An electroplating device includes a process chamber, a substrate holding device, a first cover body, a second cover body, a gas supply part and an exhaust part. The electroplating solution is contained in the inner chamber of the process chamber and the inner chamber has an opening. The substrate holding device is used for holding a substrate, and the substrate holding device is moved into or out of the inner chamber through the opening. The first cover body is connected to the substrate holding device to close the opening after the substrate holding device is moved into the inner chamber, so that the inner chamber is in a closed state. The second cover body is used for closing the opening after the substrate holding device is moved out of the inner chamber, so that the inner chamber is in the closed state again.

An electroplating device includes a process chamber, a substrate holding device, a first cover body, a second cover body, a gas supply part and an exhaust part. The electroplating solution is contained in the inner chamber of the process chamber and the inner chamber has an opening. The substrate holding device is used for holding a substrate, and the substrate holding device is moved into or out of the inner chamber through the opening. The first cover body is connected to the substrate holding device to close the opening after the substrate holding device is moved into the inner chamber, so that the inner chamber is in a closed state. The second cover body is used for closing the opening after the substrate holding device is moved out of the inner chamber, so that the inner chamber is in the closed state again.

A plating method capable of saving a substrate in an event of a failure of a transporter, a plating tank, or other component when the substrate is being plated is disclosed. The plating method includes: transporting a plurality of substrates to a plurality of plating tanks, respectively, with a transporter; immersing the plurality of substrates in a plating solution held in the plurality of plating tanks to plate the plurality of substrates; detecting a failure that has occurred in the transporter or a post-processing tank; and replacing the plating solution in the plurality of plating tanks with a preservative liquid to thereby immerse the plurality of substrates in the preservative liquid.

A plating method capable of saving a substrate in an event of a failure of a transporter, a plating tank, or other component when the substrate is being plated is disclosed. The plating method includes: transporting a plurality of substrates to a plurality of plating tanks, respectively, with a transporter; immersing the plurality of substrates in a plating solution held in the plurality of plating tanks to plate the plurality of substrates; detecting a failure that has occurred in the transporter or a post-processing tank; and replacing the plating solution in the plurality of plating tanks with a preservative liquid to thereby immerse the plurality of substrates in the preservative liquid.

Provided is a technique that allows suppressing a film thickness on an outer peripheral edge of a substrate becoming non-uniform. A plating apparatus 1 includes a plating tank, an anode, a substrate holder, at least one auxiliary anode 60a to 60d, a busbar 61 having a power feeding part 62, to which electricity is supplied, and a plurality of connecting parts 63 connected to the at least one auxiliary anode and arrayed in an extending direction of the auxiliary anode, and at least one ionically resistive element 80a to 80d. The ionically resistive element is configured to increase in resistivity of the ionically resistive element as approaching the power feeding part in an extending direction of the ionically resistive element.

Provided is a technique that allows suppressing a film thickness on an outer peripheral edge of a substrate becoming non-uniform. A plating apparatus 1 includes a plating tank, an anode, a substrate holder, at least one auxiliary anode 60a to 60d, a busbar 61 having a power feeding part 62, to which electricity is supplied, and a plurality of connecting parts 63 connected to the at least one auxiliary anode and arrayed in an extending direction of the auxiliary anode, and at least one ionically resistive element 80a to 80d. The ionically resistive element is configured to increase in resistivity of the ionically resistive element as approaching the power feeding part in an extending direction of the ionically resistive element.

An electrolysis water-making apparatus (1) generates electrolyzed products by supplying a raw material solution into an electrolytic cell (4) to perform electrolysis, and generates electrolyzed water by diluting the electrolyzed products. The electrolysis water-making apparatus (1) includes a casing (20) configured to accommodate the electrolytic cell (4), and a bracket (30) fixed to the casing (20) in a freely detachable manner, and the bracket (30) includes a pair of rigid walls to which one end and the other end of the electrolytic cell (4) are attached. The pair of rigid walls have a dimension therebetween that can be adjusted according to the linear dimension of the electrolytic cell (4).

An apparatus for electrochemical etching and an apparatus for electroplating are provided, wherein the apparatus for electrochemical etching includes an etching solution spraying head, a support, and a first and a second electrode. The first electrode is disposed inside the etching solution spraying head, and current is provided to an etching solution inside the etching solution spraying head by the first electrode. The support is disposed opposite to the etching solution spraying head. The second electrode is disposed on the support. When a substrate is placed on the second electrode, a first surface of the substrate is in electrical contact with the second electrode, and the etching solution sprayed from the etching solution spraying head can naturally flow through a second surface of the substrate and then flow off from the edges of the support.

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity.

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity.