The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the second current being transverse to the first current, and the second current inducing a relativistic charge across the first electrode.

The present embodiments are directed to systems and methods for plating of work rolls. In one embodiment, a system includes an inner tank having an inner diameter dimensioned to receive a work roll, and an outer tank, wherein the inner tank is disposed coaxially within the outer tank. The inner tank and the outer tank may each include cylindrical shapes. A temperature regulating tank, positioned outside of the outer tank, may be in fluid communication with an annular space between the inner and outer tanks. An exhaust hood having a generally ring-shaped profile including a plurality of slots formed therein may suction fumes from the inner tank. An anode configuration also is disclosed, having a shunt incorporated into the anode, wherein current going to the anode passes through the shunt.

The present embodiments are directed to systems and methods for plating of work rolls. In one embodiment, a system includes an inner tank having an inner diameter dimensioned to receive a work roll, and an outer tank, wherein the inner tank is disposed coaxially within the outer tank. The inner tank and the outer tank may each include cylindrical shapes. A temperature regulating tank, positioned outside of the outer tank, may be in fluid communication with an annular space between the inner and outer tanks. An exhaust hood having a generally ring-shaped profile including a plurality of slots formed therein may suction fumes from the inner tank. An anode configuration also is disclosed, having a shunt incorporated into the anode, wherein current going to the anode passes through the shunt.

The invention provides a system for electrolytic treatment of vertically oriented substrates. The system may include an elongated bath for electrolytic liquid, a conveyor for conveying substrates to be treated electrolytically, vertically oriented and suspended from the conveyor, in a transport direction according to a horizontal transport path through an electrolytic liquid in the bath, the conveyor being arranged for clamping the substrates near a top thereof during conveyance of the substrates through the electrolytic liquid in the bath. The system may further include a number of flow devices each with at least one discharge orifice in the bath, the discharge orifices being directed in a discharge direction that extends opposite to the transport direction for creating a flow of electrolytic liquid, with a flow direction that is opposite to the transport direction, in the electrolytic liquid along at least one longitudinal side of substrates suspended from the conveyor.

The invention provides a system for electrolytic treatment of vertically oriented substrates. The system may include an elongated bath for electrolytic liquid, a conveyor for conveying substrates to be treated electrolytically, vertically oriented and suspended from the conveyor, in a transport direction according to a horizontal transport path through an electrolytic liquid in the bath, the conveyor being arranged for clamping the substrates near a top thereof during conveyance of the substrates through the electrolytic liquid in the bath. The system may further include a number of flow devices each with at least one discharge orifice in the bath, the discharge orifices being directed in a discharge direction that extends opposite to the transport direction for creating a flow of electrolytic liquid, with a flow direction that is opposite to the transport direction, in the electrolytic liquid along at least one longitudinal side of substrates suspended from the conveyor.

There is provided a powder supply apparatus that prevents powder from scattering as much as possible. There is provided the powder supply apparatus that supplies a powder containing a metal used for a plating to a plating solution. This powder supply apparatus includes a plating solution tank, a feed pipe, a gas supply line, and a spiral-air-flow-generating component. The plating solution tank is configured to house the plating solution. The feed pipe is configured to feed the powder into the plating solution tank. The gas supply line is configured to supply a gas. The spiral-air-flow-generating component is configured to receive the gas from the gas supply line to generate a spiral air flow heading toward the plating solution tank inside the feed pipe.

There is provided a powder supply apparatus that prevents powder from scattering as much as possible. There is provided the powder supply apparatus that supplies a powder containing a metal used for a plating to a plating solution. This powder supply apparatus includes a plating solution tank, a feed pipe, a gas supply line, and a spiral-air-flow-generating component. The plating solution tank is configured to house the plating solution. The feed pipe is configured to feed the powder into the plating solution tank. The gas supply line is configured to supply a gas. The spiral-air-flow-generating component is configured to receive the gas from the gas supply line to generate a spiral air flow heading toward the plating solution tank inside the feed pipe.

An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.

An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.

A semiconductor manufacturing apparatus including: a first device; a first calculation circuit that calculates one or more feature quantities of the first device from detected physical quantities; and a failure prediction circuit that determines a portion of model data with a minimum deviation between the measured feature quantities vector comprising the measured one or more feature quantities and a feature quantities vector comprising one or more feature quantities at each time in the plurality of pieces of model data, and calculates a predicted time until failure from a difference between the failure time point in the determined piece of model data and a point in time in the determined piece of model data at which the deviation between the measured feature quantities vector and the feature quantities vector at each time of the plurality of portions of model data is the minimum; and stops the receiving of a new substrate to prevent an introduction of defects on the new substrate.