating the need for masking remaining parts of the component prior to plating.

An electroplating apparatus applies an electroplated coating to a female thread formed on a pipe end portion of a steel pipe. The apparatus includes an inner seal member, a capsule, a discharge outlet, an opening, a cylindrical insoluble anode, a plating solution supply tube, and a plurality of nozzles. The seal member divides the interior of the steel pipe at a location longitudinally inward of a region on which the female thread is formed. The capsule is attached to the pipe end portion. The outlet is designed to discharge a plating solution inside the capsule therefrom. The opening facilitates discharge of the solution inside the capsule. The anode is disposed in the inside of the pipe end portion. The supply tube projects from an end of the anode. The nozzles eject a plating solution between the outer surface of the anode and the inner surface of the pipe end portion.

An electroplating apparatus applies an electroplated coating to a female thread formed on a pipe end portion of a steel pipe. The apparatus includes an inner seal member, a capsule, a discharge outlet, an opening, a cylindrical insoluble anode, a plating solution supply tube, and a plurality of nozzles. The seal member divides the interior of the steel pipe at a location longitudinally inward of a region on which the female thread is formed. The capsule is attached to the pipe end portion. The outlet is designed to discharge a plating solution inside the capsule therefrom. The opening facilitates discharge of the solution inside the capsule. The anode is disposed in the inside of the pipe end portion. The supply tube projects from an end of the anode. The nozzles eject a plating solution between the outer surface of the anode and the inner surface of the pipe end portion.

Among other things, one or more systems and techniques for promoting metal plating uniformity are provided. An insulator plate is positioned relative to a semiconductor wafer that is to be electroplated with metal during a metal plating process. The insulator plate comprises an insulator ring that provides a resistance to electrical plating current passing through the insulator ring to the semiconductor wafer. The insulator plate comprises one or more porous regions, such as holes, that introduce little to no additional resistance to electrical plating current passing through such porous regions to the semiconductor wafer. The insulator plate influences electrical plating current so that edge plating current has a current value similar to a center plating current. The similarity in plating current promotes metal plating uniformity for the semiconductor wafer.

Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate.

Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate.

This invention relates to apparatus for electrochemical deposition onto the surface of a substrate. The apparatus includes an anode electrode 13 a support 12 for supporting the substrate 11 with its one surface 21 exposed at a location, the support 12 and the anode electrode 13 being relatively movable to alter the gap between the anode 13 and the location to define a chamber 23 between them and an electrical power source 18 with an ohmic contact to the seed layer 20 for creating a potential difference across the gap. The apparatus further includes a seal 14 for sealing with the seed layer 20 to define the fluid chamber 23; and the fluid inlet 16 and a fluid outlet 17 to the chamber 13.

This invention relates to apparatus for electrochemical deposition onto the surface of a substrate. The apparatus includes an anode electrode 13 a support 12 for supporting the substrate 11 with its one surface 21 exposed at a location, the support 12 and the anode electrode 13 being relatively movable to alter the gap between the anode 13 and the location to define a chamber 23 between them and an electrical power source 18 with an ohmic contact to the seed layer 20 for creating a potential difference across the gap. The apparatus further includes a seal 14 for sealing with the seed layer 20 to define the fluid chamber 23; and the fluid inlet 16 and a fluid outlet 17 to the chamber 13.