The embodiments disclosed herein relate to methods and apparatus for promoting bubble-free circulation of processing fluids in a recirculation system. Certain disclosed techniques involve passive, mechanical valve designs that promote variable resistance to flow in a drain. Other techniques involve automated flow control schemes that utilize feedback from flow meters, level sensors, etc. to achieve a balanced and bubble-free flow. The disclosed embodiments greatly reduce the incorporation of gas into a processing fluid, in particular as the processing fluid returns from a processing cell to a reservoir.

An electroplating cell employable with an electroplating tool and method of operating the same. In one embodiment, the electroplating cell includes a cover configured to substantially seal the electroplating cell to an outside atmosphere during an electroplating process, and a porous tube couplable to an inert gas source configured to bubble an inert gas through an electrolyte containable therein. The electroplating cell also includes an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, and a magnet configured to orient an axis of magnetization of the electroplating material for application to a wafer couplable thereto during an electroplating process.

According to an embodiment, an anode portion and a cathode portion are arranged in a reaction tank so as to opposite to each other with a distance provided. A plating solution which contains at least metal ions for plating, an electrolyte and a surfactant is provided in the reaction tank. A pattern of a metal plating film is formed on a surface of the cathode portion by setting the cathode portion at a negative electric potential with respect to an electric potential of the anode portion. A distance between the anode portion and a surface of a pattern of the metal plating film to be formed on the surface of the cathode portion is set to be smaller than a half value width of a cross-section of a portion of the pattern of the metal plating film having a minimum width.

According to an embodiment, an anode portion and a cathode portion are arranged in a reaction tank so as to opposite to each other with a distance provided. A plating solution which contains at least metal ions for plating, an electrolyte and a surfactant is provided in the reaction tank. A pattern of a metal plating film is formed on a surface of the cathode portion by setting the cathode portion at a negative electric potential with respect to an electric potential of the anode portion. A distance between the anode portion and a surface of a pattern of the metal plating film to be formed on the surface of the cathode portion is set to be smaller than a half value width of a cross-section of a portion of the pattern of the metal plating film having a minimum width.

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.

A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.

A plating apparatus and a plating method thereof are provided. The plating apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a plating solution; a fixing device configured to fix the substrate at the opening of the side wall; at least one sealing element disposed around the opening; and a cleaning module coupled to the tank body for cleaning the at least one sealing element. A cleaning method is also provided for cleaning the at least one sealing element with the cleaning module after operation of the plating apparatus.

A plating apparatus and a plating method thereof are provided. The plating apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a plating solution; a fixing device configured to fix the substrate at the opening of the side wall; at least one sealing element disposed around the opening; and a cleaning module coupled to the tank body for cleaning the at least one sealing element. A cleaning method is also provided for cleaning the at least one sealing element with the cleaning module after operation of the plating apparatus.

A plating apparatus that allows shielding a specific portion of a substrate at a desired timing is achieved. The plating apparatus includes a plating tank 410 for housing a plating solution, an anode 430 arranged in the plating tank 410, a substrate holder 440 for holding a substrate Wf with a surface to be plated facing downward, a rotation mechanism 447 for rotating the substrate holder 440, and a shielding mechanism 460 moving a shielding member 482 between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.

A plating apparatus that allows shielding a specific portion of a substrate at a desired timing is achieved. The plating apparatus includes a plating tank 410 for housing a plating solution, an anode 430 arranged in the plating tank 410, a substrate holder 440 for holding a substrate Wf with a surface to be plated facing downward, a rotation mechanism 447 for rotating the substrate holder 440, and a shielding mechanism 460 moving a shielding member 482 between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.